INTRODUCTION TO ANALOG
ELECTRONICS AND VLSI DESIGN:
AN INTRODUCTORY DISCUSSION ON ANALOG ELECTRONICS AND
VLSI DESIGN
Dr. Santanu Sarkar
Department of ECE 1
NIT Rourkela
Contents
1. Introduction to VLSI
2. Different Vertices of VLSI Circuits
3. Challenges of VLSI Designs
4. Application of VLSI Circuits and Data Converters
5. Prospects and Job opportunity
6. Conclusion and Question Answers
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Introduction to VLSI
• VLSI: VLSI stands for Very-large-scale integration. VLSI is the process of creating an integrated
circuit (IC) by combining billions of transistors into a single chip.
• The evolution in semiconductor industry started with Vacuum Tube Diode, ICs of Discrete
Components, then VLSI Circuits and finally, System-on-Chip (SoC).
• The evolution of Integrated Circuits can be classified into different categories depending on the
number of transistors fabricated on a single IC. They are as follows:
• SSI: Small Scale Integration. Few tens of transistors in a single IC.
• MSI: Medium Scale Integration. Refers to microchips containing 100s of transistors.
• LSI: Large Scale Integration. Refers to microchips containing 1000s of transistors.
• VLSI: Very Large Scale Integration. Refers to microchips containing hundreds of thousands of
(millions) transistors.
• ULSI: Ultra Large Scale Integration. Refers to microchips containing billions of transistors.
• Modern VLSI Circuits actually refers to ULSI. 3
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Advancement of VLSI & Moore’s law
• Moore’s Law • Power Consumption in Intel Processor
• Gordon Moore, Co-founder of Intel (1968), first indicated that the number of transistors
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Microprocessor chip will increase at a rate of 1.5 to 2 times per year. The statement was quite
accurate and is widely known as Moore’s law.
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History of VLSI
• Invention of Transistor: William Shockley, John Bardeen, and Walter H. Brattein of Bell
Laboratory invented the transistor on 23rd December, 1947. They were awarded Nobel prize in
1956 for Physics for the invention of the transistors.
• The first patent on MOS FET was issued by Julius Lillienfeld in 1929. Due to implementation
difficulty which was first implemented much later around 1959.
• First IC: The first IC was invented in 1958 by Jack Kilby of TI, who won the Nobel Prize in 2000
(10 components in 9 mm2), and later, Robert Noyce, of Fairchild (Co-founder of intel) improved it.
• 1st Microprocessor: Ted Hoff of Intel implemented first Microprocessor (4004) in 1971.
Approximately 2300 transistors were there.
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VLSI Technology-MOS Fabrication
• NMOS and PMOS.
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• Fabrication Steps.
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VLSI Technology-Latch Up
• Latch up problem • Equivalent Circuit and Large latch-up current
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VLSI Technology-SOI
• Use of Guard Ring to reduce Latch Up • SOI Technology
How to reduce Latch Up:
• Every well must have an appropriate substrate contact.
• Every substrate contact should be directly connected to Advantage of SOI:
a supply pad by metal. • Due to the absence of wells, transistor structures denser than
• Substrate contacts should be placed as close as possible bulk silicon are feasible.
to the source connection of transistors to reduce the • Lower substrate capacitance.
value of both Rs and Rwell. • No field-inversion problems (the existence of a parasitic
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transistor between two normal transistors).
• No latch-up is possible because of the isolation of transistors
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Integrated Circuits
• First Planer IC and photo of a Intel Microprocessor die.
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Integrated Circuits
• Silicon Wafer, die and Packaged IC.
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Integrated Circuits
• Design Specification
• Architectural Design
• RTL Coding/ Circuit Design
• Synthesis
• Physical Design
• GDS (Graphic Database System)
• Fabrication
• Package and Test
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DR. SANTANU SARKAR • VLSI Design Flow
VLSI Design Flow
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Integrated Circuits
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• VLSI Design Flow
VLSI Design Flow
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Major Branches of Microelectronics & VLSI Design
• Analog VLSI (Linear Amplifier, Data Converters, PLL, Reference Generator, etc.)
• Digital VLSI (Microprocessor, Memory, etc.)
i) ASIC (Gate Array, Semi Custom, Full Custom)
ii) FPD ( PLD [PLA, PAL], FPGA)
• Power Management ( LDO Regulators, DC-DC Converters, etc.)
• RFIC Design (Transceiver Circuit, Oscillator, PLL, etc.)
• MEMS and Signal Conditioning (Capacitive sensors, Pressure sensors, etc.)
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FPGA
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Major Branches of Microelectronics & VLSI Design
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• Power Management • RFIC
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Low Power Design Challenge
• Dynamic Power dissipation in CMOS
Circuits
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Low Power Design Challenge
• To reduce power dissipation for portable
battery operated consumer electronics
devices, several low power design techniques
are incorporated.
• Some of the important low power design
techniques are:
• Scaling supply voltage, Utilising Multiple Vth
devices, Reducing gate oxide capacitance by
using superior technology, reducing signal
activity, utilising parallelism and pipelining,
improvement in clock driver network and
improved metal layer to reduce parasitic
capacitance of the data bus. 19
• Green IC
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SOC
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• SoC provides improved area-cost-performance over SoB (System on Board)
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SOC Design Steps
• SoC Design Window
• Planning to Product Launch
• The complete planning
• Proper Time Budget
• And Manpower Allocation
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• SoC Design Time (Window) Slots
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Signal Processing
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• The Flow of Signals
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Data Converters
• Analog and Digital Signals
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Data Converters
• Analog and Digital Signals
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Data Converters
• Sampling Theorem
and Aliasing
• Quantisations
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Analog-to-Digital Data Converters
Architectures:
• Flash ADC
• Dual Slope ADC
• Oversampling ADC
• Successive approximation ADC
• Pipeline ADC
Metrics:
• Resolution
• INL, DNL
• Sampling and Signal Frequency
• Signal-to-Noise Ratio
• ENOB 26
• THD
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ADC Applications
• A Typical Receiver Block
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DAC Architectures
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DAC
Architectures:
• Resistor String DAC
• R-2R DAC
• Capacitive DAC
• Oversampling DAC
• Current Steering DAC
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Implementation of the Proposed DAC
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Implementation of 10-bit 500 MSPS CS DAC
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Layout of Bandgap Current Reference
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Implementation of 10-bit 500 MSPS CS DAC
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Layout of Bandgap Current Reference and Current Cell Matrix
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Test Set Ups and Test Plans for the DACs
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Test Set Ups for the DACs Test Plan: Outline of the PCBs
Test Results of the First 8-bit 100 MSPS Low
Power DAC
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Die Micrograph of the DAC Chip
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Implementation of 10-bit 500 MSPS CS DAC
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DR. SANTANU SARKAR Test Set-up of the 10-bit DAC
Measured Frequency Spectrum
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65.90 dB SFDR for 146 kHz signal sampled at 50 MSPS
(Bluetooth Setting)
Measured Sinusoidal Output
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Measured Sinusoidal Output for 1.07 MHz signal sampled at 100 MSPS
(WLAN Setting)
Application of DACs
Direct Transmitter System
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Biomedical Applications: Emerging Field
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Application of VLSI Circuits
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DR. SANTANU SARKAR Hardware and Cyber Security
Application of VLSI Circuits
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VLSI Application Areas
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Job Opportunity
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Thank You for Your Attention
Questions??
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