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Second Order Effects in MOSFETs

The document discusses several key concepts in MOSFET operation: 1) Threshold voltage is the minimum gate voltage needed for inversion and is affected by factors like work function difference, oxide charge, and depletion region charge. 2) Body effect describes how the threshold voltage changes with source-body voltage due to expansion of the depletion region. 3) Channel length modulation refers to the increase in depletion width at the drain end as drain voltage increases, effectively reducing channel length and increasing drain current.
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0% found this document useful (0 votes)
98 views7 pages

Second Order Effects in MOSFETs

The document discusses several key concepts in MOSFET operation: 1) Threshold voltage is the minimum gate voltage needed for inversion and is affected by factors like work function difference, oxide charge, and depletion region charge. 2) Body effect describes how the threshold voltage changes with source-body voltage due to expansion of the depletion region. 3) Channel length modulation refers to the increase in depletion width at the drain end as drain voltage increases, effectively reducing channel length and increasing drain current.
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd

E3 238 Analog VLSI Circuits

Lecture 4: Threshold Voltage, Second Order Effects

Gaurab Banerjee
Department of Electrical Communication Engineering,
Indian Institute of Science, Bangalore
[email protected]
Threshold Voltage
-> Onset of inversion in an NMOS device (opposite for PMOS): Interface is as
much n-type as the bulk is p-type
-> Gate voltage that achieves this condition = threshold voltage (VTH)
-> More accurate definition:

Φ MS = poly-Si to semiconductor work function


difference --> “BUILT-IN FERMI POTENTIAL” ->
subscript “MS” used for older technologies

Φ F = Difference between the Fermi potential of


the substrate and intrinsic silicon
Threshold Voltage
• Positive bias on gate -> Holes repelled from bulk -> Immobile negative
charge left behind -> depletion region charge modifies VTH -> Qdep/Cox
• Charge trapped in thin oxide leads to voltage drop across the oxide
-> Qox/Cox

Native transistor threshold voltage Adjustment using


implanted charge
under the gate

xd = depletion region width

Nox = 109 ions/cm3 , almost always positive

Modern CMOS processes have native, low-VT, high-VT and thick oxide (very high VT)
devices
-> Carefully choose the device that you need in your application !!!
Body Effect

fixed charge More fixed charge !!

• Depletion region charge is a key component of threshold voltage


• As VSB (source to substrate voltage) is increased, depletion region
“expands”, uncovering more charge.
Body Effect

• If the bulk potential is different from the source potential -> body effect is
present.
• Changes the effective transconductance of the device -> more on this later
• Additional degree of freedom in adjusting threshold voltage -> used in
digital circuits (body/well bias) to reduce leakage
Channel Length Modulation
Increase in depletion layer width at the drain end as drain voltage is increased.

Pinch-off => VDS = VGS – VTH = VDSAT Channel Length < L for VDS > VDSAT
Channel Length Modulation

Infinite output impedance ->


ideal current source

• λ -> relative variation in length for a given increase in VDS


• λ is smaller for longer channel lengths in the same technology
• Linear approximation ∆L/L = λ VDS is less accurate for shorter channel devices ->
variable slope is observed!
• VDS dependence of drain current is NOT an additional degree of freedom in setting
up bias current -> DO NOT use this to “adjust” biases -> not very accurate and reliable!
• Question: what happens if the high impedance (drain) node is stacked on another
high impedance node ? More on this later (CMFB)…

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