{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T09:58:54Z","timestamp":1729677534691,"version":"3.28.0"},"reference-count":20,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/iccd.2005.46","type":"proceedings-article","created":{"date-parts":[[2006,8,15]],"date-time":"2006-08-15T17:58:12Z","timestamp":1155664692000},"page":"130-133","source":"Crossref","is-referenced-by-count":6,"title":["Efficient thermal simulation for run-time temperature tracking and management"],"prefix":"10.1109","author":[{"family":"Hang Li","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Pu Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Zhenyu Qi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Lingling Jin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Wei Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"S.X.D.","family":"Tan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Jun Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"crossref","first-page":"357","DOI":"10.1109\/ISQED.2004.1283700","article-title":"Spice-compatible thermal simulation with lumped circuit modeling for thermal reliability analysis based on model reduction","author":"wang","year":"2004","journal-title":"Proc Int Symp Quality Electronic Design (ISQED)"},{"key":"17","article-title":"Fast thermal analysis for vlsi circuits via semi-analytical green's function in multi-layer materials","author":"wang","year":"2004","journal-title":"Proc IEEE Int Symp On Circuits and Systems (ISCAS)"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.804385"},{"key":"15","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"Temperature aware microarchitecture","author":"skadron","year":"2003","journal-title":"Proc IEEE International Symposium on Computer Architecture (ISCA)"},{"key":"16","article-title":"Temperature aware microarchitecture: Extended discussion and results","volume":"cs 2003 8","author":"skadron","year":"2003","journal-title":"Technicial Report"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/43.45867"},{"journal-title":"Electronic Circuit and System Simulation Methods","year":"1994","author":"pillage","key":"14"},{"key":"11","first-page":"199","article-title":"Constricting\/spreading resistance model for electronics packaging","author":"lee","year":"1995","journal-title":"Proc ASME\/JSME Thermal Engineering Conference"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/43.712097"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2001.903261"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2005.1466136"},{"journal-title":"International Technology Roadmap for Semiconductors(ITRS)","year":"2001","key":"2"},{"year":"0","key":"1"},{"key":"10","article-title":"Using performance counters for runtime temperature sensing in high performance processors","author":"lee","year":"0","journal-title":"The Workshop on High-Performance Power-aware Computing(HP-PAC)"},{"key":"7","article-title":"Managing the impact of increasing microprocessor power consumption","author":"gunther","year":"2001","journal-title":"Intel Technology Journal"},{"journal-title":"Matrix Computations","year":"1989","author":"golub","key":"6"},{"key":"5","doi-asserted-by":"crossref","first-page":"639","DOI":"10.1109\/43.384428","article-title":"Efficient linear circuit analysis by pade approximation via the lanczos process","volume":"14","author":"feldmann","year":"1995","journal-title":"IEEE Trans on Computer-Aided Design of Integrated Circuits and Systems"},{"journal-title":"Electrothermal Analysis of VLSI Systems","year":"2000","author":"cheng","key":"4"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/43.644034"},{"key":"8","first-page":"878","article-title":"Compact thermal modeling for temperature-aware design","author":"wei huang","year":"2004","journal-title":"Proceedings 41st Design Automation Conference 2004 DAC"}],"event":{"name":"2005 International Conference on Computer Design","acronym":"ICCD-05","location":"San Jose, CA, USA"},"container-title":["2005 International Conference on Computer Design"],"original-title":[],"link":[{"URL":"https:\/\/summer-heart-0930.chufeiyun1688.workers.dev:443\/http\/xplorestaging.ieee.org\/ielx5\/10219\/32585\/01524142.pdf?arnumber=1524142","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,17]],"date-time":"2017-06-17T08:31:56Z","timestamp":1497688316000},"score":1,"resource":{"primary":{"URL":"https:\/\/summer-heart-0930.chufeiyun1688.workers.dev:443\/http\/ieeexplore.ieee.org\/document\/1524142\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":20,"URL":"https:\/\/summer-heart-0930.chufeiyun1688.workers.dev:443\/https\/doi.org\/10.1109\/iccd.2005.46","relation":{},"subject":[]}}