TDA2170
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
..
The functions incorporated are :
POWER AMPLIFIER
..
FLYBACK GENERATOR
REFERENCE VOLTAGE
THERMAL PROTECTION
MULTIWATT 11
(Plastic Package)
DESCRIPTION
ORDER CODE : TDA2170
The TDA2170 is a monolithic integrated circuit in
11-lead Multiwatt package. It is a high efficiency
power booster for direct driving of vertical windings
of TV yokes. It is intended for use in Colour are B
& W television receivers as well as in monitors and
displays.
PIN CONNECTIONS
11 NC
10 GND
9 REFERENCE VOLTAGE
8 OUTPUT STAGE SUPPLY
7 OUTPUT
6 GND
5 FLYBACK GENERATOR
4 SUPPLY VOLTAGE
3 NON INVERTING INPUT
2 INVERTING INPUT
1 NC
Tab connected to Pin 6
[Link]
December 1992 1/7
TDA2170
BLOCK DIAGRAM
+VS
4 8 5
Fly back
Generator
2
Power
Amplif ier 7
3
Reference Thermal
Volt age Protect ion YOKE
9 6 10
[Link]
SCHEMATIC DIAGRAM
7
4
D4
Q11
R12 8
C1 Q12
Q10 D5
3 D3 R4 R5
Q7 Q20 D9
D8
2 Q1 Q2 Q6 Q21
D6 D7
Q9 Q13
Q4 Q8 5
D1 R6
R11
Q14 Q18
Q5
Q15 Q17
Q3 Q22
Q16
Q19
R1 D2 R2 R3 R7 R8 R9
C2
R12
Q23 Q26
Q24
R14
Z1
R13 Q27
Z2 Q28
Q25 Q29
R15 R16 R17 R18
6
[Link]
10
9
2/7
TDA2170
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
Vs Supply Voltage (pin 4) 35 V
V7 , V8 Flyback Peak Voltage 60 V
V5 Voltage at Pin 5 + Vs
V2 , V3 Amplifier Input Voltage + Vs – 0.5 V
Io Output Peak Current (non repetitive, t = 2 msec) 2.5 A
Io Output Peak Current at f = 50 Hz, t ≤ 10 µsec 3 A
Io Output Peak Current at f = 50 Hz, t > 10 µsec 2 A
I5 Pin 5 DC Current at V7 < V4 100 mA
I5 Pin 5 Peak to Peak Flyback Current at f = 50 Hz, tfly ≤ 1.5 msec 3 A
[Link]
Ptot Total Power Dissipation at Tcase = 60 °C 30 W
Tstg, Tj Storage and Junction Temperature – 40 to 150 °C
THERMAL DATA
Symbol Parameter Value Unit
[Link]
Rth (j-c) Thermal Resistance Junction-case Max 3 °C/W
R th (j-a) Thermal Resistance Junction–ambient Max 40 °C/W
ELECTRICAL CHARACTERISTICS
(refer to the test circuits, VS = 35 V, Tamb = 25 °C unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
I4 Pin 4 Quiescent Current I5 = 0 ; I7 = 0 ; V3 = 3 V 8 16 mA 1a
I8 Pin 8 Quiescent Current I5 = 0 ; I7 = 0 ; V3 = 3 V 16 36 mA 1a
I3 Amplifier Input Bias Current V3 = 1 V – 0.1 –1 µA 1a
I2 Amplifier Input Bias Current V2 = 1 V – 0.1 –1 µA 1a
V9 Reference Voltage I9 = 0 2.2 V 1a
∆V9 Reference Voltage Drift vs. Supply Voltage VS = 15 to 30 V 1 2 mV/V 1a
∆VS
V5L Pin 5 Saturation Voltage to GND I5 = 20 mA 1 V 1c
V7 Quiescent Output Voltage VS = 35 V ; Ra = 13 kΩ 18 V 1d
VS = 15 V ; Ra = 13 kΩ 7.5 V 1d
V7L Output Saturation Voltage to GND I7 = 1.2 A 1 1.4 V 1c
I7 = 0.7 A 0.7 1 V 1c
V7H Output Saturation Voltage to Supply – I7 = 1.2 A 1.6 2.2 V 1b
– I7 = 0.7 A 1.3 1.8 V 1b
[Link]
R9 Reference Voltage Output Resistance 2.1 kΩ
Tj Junction Temperature for Thermal Shut 140 °C
Down
3/7
TDA2170
Figure 1 : DC Test Circuits
Figure 1a : Measurement of I2 ; I3 ; I4 ; I8 ; I9 ; Figure 1b : Measurement of V7H
∆V9/∆VS ; R9
[Link]
[Link]
S1 : (a) I2 ; (b) I3, I4 and I8.
S2 : (a) I4 and I8 ; (b) I3 ; (c) I2.
S3 : (a) I2, I3, I4, I8, I9 and V9 ; (b) R9.
Figure 1c : Measurement of V5L, V7.L. Figure 1d : Measurement of V7.
[Link]
[Link]
S1 : (a) V5L ; (b) V7L.
Figure 2 : Application Circuit
[Link]
4/7
TDA2170
Figure 3 : PC Board and Component Layout (1:1 scale)
[Link]
COMPONENTS LIST FOR TYPICAL APPLICATIONS
110° TVC 110° TVC 90° TVC
Component 5.9 Ω / 10 mH 9.6 Ω / 24.6 mH 15 Ω / 30 mH Unit
1.95 App 1.2 App 0.82 App
RT1 10 4.7 10 kΩ
R1 12 10 12 kΩ
R2 10 5.6 5.6 kΩ
R3 27 12 18 kΩ
R4 12 8.2 5.6 kΩ
R5 0.82 1 1 Ω
R6 270 330 330 Ω
R7 1.5 1.5 1.5 Ω
D1 1N 4001 1N 4001 1N 4001 –
C1 0.1 0.1 0.1 µF
C2 el. 1000/25 V 470/25 V 470/25 V µF
C3 el. 220/25 V 220/25 V 220/25 V µF
C4 0.22 0.22 0.22 µF
[Link]
C5 el. 2200/25 V 2200/25 V 1000/16 V µF
C6 el. 4.7/16 V 4.7/16 V 10/16 V µF
5/7
TDA2170
TYPICAL PERFORMANCES
110° TVC 110° TVC 90° TVC
Parameter Unit
5.9 Ω / 10 mH 9.6 Ω / 27 mH 15 Ω / 30 mH
Vs – Supply Voltage 24 22.5 25 V
Is – Current 280 175 125 mA
tfly – Flyback Time 0.6 1 0.7 ms
* Ptot – Power Dissipation 4.2 2.5 2.05 W
* Rth c–a – Heatsink 7 13 16 °C/W
Tamb 60 60 60 °C
Tj max 110 110 110 °C
to 20 20 20 ms
[Link]
Vi 2.5 2.5 2.5 VPP
V7 50 47 52 VP
* Worst case condition.
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re- sion spring (clip) being sufficient. Between the
moved by adding an external heatsink. heatsink and the package it is better to insert a layer
of silicon grease, to optimize the thermal contact ;
Thanks to the MULTIWATT package attaching no electrical isolation is needed between the two
the heatsink is very simple, a screw or a compres- surfaces.
Figure 2 : Application Circuit
[Link] / [Link]
Figure 5 : Maximum Allowable Power Dissipation versus Ambient Temperature
[Link]
6/7
TDA2170
PACKAGE MECHANICAL DATA
11 PINS - PLASTIC MULTIWATT
H1
A
S
C L7
S1
Dia. 1
L3
L2
L4
L
L1
D
H2
[Link]
E
F G
M1 M
G1
Millimeters Inches
Dimensions
Min. Typ. Max. Min. Typ. Max.
A 5 0.197
B 2.65 0.104
C 1.6 0.063
E 0.49 0.55 0.019 0.022
F 0.88 0.95 0.035 0.037
G 1.57 1.7 1.83 0.062 0.067 0.072
G1 16.87 17 17.13 0.664 0.669 0.674
H1 19.6 0.772
H2 20.2 0.795
L 21.5 22.3 0.846 0.878
L1 21.4 22.2 0.843 0.874
L2 17.4 18.1 0.685 0.713
L3 17.25 17.5 17.75 0.679 0.689 0.699
L4 10.3 10.7 10.9 0.406 0.421 0.429
L7 2.65 2.9 0.104 0.114
M 4.1 4.3 4.5 0.161 0.169 0.177
M1 4.88 5.08 5.3 0.192 0.200 0.209
S 1.9 2.6 0.075 0.102
[Link]
S1 1.9 2.6 0.075 0.102
Dia. 1 3.65 3.85 0.144 0.152
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
7/7
This datasheet has been download from:
[Link]
Datasheets for electronics components.