BTS4501D
BTS4501D
com
Application
• All types of resistive, inductive and capacitive loads
• Current controlled power switch for 12 V and 24 V DC applications
• Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power MOSFET with charge pump ground referenced
CMOS compatible input, monolithically integrated in Smart SIPMOS technology.
Fully protected by embedded protection functions.
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Block Diagram
+ V bb
Voltage Overvoltage Current Gate
source protection limit protection
ESD- V Logic
Diode
Voltage Charge pump Limit for OUT
unclamped
sensor Level shifter ind. loads Temperature
Rectifier sensor
R
in
IN Load
ESD Logic
GND mini-PROFET
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Inductive load switch-off energy dissipation1)2) EAS 8 tbd J
single pulse
Operating temperature range Tj -40 ...+ 125 -40 ...+ 125 °C
Storage temperature range Tstg -55 ...+150 -55 ...+ 150
Max. power dissipation (DC)1) TA = 25 °C Ptot 1.4 1.4 W
Electrostatic discharge voltage ( Human Body Model) EAS kV
according to ANSI EOS/ESD – S5.1 – 1993
ESD STM5.1 – 1998
Input pin ±1 ±1
All other pins ±1 ±5
Thermal resistance junction – case: RthJC 3 3 K/W
junction - ambient:1) RthJA 60 60
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1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for V
bb
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connection. PCB is vertical without blown air..
2) not tested, specified by design
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Nominal load current IL(nom) -- -- -- 0,7 -- -- A
Device on PCB1)
Turn-on time Tj = -40...125°C to 90% VOUT ton -- 60 100 -- 50 100 µs
Turn-off time Tj = -40...125°C to 10% VOUT toff -- 90 150 -- 75 150
Slew rate on dV /dton -- 2 4 -- 1 2 V/µs
10 to 30% VOUT Tj = -40...125°C
Slew rate off -dV/dtoff -- 2 4 -- 1 2 V/µs
70 to 40% VOUT Tj = -40...125°C
1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air..
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Undervoltage hysteresis ∆Vbb(under) -- 0,4 -- -- 0,5 -- V
Standby current Ibb(off) µA
Tj = -40...tbd°C -- 10 20 -- 10 25
Tj = 125°C1) -- -- 100 -- -- 50
Operating current, VIN = high Tj = -40... 25°C IGND 0,5 1 1,5 tbd 1 1,6
Tj = +125°C 0,4 1,2
Leakage output current ( included in Ibb(off) ) IL(off) -- -- 2 -- tbd 10 µA
VIN = 0 V Tj = -40...125°C
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Tj = 125°C 0,7 -- -- 0,7 -- --
Output clamp (inductive load switch off) VON(CL) 47 53 60 47 53 60 V
at Vout = Vbb - VON(CL)
Overvoltage protection Vbb(AZ) 47 -- -- 47 -- -- V
Tj =-40...+125°C
Thermal overload trip temperature Tjt 135 150 -- 135 -- -- °C
Thermal hysteresis ∆Tjt -- 10 -- -- 10 -- K
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Input turn-off threshold voltage VIN(T-) 1,82 -- -- 1,82 -- -- V
Tj = -40...125°C
Input threshold hysteresis ∆VIN(T) -- 0,1 -- -- 0,3 -- V
Off state input current IIN(off) 20 -- -- 20 -- -- µA
Tj = -40...125°C
On state input current IIN(on) -- -- 110 -- -- 110 µA
Tj = -40...125°C
Input resistance RI -- -- -- -- 3 -- kΩ
Reverse Battery
Reverse battery1) -Vbb -- -- -- -- -- tbd V
Continious reverse drain current IS -- -- 1 -- -- tbd A
Drain source diode voltage -VON -- -- 1,2 -- 0,6 -- V
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1) Requires 150 Ω resistor in GND connection. Reverse load current (through intrinsic drain-source diode)
is normally limited by the connected load.
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Package:
SOT 223:
1 ±0.1
0.8 ±0.15
(4.17)
6.22 -0.2
0...0.15
9.9 ±0.5
0.51 min
0.15 max
per side 5x0.6 ±0.1 0.5 +0.08
-0.04
1.14
0.1
4.56
0.25 M A B GPT09161
Published by
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Bereichs Kommunikation
St.-Martin-Strasse 76,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
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Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
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For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please
contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended
to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
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