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PrinciplesofSemiconductorDevices
TitlePageTableofContentsHelp [Link],2011
Chapter7:MOSFieldEffectTransistors
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[Link](IGBTs)
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TheLaterallyDiffusedMOSFET(LDMOS)isanasymmetricpowerMOSFETdesignedforlowonresistance
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largeradiusofcurvatureattheedges,[Link]
devicesnameimpliesthatthefabricationrequireadiffusion,thedopantscanjustaswellbeimplantedand
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[Link],followedbyshallowp+andn+[Link]+regionsprovide
[Link]+regioncontactstheptypebody,whichistypicallyshortedto
thesource,therebyeliminatingthebodyeffect.
Figure7.8.1: CrosssectionofaLaterallyDiffusedMOSFET(LDMOS)structure.
TheLDMOSstructurecombinesashortchannellengthwithhighbreakdownvoltageasdesiredforhigh
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amplifiersinbasestationsofwirelesscommunicationssystemsaswellasnumerousUHFandLbandpower
amplifiersinbroadcast,communicationandradarsystems.
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TheVMOStransistor,namedaftertheVshapedgroove,isaverticalMOSFETwithhighcurrenthandling
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(100)[Link],
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MOSFETs,[Link]
resultsinashortgatelength,[Link]
allowstheuseofalowdopeddrainregion,whichresultsinahighblockingvoltage.
Figure7.8.2: CrosssectionoftwoverticalMOSFETstructures:a)VMOSandb)UMOS.
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layer,againresultingintwoverticalMOSFETs.
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resemblesahoneycombstructureinwhichthehexagonalareasaresourceareas,whilethegatemetalis
locatedontheperimeters.
[Link](IGBTs)
TheInsulatedGateBipolarTransistororIGBTforshortcombinesthehighdccurrentgainofaMOSFETwith
thehighcurrenthandlingcapabilityandhighblockingvoltageofaBJTinasurprisinglysimplestructuresuch
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[Link]+substrateratherthanann+[Link]
analyzethisstructureweusetheequivalentcircuit,whichcontainsthepnpBJTasformedbythebottom
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drainregionofthenMOSFETistheburiedntypelayer,[Link]
electronsoriginatingfromthen+sourceflowlaterallyunderneaththegateandthenflowdownintheburiedn
typeregion,[Link],the
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connectedinaswitchingcircuitjustlikeannpnBJTwiththeimportantdistinctionthatnogatecurrentis
requiredtomaintaintheonstatecurrent.
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Figure7.8.3: InsulatedGateBipolarTransistor(IGBT):a)equivalentcircuitandb)devicecrosssection.
Boulder,December2004
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