This document was developed by the SFF Committee prior to it

becoming the SFF TA (Technology Affiliate) TWG (Technical

Working Group) of the SNIA (Storage Networking Industry
Association) in 2016.

The information below should be used instead of the equivalent herein.

POINTS OF CONTACT: SFF TA TWG Chair Email: sff-chair@[Link].

LOCATION OF SFF DOCUMENTS: [Link]
Suggestions for improvement of this specification are welcome and should be
submitted to [Link]
If you are interested in participating in the activities of the SFF TA TWG, additional
information and the membership application can be found at:
[Link]
PUBLISHED SFF-8482 Rev 2.5

SFF Committee documentation may be purchased in electronic form.

SFF specifications are available at [Link]

SFF Committee

SFF-8482

Specification for

Serial Attachment 2X Unshielded Connector

Rev 2.5 August 31, 2018

Secretariat: SFF Committee

Abstract: This specification defines an Unshielded dual lane Input/Output connector

for serial interface unshielded devices, backplanes and cables.

There are multiple using generations based on performance.

3 Gb/s SFF-8678
12 Gb/s SFF-8680
24 Gb/s SFF-8681

This specification provides a common reference for systems manufacturers, system

integrators, and suppliers. This is an internal working specification of the SFF
Committee, an industry ad hoc group.

This specification is made available for public review, and written comments are
solicited from readers. Comments received by the members will be considered for
inclusion in future revisions of this specification.

The description of a connector in this specification does not assure that the
specific component is actually available from connector suppliers. If such a
connector is supplied it must comply with this specification to achieve
interoperability between suppliers.

Support: This specification is supported by the identified member companies of the

SFF Committee.

POINTS OF CONTACT:

Jay Neer I. Dal Allan

Industry Standards Manager Chairman SFF Committee
Molex 14426 Black Walnut Court
2222 Wellington Court Saratoga, CA 95070
Lisle, Il 60532

561-447-2907 408-867-6630
[Link]@[Link] endlcom@[Link]

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EXPRESSION OF SUPPORT BY MANUFACTURERS

The following member companies of the SFF Committee voted in favor of this industry
specification.

Adaptec IBM
Amphenol Intel
Comax LSI
Dell MGE
Dell Computer Molex
EMC NetApp
ENDL Sandisk
FCI Seagate
Foxconn Sun Microsystems
Fujitsu CPA TE Connectivity
Hewlett Packard Unisys
HGST Volex
Hitachi Cable Western Digital
Hitachi GST

The following SFF member companies voted no on the technical content of this
industry specification.

All Best Technique

The following member companies of the SFF Committee voted to abstain on this
industry specification.

Amphenol Maxtor
Avago Micrel
Brocade Nexans
Emulex Oclaro
FCI Panduit
Fiberxon Picolight
Finisar Pioneer
Foxconn Sumitomo
Fujitsu Components Toshiba
Infineon Toshiba America
LSI TriQuint
Luxshare-ICT Vitesse Semiconductor
Madison Cable Xyratex

The user's attention is called to the possibility that implementation to this

Specification may require use of an invention covered by patent rights. By
distribution of this specification, no position is taken with respect to the
validity of a claim or claims or of any patent rights in connection therewith.
Members of the SFF Committee which advise that a patent exists are required to
provide a statement of willingness to grant a license under these rights on
reasonable and non-discriminatory terms and conditions to applicants desiring to
obtain such a license.

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Change History

Revision 2.3
- Edited out symbols because of reports that a few were not being displayed on
screen correctly by some PDF readers.
- Clarified first and second stage content in 5.1 per request.

Revision 2.4
- p2 reflects support of SFF-8482 and SFF-8680
- Body replaced by SFF-8680 mechanical content which had enhanced host board solder
pads and attachment specifications.
Previous history of SFF-8680:
- Footprints of SFF-8482 and SFF-8680 defined as Appendixes
- SFF-8680 1.5
o Adopted common representation for SFF-8630/SFF-8639/SFF-8680
Table 6-x Performance Requirements
Appendix A introductory paragraphs
- SFF-8680 1.6
o Corrected Abstract EIA-966 reference to be formerly SFF-8482
- SFF-8680 1.7
o Editorial update to auto-generate Appendix in headings and TOC.
- SFF-8680 1.8
o Added EIA reference for Temperature Rise in Electrical Requirements Table
- SFF-8680 1.9
o Added additional footprints to Appendix A
1. Through-hole (Figure A-3)
2. Hybrid (Figure A-4)

Rev 2.5 (August 31, 2018)

- Document to be withdrawn from EIA; other than the changes to the header and cover
page, no content or formatting changes have been made since Rev 2.4 of this
document.

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Foreword

The development work on this specification was done by the SFF Committee, an
industry group. The membership of the committee since its formation in August 1990
has included a mix of companies which are leaders across the industry.

When 2 1/2" diameter disk drives were introduced, there was no commonality on
external dimensions e.g. physical size, mounting locations, connector type, and
connector location, between vendors.

The first use of these disk drives was in specific applications such as laptop
portable computers and system integrators worked individually with vendors to
develop the packaging. The result was wide diversity, and incompatibility.

The problems faced by integrators, device suppliers, and component suppliers led to
the formation of the SFF Committee as an industry ad hoc group to address the
marketing and engineering considerations of the emerging new technology.

During the development of the form factor definitions, other activities were
suggested because participants in the SFF Committee faced more problems than the
physical form factors of disk drives. In November 1992, the charter was expanded to
address any issues of general interest and concern to the storage industry. The SFF
Committee became a forum for resolving industry issues that are either not addressed
by the standards process or need an immediate solution.

Those companies which have agreed to support a specification are identified in the
first pages of each SFF Specification. Industry consensus is not an essential
requirement to publish an SFF Specification because it is recognized that in an
emerging product area, there is room for more than one approach. By making the
documentation on competing proposals available, an integrator can examine the
alternatives available and select the product that is felt to be most suitable.

SFF Committee meetings are held during T10 weeks (see [Link]), and Specific
Subject Working Groups are held at the convenience of the participants. Material
presented at SFF Committee meetings becomes public domain, and there are no
restrictions on the open mailing of material presented at committee meetings.

Most of the specifications developed by the SFF Committee have either been
incorporated into standards or adopted as standards by EIA (Electronic Industries
Association), ANSI (American National Standards Institute) and IEC (International
Electrotechnical Commission).

If you are interested in participating or wish to follow the activities of the SFF
Committee, the signup for membership and/or documentation can be found at:
[Link]/ie/[Link]

The complete list of SFF Specifications which have been completed or are currently
being worked on by the SFF Committee can be found at:
[Link]

If you wish to know more about the SFF Committee, the principles which guide the
activities can be found at:
[Link]

Suggestions for improvement of this specification will be welcome. They should be

sent to the SFF Committee, 14426 Black Walnut Ct, Saratoga, CA 95070.

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CONTENTS

1. Scope 6
1.1 Application Specific Criteria 6

2. References 6
2.1 Industry Documents 6
2.2 SFF Specifications 6
2.3 Sources 6
2.4 Conventions 6
2.5 Definitions 6

3. General Description 8

4. Dimensioning Requirements 9
4.1 Connector Interface 9
4.2 General Tolerances 9

5. Backplane Fixed (Receptacle) Interface Features 15

5.1 Blind Mating 15
5.2 Device to Backplane Location 16
5.3 Hot Plugging 17

6. Ratings 19
6.1 Current 19
6.2 Temperature 19

7. General Connector Performance Requirements 19

A. Appendix (Informative): Receptacle PCB Footprints (High Performance) 21

B. Appendix (Informative): Receptacle PCB Footprints 23

FIGURES
Figure 2-1 Mating Side Gender 7
Figure 3-1 General Views 8
Figure 4-1 Device Free (Plug) Connector 10
Figure 4-2 Device Free (Plug) Connector Detail and Section View 11
Figure 4-3 Backplane Fixed (Receptacle) Connector 12
Figure 4-4 Backplane Fixed (Receptacle) Connector Section View 13
Figure 4-5 Cable Fixed (Receptacle) Connector 14
Figure 5-1 Blind Mate Tolerance Zones 16
Figure 5-2 Device to Backplane Location 16

Figure_ A-1 Printed Circuit Board Detail Surface Mount 21

Figure_ A-2 Printed Circuit Board Detail Alternate Surface Mount 21
Figure_ A-3 Printed Circuit Board Detail Through Hole 22
Figure_ A-4 Printed Circuit Board Detail Hybrid 22
Figure_ B-1 Through Hole Printed Circuit Board Detail (Press Fit & Solder Pin) 23
Figure_ B-2 Surface Mount Printed Circuit Board Detail 23
Figure_ B-3 Hybrid Printed Circuit Board Detail 24

TABLES
Table 5-1 Hot Plug Contact Sequencing 18
Table 7-1 Electrical Requirements 19
Table 7-2 Mechanical Requirements 20
Table 7-3 Environmental Requirements 20

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SFF Committee --

Serial Attachment 2X Unshielded Connector

1. Scope
This specification defines the mechanical and connector contact performance
requirements for a composite connector system. This composite system is designed to
support high speed serial signals and power on different contacts within the same
housing.
1.1 Application Specific Criteria
Intended applications for this connector system include Serial Attached SCSI (SAS)
as specified by the T10 standards and for other applications requiring such a
connector system.

2. References

2.1 Industry Documents

The following interface standards are relevant to this SFF Specification.

- ASME Y14.5M Dimensioning and Tolerancing

- EIA-364-D Electrical Connector/Socket Test Procedures Including Environmental
Classifications (see Section 7 for relevant test procedures)
- INCITS 478 Serial Attached SCSI 2.1 (SAS-2.1)
- INCITS 519 Serial Attached SCSI - 3 (SAS-3)
- INCITS 534 Serial Attached SCSI - 4 (SAS-4)
- SFF-8223 2.5 inch Form Factor Drive w/Serial Attached Connector (EIA-720)
- SFF-8323 3.5 inch Form Factor Drive w/Serial Attached Connector (EIA-740)
- SFF-8678 Serial Attachment 2X 3 Gb/s Unshielded Connector
- SFF-8680 Serial Attachment 2X 12 Gb/s Unshielded Connector
- SFF-8681 Serial Attachment 2X 24 Gb/s Unshielded Connector
2.2 SFF Specifications
There are several projects active within the SFF Committee. The complete list of
specifications which have been completed or are still being worked on are listed in
the specification at [Link]
2.3 Sources
Those who join the SFF Committee as an Observer or Member receive electronic copies
of the minutes and SFF specifications ([Link]

Copies of ANSI standards may be purchased from the InterNational Committee for
Information Technology Standards ([Link]
2.4 Conventions
The ISO convention of numbering is used i.e., the thousands and higher multiples are
separated by a space and a period is used as the decimal point. This is equivalent
to the English/American convention of a comma and a period.

American French ISO

0.6 0,6 0.6
1,000 1 000 1 000
1,323,462.9 1 323 462,9 1 323 462.9

2.5 Definitions
For the purpose of SFF Specifications, the following definitions apply:

Fixed: Used to describe the gender of the mating side of the connector that accepts

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its mate upon mating. This gender is frequently, but not always, associated with
the common terminology "receptacle". Other terms commonly used are "female" and
"socket connector". The term "fixed" is adopted from EIA standard terminology as
the gender that most commonly exists on the fixed end of a connection, for example,
on the board or bulkhead side.

In this specification "fixed" is specifically used to describe the mating side

gender illustrated in Figure 3-1 as Backplane "Fixed" (receptacle)and Cable "Fixed"
(receptacle).

Fixed Board: A connector that uses a fixed gender mating side and a termination
side suitable for any of the printed circuit board termination technologies

Free: Used to describe the gender of the mating side of the connector that
penetrates its mate upon mating. This gender is frequently, but not always,
associated with the common terminology "plug". Other terms commonly used are "male"
and "pin connector". The term "free" is adopted from EIA standard terminology as
the gender that most commonly exists on the free end of a connection, for example,
on the cable side.

In this specification "free" is specifically used to describe the mating side gender
illustrated in Figure 3-1 as Device "Free" (plug).

Free Board: A connector that uses a free gender mating side and a termination side
suitable for any of the printed circuit board termination technologies

Mating side: The side of the connector that joins and separates from the mating side
of a connector of opposite gender. Other terms commonly used in the industry are
mating interface, separable interface and mating face.

FIGURE 2-1 MATING SIDE GENDER

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3. General Description
This connector system is designed to allow devices to connect to cable assemblies or
to PCB's with the same device connector interface.

The device free (plug) interface incorporates three different contact sets (CS).
Two of these sets (CS1 and CS2) contain 7 contacts each and typically are used for
high speed serial signals. The high speed signals are grouped into differential
pairs flanked with Grounds (G-S-S-G-S-S-G). The third set (CS3) contains 15 contacts
and typically would be used for low frequency purposes such as power and control.

The backplane fixed (receptacle) interface supports device free (plug) interfaces
which have CS1 and CS3 only or has all CS1, CS2 and CS3 contacts. Blind mating is
supported by the guides built into the mating interface and a provision for hot
plugging is supported by the contact sequencing that is possible by using the offset
contact positions.

There is no provision for positive mating interface retention latching in the

backplane fixed version.

FIGURE 3-1 GENERAL VIEWS

The cable fixed (receptacle) supports device free (plug) interfaces which have CS1
and CS3 only or has all CS1, CS2 and CS3 contacts. The cable fixed (receptacle)
interface incorporates a passive latching retention system to prevent accidental
disconnection of the interface.

For cabled backplane implementation, the cable connector shall provide all feature
requirements of the backplane fixed (receptacle)in addition to the passive cable
retention defined.

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4. Dimensioning Requirements

4.1 Connector Interface

All dimensional requirements for the connector within this specification must be met
in order to provide intermateability between plug and receptacle and to fit within
the physical boundaries required by the media and backplane.
4.2 General Tolerances
Unless otherwise shown, the following tolerances apply to the figures:

2 Place dimension = +/-0.20mm

Angular dimension = +/-3 degrees

The range of characteristics supported is indicative of the environment of use.

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FIGURE 4-1 DEVICE FREE (PLUG) CONNECTOR

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FIGURE 4-2 DEVICE FREE (PLUG) CONNECTOR DETAIL AND SECTION VIEW

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FIGURE 4-3 BACKPLANE FIXED (RECEPTACLE) CONNECTOR

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FIGURE 4-4 BACKPLANE FIXED (RECEPTACLE) CONNECTOR SECTION VIEW

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FIGURE 4-5 CABLE FIXED (RECEPTACLE) CONNECTOR

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5. Backplane Fixed (Receptacle) Interface Features

5.1 Blind Mating

The process of mating an unshielded serial attachment connector pair should be
accomplished in a "free fit" manner where no excessive mechanical stresses are
placed on the connectors during or after the mating process. The mating process
should be considered in the context of the packaging surrounding the device with the
connectors. Stresses considered include those transmitted to the mated connector
through the device: for example, the weight of the drive, that resulting from
resilient device guide members in the enclosure, the device retention mechanism,
acceleration stresses (mechanical shock testing) and interference with enclosure
parts. Mechanical interference between the device with the mated connectors and
fixed or solid parts of the packaging will generally not be tolerated by the
unshielded serial connector attachment system.

The mating interface specifications require a two stage process to arrive at the
Final mated contact:

- The first stage must be delivered by the device enclosure system to achieve
center to center alignment of less than 1.5 mm in the longitudinal axis and less
than 1.0 mm in the horizontal axis prior to any part of the connector pair engaging.
This is the blind mate tolerance zone depicted in Figure 5-1.

- The second stage (incorporated within connector blind mate pre-alignment

features) positions the connectors from +/-1.5 mm / +/-1.0 mm at initial engagement
through to a point where the main connector chamfers engage (normal connector
engagement)

System/Application designers should recognize that certain lateral movement between

free gender contacts and fixed gender contacts may occur between the time the pre-
alignment features engage and the contacts reach the final mated position.
The positional requirements in Figure 5-2 define the fully mated condition.

CAUTION: When mating unshielded serial attachment connectors without the aid of
guide rails (or other pre-mating guiding systems not part of the connector) there is
a risk of shorting signals to power. This event may damage the devices on either
side of the connector.

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FIGURE 5-1 BLIND MATE TOLERANCE ZONES

5.2 Device to Backplane Location

In order to guarantee minimum contact engagement is provided in a backplane system,
the position of the device connector interface must be controlled relative to the
Backplane surface as shown in Figure 5-2.
Device clearances vary by Form Factor, see the appropriate Form Factor
Specifications for connector location with respect to each Form Factor.

FIGURE 5-2 DEVICE TO BACKPLANE LOCATION

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5.3 Hot Plugging

In order to facilitate hot plugging of a device into a powered backplane, the
Backplane fixed (Receptacle) & Device free (plug) interface is designed to provide a
3 level contact engagement sequence. By specifying an offset between key contacts on
each side of the mating interface, the mating sequence of these contacts is timed to
occur in the proper order. There are 2 pins located in CS3 of the Backplane fixed
(receptacle) interface that are advanced 0.50mm nominal from all other contact pins
on this side of the interface. These pin locations represent the 1st level of mating
upon insertion of the Device. The 2nd level of mating is established when the
forward group of contacts located in the CSs of the Device free (plug) interface
penetrate 0.50mm nominal into the Backplane fixed (receptacle) interface. The
remaining contacts of the Device free (plug) interface are set back 0.50mm nominal
and will be the last contacts to mate. In order to maintain this sequence,
sufficient tolerance has been designed into the interface to allow for manufacturing
and alignment of the device to the enclosure – see section 5.1.
The pin locations for the long & short contacts on both sides of the interface are
defined in Table 5-1.

Hot plugging of cables is not supported by this interface.

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TABLE 5-1 HOT PLUG CONTACT SEQUENCING

Device Free (Plug) Interface Backplane Fixed (Receptacle) Interface

S1 S1
S2 S2
S3 S3
S4 S4
S5 S5
S6 S6
S7 S7
S8 S8
S9 S9
S10 S10
S11 S11
S12 S12
S13 S13
S14 S14
P1 P1
P2 P2
P3 P3
P4 P4
P5 P5
P6 P6
P7 P7
P8 P8
P9 P9
P10 P10
P11 P11
P12 P12
P13 P13
P14 P14
P15 P15
<-0.50mm-> <-0.50mm->

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6. Ratings

6.1 Current
Power section (per pin):
- Continuous Current 1.5 A
- Peak Current 2.5A 1.5 s
- Peak Current Pre-charge 6A 1 ms

Signal section (per pin)

- Continuous Current 500 mA
6.2 Temperature
Operating 0° C to 55° C
Non-operating -40° C to 85° C

7. General Connector Performance Requirements

The General Electrical, Mechanical and Environmental requirements for mating
connectors are listed in the tables.

See section 1.2 for the Electrical Performance requirements for this connector
solution.

TABLE 7-1 ELECTRICAL REQUIREMENTS

Description Requirement Procedure
Low Level 30 milliohms EIA-364-23:
Contact maximum for signal Mate connectors and apply a maximum voltage of
Resistance contacts (initial) 20 mV and a current of 100 mA
Insulation 1000 Megaohms EIA 364-21:
Resistance minimum Apply a voltage of 500 VDC for 1 minute
between adjacent terminals
Dielectric No breakdown or EIA 364-20, method B:
Withstanding flashover Apply a voltage of 500 VAC for 1 minute
Voltage between adjacent terminals
Temperature Temperature rise EIA-364-70B:
Rise (via shall not exceed Wire contact pins P1, P2, P8 and P9 in
current 30C degrees parallel for power
cycling) Power Wire contact pins P4, P5, P6, P10 and P12 in
section only parallel for return
(P1 thru P15) Supply 6 Amp total DC current to the power
pins in parallel, returning from the parallel
ground pins
Measure and record the temperature after 96
hours (45 minutes ON and 15 minutes OFF per
hour) in ambient condition of 25C still air

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TABLE 7-2 MECHANICAL REQUIREMENTS

Description Requirement Procedure
Mechanical Discontinuity <1 EIA-364-27
Shock microsecond 15 Subject mated connectors to 50G’s half-sine
milliohm maximum shock pulses of 11 milliseconds duration in
change from initial each X,Y and Z axis (18 shocks total)
Contact Resistance
Random Discontinuity <1 EIA-364-28, Test Condition VII
Vibration microsecond Subject mated connectors to 3.10G’s RMS
15 milliohm maximum between 20-500 Hz for 15 minutes in each of 3
change from initial mutually perpendicular planes
Contact Resistance
Durability No damage EIA 364-09:
15 milliohm maximum Mate and unmate connectors at a maximum rate
change from initial of 200 cycles per hour
Contact Resistance Backplane - 500 Cycles
Cable - 25 Cycles
Connector Mate Backplane EIA 364-13:
and Unmate Mate - 25N max Mate and unmate connectors at a rate of 25mm
Forces Unmate - 5N min per minute
Cable
Mate - 50N max
Unmate - 20N min
Initial and after
durability

TABLE 7-3 ENVIRONMENTAL REQUIREMENTS

Description Requirement Procedure
Thermal Shock No damage EIA 364-32, Test Condition I:
15 milliohm maximum Subject mated connectors to 10 cycles between
change from initial minus 55C and plus 85C degrees
Contact Resistance
Temperature No damage EIA 364-17, Test Condition III, Method A, Test
Life 15 milliohm maximum Time Condition C:
change from initial Subject mated connectors to 85C for 500 hours
Contact Resistance
Mixed Flowing No damage EIA 364-65, Class IIA: (4 Gas)
Gas 15 milliohm maximum Expose half of samples unmated for 7 days and
change from initial then mated for 7 days. The other half are
Contact Resistance exposed mated for full 14 day test period.
Humidity No damage EIA 364-31, Method II, Test Condition A:
15 milliohm maximum Subject mated connectors to 96 hours at 40C
change from initial degrees with 90-95% relative humidity per
Contact Resistance

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A. Appendix (Informative): Receptacle PCB Footprints (High Performance)

The PCB footprint has an impact on the Signal Integrity (SI) performance of the
connector system and the actual geometry may vary between different vendor
implementations. Being an example, the footprint may not meet the necessary SI
performance for all vendor implementations, and it is not a requirement of this
specification.

Note: This specification does not address the electrical performance characteristics
of the host Printed Circuit Board (PCB) material and construction used in these
applications. The PCB thickness, number of layers, layer stack up, trace layer
location(s), copper plane anti-pads, etc., as all are major contributors to the
final electrical characteristics of each unique application of the connector.

FIGURE_ A-1 PRINTED CIRCUIT BOARD DETAIL SURFACE MOUNT

FIGURE_ A-2 PRINTED CIRCUIT BOARD DETAIL ALTERNATE SURFACE MOUNT

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FIGURE_ A-3 PRINTED CIRCUIT BOARD DETAIL THROUGH HOLE

(Press Fit & Solder Pin)

FIGURE_ A-4 PRINTED CIRCUIT BOARD DETAIL HYBRID

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B. Appendix (Informative): Receptacle PCB Footprints

These footprint examples suit the performance defined by SFF-8678.

FIGURE_ B-1 THROUGH HOLE PRINTED CIRCUIT BOARD DETAIL (PRESS FIT & SOLDER PIN)

FIGURE_ B-2 SURFACE MOUNT PRINTED CIRCUIT BOARD DETAIL

Pad widths listed as reference dimensions are left open to the manufacturer to
determine based on their internal design standards. In order to determine the pad
widths for Surface Mount leads the following dimensions and tolerances apply:
Solder Leads on 1.27mm spacing = 0.40 +/- 0.08mm
Solder Leads on 0.80mm spacing = 0.30 +/- 0.05mm

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FIGURE_ B-3 HYBRID PRINTED CIRCUIT BOARD DETAIL

Hole sizes listed as reference dimensions are left open to the manufacturer to
determine based on their internal design standards. In order to determine the hole
diameter for Solder Pins the following pin width dimensions and tolerances apply:
Solder Pins on 1.27mm spacing = 0.40 +/- 0.08mm
Solder Pins on 0.80mm spacing = 0.40 +/- 0.08mm

Pad widths listed as reference dimensions are left open to the manufacturer to
determine based on their internal design standards. In order to determine the pad
widths for Surface Mount leads the following dimensions and tolerances apply:
Solder Leads on 1.27mm spacing = 0.40 +/- 0.08mm
Solder Leads on 0.80mm spacing = 0.30 +/- 0.05mm

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