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TV Vertical Deflection Output Circuit: Description

This document provides information about the TDA2170 integrated circuit, which is used as a power booster for directly driving vertical windings in TVs. It contains a power amplifier, flyback generator, reference voltage, and thermal protection. The pin connections, block diagram, schematic diagram, and electrical characteristics are described. Key specifications include a maximum supply voltage of 35V, output peak current up to 3A, and thermal resistances of up to 3°C/W and 40°C/W.

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0% found this document useful (0 votes)
190 views8 pages

TV Vertical Deflection Output Circuit: Description

This document provides information about the TDA2170 integrated circuit, which is used as a power booster for directly driving vertical windings in TVs. It contains a power amplifier, flyback generator, reference voltage, and thermal protection. The pin connections, block diagram, schematic diagram, and electrical characteristics are described. Key specifications include a maximum supply voltage of 35V, output peak current up to 3A, and thermal resistances of up to 3°C/W and 40°C/W.

Uploaded by

Sv Ko
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

TDA2170

TV VERTICAL DEFLECTION OUTPUT CIRCUIT

..
The functions incorporated are :
POWER AMPLIFIER

..
FLYBACK GENERATOR
REFERENCE VOLTAGE
THERMAL PROTECTION

MULTIWATT 11
(Plastic Package)
DESCRIPTION
ORDER CODE : TDA2170
The TDA2170 is a monolithic integrated circuit in
11-lead Multiwatt package. It is a high efficiency
power booster for direct driving of vertical windings
of TV yokes. It is intended for use in Colour are B
& W television receivers as well as in monitors and
displays.

PIN CONNECTIONS

11 NC
10 GND
9 REFERENCE VOLTAGE
8 OUTPUT STAGE SUPPLY
7 OUTPUT
6 GND
5 FLYBACK GENERATOR
4 SUPPLY VOLTAGE
3 NON INVERTING INPUT
2 INVERTING INPUT
1 NC

Tab connected to Pin 6


[Link]

December 1992 1/7


TDA2170

BLOCK DIAGRAM
+VS

4 8 5

Fly back
Generator

2
Power
Amplif ier 7
3

Reference Thermal
Volt age Protect ion YOKE

9 6 10

[Link]
SCHEMATIC DIAGRAM
7
4

D4
Q11

R12 8
C1 Q12
Q10 D5
3 D3 R4 R5
Q7 Q20 D9
D8

2 Q1 Q2 Q6 Q21
D6 D7
Q9 Q13
Q4 Q8 5

D1 R6
R11
Q14 Q18
Q5
Q15 Q17
Q3 Q22
Q16
Q19

R1 D2 R2 R3 R7 R8 R9

C2

R12

Q23 Q26

Q24
R14

Z1
R13 Q27
Z2 Q28

Q25 Q29

R15 R16 R17 R18


6
[Link]

10
9

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TDA2170

ABSOLUTE MAXIMUM RATINGS


Symbol Parameter Value Unit
Vs Supply Voltage (pin 4) 35 V
V7 , V8 Flyback Peak Voltage 60 V
V5 Voltage at Pin 5 + Vs
V2 , V3 Amplifier Input Voltage + Vs – 0.5 V
Io Output Peak Current (non repetitive, t = 2 msec) 2.5 A
Io Output Peak Current at f = 50 Hz, t ≤ 10 µsec 3 A
Io Output Peak Current at f = 50 Hz, t > 10 µsec 2 A
I5 Pin 5 DC Current at V7 < V4 100 mA
I5 Pin 5 Peak to Peak Flyback Current at f = 50 Hz, tfly ≤ 1.5 msec 3 A

[Link]
Ptot Total Power Dissipation at Tcase = 60 °C 30 W
Tstg, Tj Storage and Junction Temperature – 40 to 150 °C

THERMAL DATA
Symbol Parameter Value Unit

[Link]
Rth (j-c) Thermal Resistance Junction-case Max 3 °C/W
R th (j-a) Thermal Resistance Junction–ambient Max 40 °C/W

ELECTRICAL CHARACTERISTICS
(refer to the test circuits, VS = 35 V, Tamb = 25 °C unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
I4 Pin 4 Quiescent Current I5 = 0 ; I7 = 0 ; V3 = 3 V 8 16 mA 1a
I8 Pin 8 Quiescent Current I5 = 0 ; I7 = 0 ; V3 = 3 V 16 36 mA 1a
I3 Amplifier Input Bias Current V3 = 1 V – 0.1 –1 µA 1a
I2 Amplifier Input Bias Current V2 = 1 V – 0.1 –1 µA 1a
V9 Reference Voltage I9 = 0 2.2 V 1a
∆V9 Reference Voltage Drift vs. Supply Voltage VS = 15 to 30 V 1 2 mV/V 1a
∆VS
V5L Pin 5 Saturation Voltage to GND I5 = 20 mA 1 V 1c
V7 Quiescent Output Voltage VS = 35 V ; Ra = 13 kΩ 18 V 1d
VS = 15 V ; Ra = 13 kΩ 7.5 V 1d
V7L Output Saturation Voltage to GND I7 = 1.2 A 1 1.4 V 1c
I7 = 0.7 A 0.7 1 V 1c
V7H Output Saturation Voltage to Supply – I7 = 1.2 A 1.6 2.2 V 1b
– I7 = 0.7 A 1.3 1.8 V 1b
[Link]

R9 Reference Voltage Output Resistance 2.1 kΩ


Tj Junction Temperature for Thermal Shut 140 °C
Down

3/7
TDA2170

Figure 1 : DC Test Circuits


Figure 1a : Measurement of I2 ; I3 ; I4 ; I8 ; I9 ; Figure 1b : Measurement of V7H
∆V9/∆VS ; R9

[Link]
[Link]
S1 : (a) I2 ; (b) I3, I4 and I8.
S2 : (a) I4 and I8 ; (b) I3 ; (c) I2.
S3 : (a) I2, I3, I4, I8, I9 and V9 ; (b) R9.

Figure 1c : Measurement of V5L, V7.L. Figure 1d : Measurement of V7.


[Link]

[Link]
S1 : (a) V5L ; (b) V7L.

Figure 2 : Application Circuit


[Link]

4/7
TDA2170

Figure 3 : PC Board and Component Layout (1:1 scale)

[Link]
COMPONENTS LIST FOR TYPICAL APPLICATIONS
110° TVC 110° TVC 90° TVC
Component 5.9 Ω / 10 mH 9.6 Ω / 24.6 mH 15 Ω / 30 mH Unit
1.95 App 1.2 App 0.82 App
RT1 10 4.7 10 kΩ
R1 12 10 12 kΩ
R2 10 5.6 5.6 kΩ
R3 27 12 18 kΩ
R4 12 8.2 5.6 kΩ
R5 0.82 1 1 Ω
R6 270 330 330 Ω
R7 1.5 1.5 1.5 Ω
D1 1N 4001 1N 4001 1N 4001 –
C1 0.1 0.1 0.1 µF
C2 el. 1000/25 V 470/25 V 470/25 V µF
C3 el. 220/25 V 220/25 V 220/25 V µF
C4 0.22 0.22 0.22 µF
[Link]

C5 el. 2200/25 V 2200/25 V 1000/16 V µF


C6 el. 4.7/16 V 4.7/16 V 10/16 V µF

5/7
TDA2170

TYPICAL PERFORMANCES
110° TVC 110° TVC 90° TVC
Parameter Unit
5.9 Ω / 10 mH 9.6 Ω / 27 mH 15 Ω / 30 mH
Vs – Supply Voltage 24 22.5 25 V
Is – Current 280 175 125 mA
tfly – Flyback Time 0.6 1 0.7 ms
* Ptot – Power Dissipation 4.2 2.5 2.05 W
* Rth c–a – Heatsink 7 13 16 °C/W
Tamb 60 60 60 °C
Tj max 110 110 110 °C
to 20 20 20 ms

[Link]
Vi 2.5 2.5 2.5 VPP
V7 50 47 52 VP
* Worst case condition.

MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re- sion spring (clip) being sufficient. Between the
moved by adding an external heatsink. heatsink and the package it is better to insert a layer
of silicon grease, to optimize the thermal contact ;
Thanks to the MULTIWATT package attaching no electrical isolation is needed between the two
the heatsink is very simple, a screw or a compres- surfaces.
Figure 2 : Application Circuit

[Link] / [Link]

Figure 5 : Maximum Allowable Power Dissipation versus Ambient Temperature


[Link]

6/7
TDA2170

PACKAGE MECHANICAL DATA


11 PINS - PLASTIC MULTIWATT
H1
A
S
C L7

S1

Dia. 1

L3

L2
L4
L

L1
D

H2

[Link]
E
F G
M1 M
G1

Millimeters Inches
Dimensions
Min. Typ. Max. Min. Typ. Max.
A 5 0.197
B 2.65 0.104
C 1.6 0.063
E 0.49 0.55 0.019 0.022
F 0.88 0.95 0.035 0.037
G 1.57 1.7 1.83 0.062 0.067 0.072
G1 16.87 17 17.13 0.664 0.669 0.674
H1 19.6 0.772
H2 20.2 0.795
L 21.5 22.3 0.846 0.878
L1 21.4 22.2 0.843 0.874
L2 17.4 18.1 0.685 0.713
L3 17.25 17.5 17.75 0.679 0.689 0.699
L4 10.3 10.7 10.9 0.406 0.421 0.429
L7 2.65 2.9 0.104 0.114
M 4.1 4.3 4.5 0.161 0.169 0.177
M1 4.88 5.08 5.3 0.192 0.200 0.209
S 1.9 2.6 0.075 0.102
[Link]

S1 1.9 2.6 0.075 0.102


Dia. 1 3.65 3.85 0.144 0.152

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.

 1994 SGS-THOMSON Microelectronics - All Rights Reserved

Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.

SGS-THOMSON Microelectronics GROUP OF COMPANIES


Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

7/7
This datasheet has been download from:

[Link]

Datasheets for electronics components.

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