0% found this document useful (0 votes)
155 views8 pages

Sipmos Small-Signal Transistor: GS (TH)

This document provides specifications for the BSP 295 N-channel enhancement mode logic level small-signal transistor. Key details include: - It has a gate threshold voltage of 0.8-2.0V, continuous drain current of 1.8A, and on-resistance of 0.3 ohms. - Electrical characteristic graphs show properties like drain current and on-resistance in relation to temperature, voltage, and current levels. - Maximum ratings include a drain-source breakdown voltage of 50V and operating junction temperature range of -55 to +150°C.
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
0% found this document useful (0 votes)
155 views8 pages

Sipmos Small-Signal Transistor: GS (TH)

This document provides specifications for the BSP 295 N-channel enhancement mode logic level small-signal transistor. Key details include: - It has a gate threshold voltage of 0.8-2.0V, continuous drain current of 1.8A, and on-resistance of 0.3 ohms. - Electrical characteristic graphs show properties like drain current and on-resistance in relation to temperature, voltage, and current levels. - Maximum ratings include a drain-source breakdown voltage of 50V and operating junction temperature range of -55 to +150°C.
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

BSP 295

SIPMOS Small-Signal Transistor

N channel Enhancement mode Logic Level


VGS(th) = 0.8...2.0V

Pin 1 G
Type

Pin 2 D
Marking

Pin 3 S

Pin 4 D

VDS
50 V

ID
1.8 A

RDS(on)
0.3

Package

BSP 295
Type BSP 295

SOT-223

BSP 295

Ordering Code Q67000-S066

Tape and Reel Information E6327

Maximum Ratings Parameter Symbol Values Unit

Drain source voltage Drain-gate voltage


RGS = 20 k

VDS V
DGR

50

50
VGS

Gate source voltage ESD Sensitivity (HBM) as per MIL-STD 883 Continuous drain current
TA = 34 C

20
Class 1 A 1.8

ID

DC drain current, pulsed


TA = 25 C

IDpuls

7.2
Ptot

Power dissipation
TA = 25 C

W 1.8

Data Sheet

05.99

BSP 295

Maximum Ratings Parameter Symbol Values Unit

Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air Thermal resistance, junction-soldering point DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1
1)

Tj Tstg RthJA R thJS

-55 ... + 150 -55 ... + 150

70 10
E 55 / 150 / 56

K/W

1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection

Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Values typ. max. Unit

Drain- source breakdown voltage


VGS = 0 V, ID = 0.25 mA, Tj = 25 C

V (BR)DSS

V 50 -

Gate threshold voltage


VGS=VDS, ID = 1 mA

V GS(th)

0.8
IDSS

1.4

Zero gate voltage drain current


VDS = 50 V, VGS = 0 V, Tj = 25 C VDS = 50 V, VGS = 0 V, Tj = 125 C VDS = 30 V, VGS = 0 V, Tj = 25 C

IGSS

0.1 8 -

1 50 100

nA nA

Gate-source leakage current


VGS = 20 V, VDS = 0 V

RDS(on)

10

100

Drain-Source on-state resistance


VGS = 10 V, ID = 1.8 A VGS = 4.5 V, ID = 1.8 A

0.25 0.45 0.3 0.5

Data Sheet

05.99

BSP 295

Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Values typ. max. Unit

Transconductance
VDS 2 * ID * RDS(on)max, ID = 1.7 A

gfs

S 0.5 1.7 pF 320 425

Input capacitance
VGS = 0 V, V DS = 25 V, f = 1 MHz

Ciss

Output capacitance
VGS = 0 V, V DS = 25 V, f = 1 MHz

Coss

Crss

110

170

Reverse transfer capacitance


VGS = 0 V, V DS = 25 V, f = 1 MHz

td(on)

50

75 ns

Turn-on delay time


VDD = 30 V, VGS = 10 V, ID = 0.29 A RGS = 50

tr

12

Rise time
VDD = 30 V, VGS = 10 V, ID = 0.29 A RGS = 50

td(off)

20

30

Turn-off delay time


VDD = 30 V, VGS = 10 V, ID = 0.29 A RGS = 50

tf

120

160

Fall time
VDD = 30 V, VGS = 10 V, ID = 0.29 A RGS = 50

85

115

Data Sheet

05.99

BSP 295

Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Values typ. max. Unit

Reverse Diode

Inverse diode continuous forward current


TA = 25 C

IS

A 1.8

Inverse diode direct current,pulsed


TA = 25 C

ISM

V SD

7.2 V

Inverse diode forward voltage


VGS = 0 V, IF = 3.6 A, Tj = 25 C

1.1

1.5

Data Sheet

05.99

BSP 295

Power dissipation Ptot = (TA)

Drain current ID = (TA) parameter: VGS 10 V


1.9 A 1.6

2.0 W

Ptot

1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 C 160

ID
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 C 160

TA

TA

Safe operating area ID=f(VDS) parameter : D = 0, TC=25C

Transient thermal impedance Zth JA = (tp ) parameter: D = tp / T


10 2 K/W 10 1

ZthJA
10 0

10 -1 D = 0.50 0.20 10 -2 0.10 0.05 10 -3 single pulse 0.02 0.01

10 -4 -8 -7 -6 -5 -4 -3 -2 -1 0 10 10 10 10 10 10 10 10 s 10

tp

Data Sheet

05.99

BSP 295

Typ. output characteristics ID = (VDS) parameter: tp = 80 s , Tj = 25 C


4.0 A
e k j Ptot = 2W ih l

Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C


0.9
a b c d

gf

VGS [V] a 2.0


b 2.5 3.0 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10.0

ID

3.2 2.8 2.4 2.0 1.6 1.2 0.8 0.4


a

RDS (on) 0.7


0.6 0.5 0.4 0.3
k

c d

d e
f g h

i j k l

e f g i h j

0.2
b

0.1 0.0 V 5.0

VGS [V] =
a 2.5 2.0 b 3.0 c 3.5 d 4.0 e f 4.5 5.0 g 6.0 h i 7.0 8.0 j 9.0 k 10.0

0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2 A 3.8

VDS

ID

Typ. transfer characteristics ID = f(V GS) parameter: tp = 80 s

Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s,

4.5 A
ID

2.2 S
gfs

1.8 1.6

3.5 3.0

1.4 2.5 2.0 1.5 1.0 0.4 0.5 0.0 0 1 2 3 4 5 6 7 8 V


VGS

1.2 1.0 0.8 0.6

0.2 0.0 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 A


ID

4.0

Data Sheet

05.99

BSP 295

Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 1.8 A, VGS = 10 V


0.75

Gate threshold voltage VGS (th) = (Tj ) parameter: VGS = VDS, ID = 1 mA


4.6 V 4.0

0.65

RDS (on)0.60
0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -60 -20 20 60 100 C 160

VGS(th)

3.6 3.2 2.8

98% typ

2.4

98%
2.0 1.6 1.2

typ

2%
0.8 0.4 0.0 -60 -20 20 60 100 C 160

Tj

Tj

Typ. capacitances

C = f (VDS)

parameter:VGS=0V, f = 1 MHz
10 3

Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s


10 1

pF
C

Ciss

IF
10 0

10 2

Coss

Crss

10 1

10 -1

Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%)


10 0 0 10 -2 0.0

10

15

20

25

30

V
VDS

40

0.4

0.8

1.2

1.6

2.0

2.4

3.0

VSD

Data Sheet

05.99

BSP 295

Drain-source breakdown voltage V(BR)DSS = (Tj)

Safe operating area ID=f(V DS) parameter : D = 0.01, TC=25C

60 V 58

V(BR)DSS 57
56 55 54 53 52 51 50 49 48 47 46 45 -60 -20 20 60 100 C 160

Tj

Data Sheet

05.99

You might also like