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Computer Science > Other Computer Science

arXiv:0711.3324 (cs)
[Submitted on 21 Nov 2007]

Title:Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array

Authors:Gy. Bognar, V. Szekely, M. Rencz
View a PDF of the paper titled Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array, by Gy. Bognar and 2 other authors
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Abstract: In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in situ IR measurement among operating cards of a system e.g. in a rack.
Comments: Submitted on behalf of TIMA Editions (this http URL)
Subjects: Other Computer Science (cs.OH)
Cite as: arXiv:0711.3324 [cs.OH]
  (or arXiv:0711.3324v1 [cs.OH] for this version)
  https://doi.org/10.48550/arXiv.0711.3324
arXiv-issued DOI via DataCite
Journal reference: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

Submission history

From: EDA Publishing Association [view email] [via CCSD proxy]
[v1] Wed, 21 Nov 2007 10:09:20 UTC (322 KB)
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György Bognár
Vladimir Székely
Vladimír Székely
Márta Rencz
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