Different Types of Soldering

Soldering is the process of using a metal alloy to join two metal surfaces. A soldering iron tool is
used to melt the solder and join the metals.
Types of Soldering
Reflow soldering permanently glues components that are first temporarily stuck to their pads
on circuit boards using solder paste that will be melted through hot air or other
thermal radiation conduction. Reflow soldering is implemented in a machine
called a reflow soldering oven. As its definition implies, electrical components
are temporarily attached to contact pads prior to soldering using solder paste.
Wave soldering is used to combine PCBs and parts through a liquid “wave” formed as the result
of motor agitation. The liquid is actually dissolved tin. It is carried out in a wave
soldering machine.
Hand-soldering is one of the most fundamental skills to learn in electronics. Hand soldering
PCBs is usually the last step in the assembly process for prototypes and is used to
finish out details for through-holes and surface mounted components. Hand
soldering can be a tricky skill to learn as it requires a breadth of knowledge and
practice to master.
Four Key Elements in Soldering
• Iron
• Solder
• Flux
• Component
 Electronic Component
3 main types of electronic component
1. Passive
Devices that store or maintain energy in the form of voltage or current
Example: Resistor, capacitor, inductor
2. Active
Devices or components that produce energy in the form of voltage or current
Example: Transistor, diode, SCR
3. Electromechanical
 Flux
 is a chemical cleaning agent used before and during the soldering process of electronic
components onto circuit boards. The main purpose of the flux is to prepare the metal surfaces
for soldering by cleaning and removing any oxides and impurities. Oxides are formed when
metal is exposed to air and may prevent the formation of good solder joints.

 Solder Wire
Is a fusible metal alloy used to create permanent bond between metal and work pieces.
How to Solder Properly and Avoid Problems
 The recommended technique for cleaning the soldering iron tip is wiping it on a damp
sponge or brass tip cleaner.
 The purpose of flux in soldering is to prevent oxidation and promote good wetting
 The first step in the soldering procedure is preparing the soldering iron.
 The purpose of preheating the soldering surface or component before soldering is to
speed up the soldering process
 A safety precaution to follow when soldering is to solder in a well-ventilated area or use
a fume extractor.
 The considered three factors to achieve a good solder connection are soldering iron,
solder and good techniques.
 Solder is an alloy of tin and lead

PCB Pattern Designing Using Different Method and PCB Etching

PCB (PRINTED CIRCUIT BOARD) is a baseboard upon which electronic components are mounted
and soldered to form its circuit connection. Its main purpose is to reduce the space and to
troubleshoot easily when problem arises.

PCB Cross Section

1. Substrate consists of thin copper layer which is firmly bonded to an insulting base
materials. This is the side where the electronic components are placed. Substrate side is
also called components side.
 2. Copper - a conductor where the components terminal lead are soldered. Also called solder
side.
A schematic diagram is a fundamental two-dimensional circuit representation showing the
functionality and connectivity between different electrical components
Procedure in Preparing the Layout Diagram in the PCB
1. Prepare the schematic diagram of the circuit.
2. Arrange the component circuit in a graphing paper to show / illustrate the same design factor
in PCB lay outing. Note: Actual size of the component should be adapted for component
arrangement and mounting.
3. Interconnect each component by copying the connection in the schematic diagram.
4. Double check the connection.
5. Trace the designed PCB by using a carbon paper and mark it on the copper side of the clad
board.
6. And use a high point permanent marker for marking. Do the marking three times and be
careful not to shorten each line marking.

PCB ETCHING
The board with laid out design is then submerged to a chemical solution such as ferric chloride
to dissolve the exposed part of PCB. Ferric chloride liquefies the uncovered surfaces of the
design copper clad board that creates PCB. The process is known as etching. Etching is the
process of dissolving a certain materials through chemicals.
Tools and Materials Needed in PCB Etching
1. Designed PCB
2. a bottle of ferric chloride (the quantity of bottle will depend upon the area of the PCB
3. Plastic Basin. It is the medium of ferric chloride
4. Tweezer. It is used for hauling the designed PCB
5. Old newspaper. It is placed under the plastic basin for prevention of accidental spill of
chemical over the table.
6. Apron
7. Piece of cloth
8. Plastic Varnish
9. Lacquer
10. Surgical gloves
11. Utility knife
STEPS IN PCB ETCHING
1. Prepare the necessary tools and materials need in PCB etching.
2. Wear your apron and surgical gloves in order to prevent accidental splash of the
solution on your clothes or on your skin.
3. Pour the ferric chloride in the plastic basic
4. Etch the PCB by immersing it in a basin filled with ferric chloride until the uncovered
part of the copper clad is totally etched.
5. After 10-15 minutes, check the PCB if all the parts needed to be removed are totally
etched (using the tweezer in hauling). If not yet, return it into the plastic basin filled with
ferric chloride. After 3-5 minutes check it again.
6. Haul the PCB from the plastic basin and wash it in a free-flowing water to remove the
remaining residue in the PCB.
7. With a clean and dry piece of cloth, wipe the wet PCB.
 8. Pour a little amount of lacquer thinner on a clean dry piece of clothand wipe the
markings of the permanent marker pen in the copper clad. (Don't forget to wear your
gloves)
9. Aided by bright light, inspect the PCB for possible hairline break or short. If there is a
hairline path between the copper conductors, cut it by a knife or cutter. And if there is a
break between the conductors, solder it.
10. Apply plastic varnish to the newly etched PCB to prevent corrosion or rust and let it dry
before touching it.
 Rinse the PCB with water to remove the etchant should be done after the etching
process in the PCB etching procedure.
 It important to etch the PCB in a well-ventilated area or under a fume hood to minimize
the exposure to harmful fumes
 The correct sequence of steps in the PCB etching process are cleaning, masking, etching,
rinsing.

PCB Drilling
 The purpose of PCB drilling operation is creating holes for vias and through-hole.
 The purpose of marking the locations for drilling on the PCB is to indicate the position
of mounting holes.
 It important to wear safety goggles during the PCB drilling procedure to protect against
eye injuries from flying debris
 The first step in the PCB drilling procedure preparing the drill file.

Printed circuit board drilling is a procedure that involves crafting cavities, electronic circuit
board slots, or holes on an before you mount component.
Basically, there are two kinds of drilling technologies, MECHANICAL AND LASER DRILLING
Mechanical Drilling
This drilling technology is relatively easy to execute. But it has less precision, and it uses drill
bits. The minor hole diameter with this drill is about 0.006” (6 mils).
Laser Drilling
Laser drilling is a non- contact process where the workpiece and the tool do not come in
contact with each other. A laser beam is used to remove board material and create precise
holes. Here, the drill depth can be effortlessly controlled.
Point Angle and Helix Angle
The PCB drills have a point of 130° with a helix angle from 30° to 35°. A point angle is situated at
the top of the drill bit. It is measured between the most prominent edges.
Classification of Holes
The non-plated holes (NPTHs) are non- conductive. These are used to hold the components in
position during the PCB assembly process. The component mounting holes are NPTHS. There is
no tolerance level for these holes since the components won't fit in if the hole size is too small
or large.
The plated holes (PTHS) are the signal- carrying conductive vias that establish interconnection
between the different layers in the circuit board.
Drilling Disaster
 The accuracy of the hole location is compromise.
 Smear resin
 Delamination
 Presence of entry and exit burr.