Electronic Product Design

Bharati Vidyapeeth (Deemed to be University)

College of Engineering, Pune
Department of Electronics and Tele- Communication

[Link] (Electronics & Telecommunication) Semester VII Winter 2023

Subject- Electronic Product Design

Student Name -
Student PRN -
Student Roll No. – Index
____________________________________________________________________________

Sr. Name of Experiment Page Date Marks Faculty Avg.

No. No. (25) Signature Mark
s
1. Study of IP (Ingress Protection)
Standards
2. Study EMC/EMI Standards
3. Study of Cooling Techniques

4. Enclosure and Front Panel Design

5. Power Supply Subsystem Design
6. Complete System Design of any
Portable Device
7. Design of Double Sided PCB
8. Creating a Testing and Quality
Assurance manual for a product
9. Write a Technical manual for a
product

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Experiment No.1
Study of IP (Ingress Protection) Standards
Aim- Study of IP (Ingress Protection) Standards

Equipment-

Theory-
The IP (Ingress Protection) standards are a set of ratings that define the level of protection
provided by an enclosure against the intrusion of solid particles and liquids. These standards are
internationally recognized and maintained by the International Electrotechnical Commission
(IEC) under the IEC 60529 standard. The IP code is typically written as "IP" followed by two
digits (e.g., IP67).

The IP code has two digits, each with its own specific meaning:
First Digit (Protection against solid particles):
0: No protection against solid particles.
1: Protection against solid particles larger than 50mm in size.
2: Protection against solid particles larger than 12.5mm in size.
3: Protection against solid particles larger than 2.5mm in size.
4: Protection against solid particles larger than 1mm in size.
5: Limited protection against dust ingress.
6: Totally protected against dust ingress.
Second Digit (Protection against liquids):
0: No protection against liquids.
1: Protection against vertically falling water drops.
2: Protection against water drops at an angle up to 15 degrees from vertical.
3: Protection against spraying water at an angle up to 60 degrees from vertical.
4: Protection against splashing water from any direction.
5: Protection against water jets from any direction.
6: Protection against powerful water jets or heavy seas.
7: Protection against temporary immersion in water (up to 1 meter for 30 minutes).
8: Protection against continuous immersion in water under specified conditions.

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For example, an IP67-rated device means it has a level 6 (highest) protection against dust and a
level 7 protection against temporary immersion in water.

IP ratings are commonly found in various electronic devices, outdoor equipment, lighting fixtures,
and industrial products. The standards help manufacturers and consumers understand the level of
protection a device offers against environmental elements.
It's essential to consider IP ratings when selecting equipment for specific applications, ensuring
that the devices can withstand the environmental conditions they will be exposed to.
Ingress Protection ratings or IP ratings are defined by international standard IEC 60529, which
classifies the degrees of protection provided against the intrusion of solid objects (which includes
body parts like hands and fingers), dust, accidental contact, and water in electrical enclosures. The
IP Rating provides a clearer meaning rather than vague marketing terms such as waterproof or
water resistant.

IP Rating for solid objects.

The numbers indicate conformity with the conditions shown below with the first digit indicating
the level of protection that the enclosure provides against access to hazardous parts (e.g., electrical
conductors, moving parts) and the ingress of solid foreign objects.
Solid foreign objects can be anything from fingers (ouch!) to tools to dust and anything in
between. Knowing what degree of protection the housing provides should be a key part of health
and safety planning both for existing equipment and new purchases.
Level Object size Effective against
protected against

0 Not protected No protection against contact and ingress of objects

1 >50mm Any large surface of the body, such as the back of the
hand, but no protection against deliberate contact with
a body part.

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2 >12.5mm Fingers or similar objects.

3 >2.5mm Tools, thick wires, etc.

4 >1mm Most wires, screws, etc.

5 Dust Protected Ingress of dust is not entirely prevented, but it must

not enter in sufficient quantity to interfere with the
satisfactory operation of the equipment, complete
protection against contact.

6 Dust Tight No ingress of dust; complete protection against

contact.

IP Rating for liquids.

The second digit relates to liquids and protection of the equipment inside the enclosure against
harmful ingress of water.
Object size Effective against
Level protected
against

0 Not protected –

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1 Dripping Dripping water (vertically falling drops) shall have no

water harmful effect.

2 Dripping when tilted up to 15° Vertically dripping water shall have no

water harmful effect when the enclosure is tilted at an angle up to
15° from its normal position.

3 Spraying Water falling as a spray at any angle up to 60° from the

water vertical shall have no harmful effect.

4 Splashing Water splashing against the enclosure from any direction

water shall have no harmful effect.

5 Water jets Water projected by a nozzle (6.3mm) against enclosure from

any direction shall have no harmful effects.

6 Powerful Water projected in powerful jets (12.5mm nozzle) against

water jets the enclosure from any direction shall have no harmful
effects.

7 Immersion Ingress of water in harmful quantity shall not be possible

up to 1m when the enclosure is immersed in water under defined
conditions of pressure and time (up to 1 m of submersion).

8 Immersion The equipment is suitable for continuous immersion in

beyond 1m water under conditions which shall be specified by the
manufacturer. Normally, this will mean that the equipment
is hermetically sealed. However, with certain types of
equipment, it can mean that water can enter but only in such
a manner that it produces no harmful effects.

For further information on IP Rating is available using the following links:

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Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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 Electronic Product Design

Experiment No. 2
Study EMC/EMI Standards
Aim- Study EMC/EMI Standards

Equipment-

Theory-
EMC (Electromagnetic Compatibility) and EMI (Electromagnetic Interference) standards are
essential guidelines and regulations that aim to ensure electronic and electrical devices can coexist
and operate without negatively affecting each other or the surrounding electromagnetic
environment. Compliance with these standards is crucial to prevent interference issues and
maintain the reliable performance of devices in various applications.

Some of the key EMC/EMI standards include:

 CISPR 22/CISPR 32: These are standards developed by the International Special
Committee on Radio Interference (CISPR) and cover the emission of radio-frequency
interference from Information Technology Equipment (ITE) and multimedia equipment.
 CISPR 16: This standard specifies the methods of measurement of radio interference
characteristics for the determination of compliance with EMC requirements. It covers
radiated and conducted emissions.
 EN 55032/EN 55022: European Union equivalents of CISPR 32/CISPR 22, which define
limits and methods of measurement of electromagnetic emissions from multimedia
equipment and ITE.
 FCC Part 15: A set of regulations from the U.S. Federal Communications Commission
(FCC) that governs the unintentional emissions of electromagnetic radiation from digital
devices.
 EN 61000-4 series: This series of standards, also known as the IEC 61000-4 series,
addresses various EMC test methods, including immunity to electrostatic discharge
(ESD), radiated and conducted immunity, and surge immunity.
 EN 61000-3 series: This series of standards provides limits for voltage fluctuations,
flicker, and harmonics to ensure the compatibility of electrical equipment with the power
grid.
 MIL-STD-461: A military standard used in the United States that defines the requirements
for the control of electromagnetic interference characteristics of equipment.
 ISO 11452: A series of standards that specify electromagnetic compatibility test methods
and procedures for road vehicles.
These standards cover a wide range of topics related to EMC/EMI, including emission limits,
immunity testing, test methods, and compliance procedures. Compliance with these standards is
often a prerequisite for obtaining regulatory approvals and certifications required for selling
products in specific markets.

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Manufacturers and engineers must carefully design, test, and verify their products to meet these
standards to ensure that they do not cause harmful interference to other devices and can withstand
external electromagnetic interference. Non-compliance with EMC/EMI standards can result in
issues such as degraded performance, malfunctions, or communication problems between devices.

Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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 Electronic Product Design

Experiment No. 3
Study of Cooling Techniques
Aim- Study of Cooling Techniques

Equipment-

Theory-
Cooling techniques are methods used to dissipate heat from electronic, mechanical, or industrial
systems to prevent overheating and maintain optimal operating conditions. Effective cooling is
essential to ensure the reliability and longevity of devices and systems.

Here are some common cooling techniques:

 Air Cooling: Air cooling is one of the simplest and most widely used cooling methods. It
involves using fans or blowers to circulate air around heat-generating components or
devices. The air absorbs the heat and carries it away, thus reducing the temperature of the
components. Air cooling is cost-effective and suitable for low to medium heat dissipation
requirements.
 Liquid Cooling: Liquid cooling uses a liquid coolant (usually water or a water-glycol
mixture) to remove heat from components. Liquid absorbs more heat than air, making it
more efficient in dissipating high heat loads. Liquid cooling can be implemented using
either liquid-to-air heat exchangers (air-cooled radiators) or liquid-to-liquid heat
exchangers (water-cooled systems). It is commonly used in high-performance computing,
servers, and overclocked computer systems.
 Phase-Change Cooling: Phase-change cooling systems use refrigerants to absorb heat as
they change from liquid to gas (evaporation) and release heat as they change from gas to

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liquid (condensation). This method is commonly employed in extreme cooling solutions,

such as for overclocking or in industrial applications where very low temperatures are
required.
 Heat Pipes: Heat pipes are passive heat transfer devices that use the principle of phase
change to transfer heat efficiently. They consist of a sealed tube containing a small amount
of working fluid. The fluid absorbs heat from the heat source, vaporizes, and then
condenses at a cooler surface, releasing the heat. Heat pipes are used to transfer heat over
longer distances and are commonly found in laptops and other compact electronic devices.
 Heat Sinks: Heat sinks are passive cooling devices typically made of metal (aluminum or
copper) with fins or other extended surfaces. They are attached to heat-generating
components to increase the surface area for heat dissipation. Heat sinks work by
conduction and convection, allowing heat to spread out and dissipate more effectively into
the surrounding air.
 Thermoelectric Cooling: Thermoelectric cooling (also known as Peltier cooling) uses the
Peltier effect to create a temperature difference at the junction of two different materials.
When an electric current is passed through the junction, heat is either absorbed or released,
depending on the direction of the current. This method is commonly used for small-scale
cooling applications.
 Direct Liquid Cooling (DLC): In this technique, the liquid coolant is directly brought into
contact with the heat-generating components, providing efficient heat transfer. DLC is
gaining popularity in high-performance computing and data centers.
Each cooling technique has its advantages and limitations, and the choice of method depends on
factors such as the heat load, space constraints, cost considerations, and the specific requirements
of the application. Effective cooling is crucial to maintaining the performance and reliability of
electronic and mechanical systems, especially in high-power and high-performance applications.

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Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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Experiment No. 4
Enclosure and Front Panel Design
Aim- Enclosure and Front Panel Design

Equipment-

Theory-
Enclosure and front panel design are critical aspects of product development, especially for
electronic devices and equipment. The enclosure houses the internal components, protects them
from environmental factors, and provides a user-friendly interface through the front panel. Here
are some key considerations for enclosure and front panel design:

1. Purpose and Use: Understand the purpose of the product and how it will be used. Consider
factors such as the intended environment (indoor, outdoor, industrial, etc.), user
ergonomics, and the need for protection against dust, water, and other hazards.
2. Material Selection: Choose the appropriate materials for the enclosure and front panel
based on factors like strength, durability, electrical properties, thermal conductivity, and
aesthetic appeal. Common materials include metals (aluminum, steel), plastics (ABS,
polycarbonate), and composite materials.
3. Enclosure Size and Shape: The enclosure size should accommodate all internal
components, connectors, and cooling solutions without excessive empty space. The shape
and design should align with the product's aesthetics and branding.
4. Cooling and Ventilation: If the product generates significant heat, incorporate cooling
solutions such as fans, heat sinks, or ventilation holes in the enclosure design to maintain
optimal operating temperatures.
5. EMI/RFI Shielding: For electronic devices, consider electromagnetic interference (EMI)
and radio-frequency interference (RFI) shielding to prevent unwanted electromagnetic
emissions and protect the product from external interference.
6. IP Rating: If the product is intended for outdoor or rugged use, ensure it meets the
necessary Ingress Protection (IP) standards for dust and water resistance.
7. User Interface: Design the front panel to provide an intuitive and user-friendly interface.
Consider the placement of buttons, knobs, display screens, and other input/output
components for easy access and readability.
8. Labeling and Branding: Clearly label control elements and interfaces with symbols, text,
or icons. Incorporate branding elements like logos and product names to create a cohesive
identity.
9. Assembly and Manufacturing: Design the enclosure and front panel with ease of assembly
and manufacturing in mind. Minimize the number of parts and use standardized
components where possible to streamline production.
10. Safety Considerations: Ensure the design meets relevant safety standards and regulations
for the intended market or application.

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11. Prototyping and Testing: Create prototypes to evaluate the physical and functional aspects
of the design. Conduct testing for performance, usability, and compliance with relevant
standards.
12. Accessibility: Consider accessibility features for users with disabilities, such as tactile
indicators, contrasting colors, and ergonomic designs.
The enclosure and front panel design should strike a balance between functionality, aesthetics,
and manufacturability. Collaborating with industrial designers, mechanical engineers, and user
experience (UX) experts can help create a well-integrated and successful product design.
Additionally, feedback from target users during the design process can lead to valuable
improvements and a better overall user experience.

Custom Control Panel Enclosures

Pros:

 Measurements, holes, hinges and latching mechanisms will be exactly what the OEM
needs, where he or she needs them
 Designers can add visual appeal to the enclosure, integrating it into company branding
efforts and enhancing the overall aesthetics of the machine

Cons:

 Longer lead times

 Higher costs
 Generally not water/weatherproof

Standard Control Panel Enclosures

Pros:

 Readily available with shorter lead times

 Cost efficient
 Can be water/weatherproof

Cons:

 Limited to standard sizing, color and material options

 Secondary machining is usually necessary to add or resize holes to accommodate the
OEM’s needs

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Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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Experiment No. 5
Power Supply subsystem Design
Aim- Power Supply subsystem Design

Equipment-

Theory-

Designing a power supply subsystem is a critical aspect of electronic product development. The
power supply subsystem is responsible for providing stable and reliable electrical power to all the
components within the device. Here are some key steps and considerations for designing a power
supply subsystem:

1. Power Requirements Analysis: Understand the power requirements of all the components
in the system. Determine the voltage and current levels needed for each component during
both idle and peak operation. Consider any transient or start-up currents that may affect
the power supply design.
2. Input Power Source: Identify the input power source for the system. It could be mains AC
power, batteries, DC power from another device, or renewable energy sources (solar,
wind, etc.). The choice of power source will influence the design of the power supply
subsystem.
3. Power Conversion: Based on the power requirements and input source, select appropriate
power conversion methods, such as linear regulators, switching regulators (buck, boost, or
buck-boost), or DC-DC converters. Switching regulators are more efficient and suitable
for higher power applications, but linear regulators are simpler and quieter for low-power
applications.
4. Efficiency and Heat Dissipation: Consider the efficiency of the power supply subsystem to
minimize power losses and maximize battery life (if applicable). Efficient power supplies
generate less heat, reducing the need for extensive heat dissipation measures. Adequate
heat sinking and cooling solutions should be incorporated for power-hungry components
or environments with high ambient temperatures.
5. Voltage Regulation: Ensure stable voltage regulation to protect sensitive components from
voltage fluctuations. Voltage regulators or voltage references may be used for this
purpose.
6. Current Limiting and Protection: Implement current limiting and protection features to
prevent damage due to overcurrent conditions or short circuits. Fuses, current limiters, and
electronic protection circuits can be employed.
7. EMI/EMC Considerations: Design the power supply subsystem with electromagnetic
interference (EMI) and electromagnetic compatibility (EMC) in mind. Proper filtering,
grounding, and shielding can help reduce emissions and improve system performance.
8. Safety and Isolation: In some applications, isolation may be required to protect users from
electrical hazards. Isolation transformers or opto-isolators can be used to provide isolation
between input and output circuits.

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9. Power Sequencing: Plan the power-on and power-off sequence to ensure that sensitive
components receive power in the correct order, avoiding potential issues during startup
and shutdown.
10. Redundancy: For critical systems, consider incorporating redundant power supply paths to
ensure continued operation in case of a single point of failure.
11. PCB Layout: Pay attention to the PCB layout of the power supply circuitry to minimize
noise, reduce parasitic elements, and optimize the signal integrity.
12. Testing and Validation: Thoroughly test the power supply subsystem under different
operating conditions and load scenarios. Verify that it meets the specified requirements
and safety standards.
Remember to adhere to relevant safety and compliance standards for power supply design in your
industry or region. Additionally, consider factors like cost, size, and weight constraints, as they
will influence the overall system design and product performance.

Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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Experiment No. 6
Complete System Design of any Portable Device
Aim- Complete System Design of any Portable Device

Equipment-

Theory-
Designing a complete system for a portable device involves a multidisciplinary approach that
considers various aspects, including mechanical design, electronics, power supply, user interface,
software, and more. Let's take the example of a portable Bluetooth speaker as a case study for the
complete system design:
1. Product Concept and Market Research: Define the purpose and target market for the
portable Bluetooth speaker. Conduct market research to identify user needs, competitors,
and potential differentiators for the product.
2. Product Requirements Specification: Based on market research and user needs, create a
detailed product requirements document that outlines the features, specifications, and
performance criteria of the portable Bluetooth speaker.
3. Industrial Design: Collaborate with industrial designers to create the physical appearance
and form factor of the speaker. Consider factors like aesthetics, ergonomics, materials, and
durability.
4. Electronics and PCB Design: Design the electronic circuitry of the Bluetooth speaker.
This includes the audio amplifier, Bluetooth module, digital signal processor (DSP),
battery management, and other components. Create the Printed Circuit Board (PCB)
layout to integrate the electronic components.
5. Audio and Acoustic Design: Work with audio engineers to design the speaker drivers,
enclosure, and acoustic components to achieve the desired sound quality and frequency
response.
6. Power Supply and Battery Management: Design the power supply subsystem, considering
the power requirements of the electronics and audio components. Implement battery
management circuits for charging and discharging the battery safely.
7. User Interface Design: Develop the user interface, which may include physical buttons,
touch controls, LED indicators, and a display (if applicable). Focus on intuitive controls
and user experience.
8. Wireless Connectivity: Integrate the Bluetooth module for wireless connectivity with
smartphones, tablets, or other devices.
9. Software Development: Develop the firmware that controls the various functions of the
portable speaker, including Bluetooth communication, audio processing, power
management, and user interface interactions.
10. Testing and Validation: Conduct comprehensive testing to verify that the portable speaker
meets the specified requirements, including audio quality, wireless performance, power
efficiency, and durability. Validate the product against relevant standards and
certifications.

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11. Packaging and Assembly: Design the packaging for the product to ensure safe shipping
and appealing presentation to consumers. Plan the assembly process, considering the ease
of manufacturing and quality control.
12. Quality Assurance and Compliance: Implement quality assurance processes to monitor
production and ensure consistent product quality. Ensure the product complies with
relevant safety, environmental, and wireless communication standards (e.g., CE, FCC,
RoHS).
13. Manufacturing and Supply Chain: Establish relationships with manufacturers, suppliers,
and distributors for mass production and distribution of the portable speakers.
14. Marketing and Launch: Develop a marketing strategy and launch plan to promote the
portable speaker, generate consumer interest, and drive sales.
15. Post-Launch Support: Provide customer support, address any issues or feedback from
users, and release software updates to enhance the product's performance over time.
The successful completion of a portable Bluetooth speaker involves collaboration among various
teams, including industrial designers, mechanical engineers, electrical engineers, audio engineers,
software developers, and marketing professionals. Each team's expertise contributes to creating a
well-designed and functional portable device that meets user needs and delivers an exceptional
user experience

Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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Experiment No. 7
Design of Double Sided PCB
Aim- Design of Double Sided PCB

Equipment-

Circuit & PCB layout-

Designing a double-sided PCB using Altium Designer involves several steps, from creating the
schematic to generating Gerber files for manufacturing. Here's a step-by-step guide to help you
design a double-sided PCB using Altium Designer:

1. Schematic Design:
 Create a new project in Altium Designer and add a schematic sheet.
 Use the schematic editor to place and connect electronic components, ensuring proper
signal and power connections.
2. Component Footprints:
Add component footprints to the schematic symbols or create custom footprints if required.
Associate the components in the schematic with their corresponding footprints.

3. Netlist Generation:
Compile the schematic to generate a netlist that captures the connectivity information of the
design.

4. PCB Layout:
 Create a new PCB layout file in the project.
 Import the netlist into the PCB layout editor to establish the connectivity between
components.
5. Board Outline:
Define the board outline based on the mechanical constraints and enclosure requirements. You
can draw the board outline or import it from a mechanical design file.

6. Layer Stackup:
Define the layer stackup, specifying the number of layers, their arrangement, and any signal and
power planes.

7. Component Placement:
Manually place the components on the PCB layout or use the auto-placement feature to get a
preliminary placement.

8. Routing:
 Start routing the traces on the top layer of the PCB layout, following the schematic
connections.
 Use interactive routing tools to route traces, maintaining the design rules for width,
clearance, and impedance.

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 Use vias to connect traces between the top and bottom layers.
9. Ground Plane and Power Plane:
 Add a continuous ground plane on the bottom layer to provide a low-impedance return
path for signals and reduce EMI.
 Add power planes on the desired layers for power distribution.
10. Routing on Bottom Layer:
 Continue routing traces on the bottom layer, ensuring that they do not overlap with traces
on the top layer to avoid short circuits.
 Silkscreen and Designators:
 Add silkscreen markings for component names, values, and reference designators to aid
assembly and testing.
11. Design Rule Check (DRC):
Run a design rule check to ensure that your PCB design meets the manufacturing constraints and
standards.

12. PCB Design Validation:

Use built-in simulation and signal integrity tools to validate your design for electrical
performance.
13. Gerber Generation:
Generate Gerber files, NC drill files, and other manufacturing outputs required by your PCB
manufacturer.

14. Assembly and Testing:

 After manufacturing, assemble the components onto the PCB using standard PCB
assembly techniques.
 Thoroughly test the assembled PCB to verify its functionality and performance.
Remember to check your design at different stages to catch any errors and ensure the design
meets your specific requirements. Altium Designer provides various design rule checks and
simulation tools to help you optimize your design and create a reliable and high-quality double-
sided PCB

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Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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Experiment No. 8
Creating Testing and Quality Assurance manual for a product
Aim- Creating Testing and Quality Assurance manual for a product

Equipment-

Theory-
Creating a Testing and Quality Assurance (QA) Manual for a product is essential to ensure that
the product meets the desired quality standards and performs as expected. The manual serves as a
comprehensive guide for conducting tests, documenting procedures, and maintaining quality
throughout the product's development and manufacturing lifecycle. Here's a step-by-step guide to
help you create a Testing and Quality Assurance Manual for your product:

 Introduction:
Provide an overview of the product and its purpose.

Explain the importance of testing and quality assurance in ensuring product performance and
customer satisfaction.

 Scope and Objectives:

Define the scope of the Testing and QA activities. Specify which aspects of the product will be
tested and the level of testing required.

Set clear objectives for the Testing and QA process, including the desired quality standards and
performance metrics.

 Testing and QA Team:

List the members of the Testing and QA team, along with their roles and responsibilities.

Identify any external parties involved in the testing process, such as third-party testing labs or
consultants.

 Testing Methodology:
Describe the testing methodologies to be employed, such as black-box testing, white-box testing,
regression testing, performance testing, etc.
Explain the rationale behind the chosen testing approaches and their suitability for the product.

 Testing Procedures:
Provide step-by-step testing procedures for each type of test. This includes test setup, test
execution, data collection, and result analysis.
Include any specific requirements, tools, or equipment needed for conducting the tests.

 Test Cases and Scenarios:

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Create detailed test cases and test scenarios that cover all functional and non-functional aspects of
the product.
Clearly state the expected outcomes and acceptance criteria for each test case.

 Defect Management:
Outline the process for reporting and tracking defects or issues identified during testing.

Define the severity and priority levels for different types of defects and specify the turnaround
time for resolving them.

 Quality Assurance Process:

Describe the quality assurance process for ensuring that the product adheres to the specified
quality standards.

Include any audits, inspections, or reviews that will be conducted throughout the development and
manufacturing stages.

 Documentation and Records:

Specify the documents and records that need to be maintained throughout the Testing and QA
process.
Include templates for test reports, defect logs, and other relevant documents.

 Training and Skill Development:

Identify any training requirements for the Testing and QA team to enhance their skills and
knowledge.

Plan for regular skill development sessions to keep the team updated with the latest testing
techniques and tools.

 Continuous Improvement:
Emphasize the importance of continuous improvement in the Testing and QA process.

Encourage feedback from team members to identify areas for improvement and implement
corrective actions.

 Compliance and Standards:

Ensure that the Testing and QA process aligns with relevant industry standards and regulations.
Include any certifications or compliance requirements that the product must meet.

 Approval and Review Process:

Define the process for approving the final product based on the testing and QA results.
Establish a review process for periodically evaluating and updating the Testing and QA Manual.

 Appendix:
Include any additional information or reference materials that support the Testing and QA
process, such as test data, sample reports, and relevant standards documents.

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Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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Experiment No. 9
Write a Technical manual for a product

Aim- Write a Technical manual for a product

Equipment-

Theory-
Creating a technical manual for a product requires clear and detailed documentation of the
product's features, functions, and usage instructions. The manual serves as a guide for users,
technicians, and support personnel to understand and operate the product effectively. Here's a
general structure and content you can include in a technical manual:
Title Page:

 Product Name
 Version Number
 Date of Publication
 Company/Manufacturer Information
 Copyright Notice
Table of Contents:

 List of Sections and Subsections with page numbers for easy navigation.
1. Introduction:

 Overview of the product and its intended use.

 Brief description of key features and benefits.
 Safety warnings and precautions.
2. Product Description:

 Detailed description of the product's physical appearance, components, and interfaces.

3. Technical Specifications:

 Specifications and technical details, including dimensions, weight, power requirements,

operating conditions, and environmental considerations.
4. Installation:

 Step-by-step instructions for installing or setting up the product.

 Guidance on connecting external peripherals or accessories.
5. Operation:

 Instructions on how to operate the product, including power-on/off procedures, navigation,

and user interface controls.
 Description of different modes and settings.
6. Troubleshooting:

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 A list of common issues or errors that users might encounter.

 Possible causes and solutions for each issue.
7. Maintenance and Cleaning:

 Instructions for routine maintenance and cleaning of the product.

 Recommended schedules for maintenance tasks.
8. Safety and Regulatory Compliance:

 Detailed safety guidelines for safe operation and handling.

 Compliance information with relevant standards and regulations.
9. Technical Support:

 Contact information for technical support or customer service.

 Troubleshooting tips and procedures for support personnel.
10. FAQs:
Frequently asked questions and answers related to the product.
11. Glossary:
A list of technical terms and their definitions for easy reference.
12. Index:
Alphabetical list of terms, topics, and page numbers for quick lookup.
Appendix:

 Any additional information or resources, such as diagrams, charts, technical drawings, or

warranty information.

Copyright and Legal Information:

Include copyright notice, terms of use, and any disclaimers.

Remember to use clear language and visuals (images, diagrams) to aid understanding. Use
headings, bullet points, and numbered lists to make the information more organized and
accessible. The manual should be user-friendly and designed for the target audience's technical
expertise. Proofread and review the manual thoroughly before publishing to ensure accuracy and
consistency.

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Conclusion: -

______________________________________________________________________________

______________________________________________________________________________

Assessment of the Experiment / Assignment:

Timely Submission Presentation Understanding Total Signature of Teacher

(07) (06) (12) (25) with date

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