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Ect201 Solid State Devices, December 2021

This document is an examination paper for the Third Semester B.Tech Degree in Solid State Devices from APJ Abdul Kalam Technological University, dated December 2021. It includes questions divided into two parts: Part A consists of short answer questions, while Part B contains longer questions from various modules related to solid state devices. The exam covers topics such as the law of mass action, quasi Fermi levels, MOSFET characteristics, and various semiconductor principles.

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0% found this document useful (0 votes)
77 views3 pages

Ect201 Solid State Devices, December 2021

This document is an examination paper for the Third Semester B.Tech Degree in Solid State Devices from APJ Abdul Kalam Technological University, dated December 2021. It includes questions divided into two parts: Part A consists of short answer questions, while Part B contains longer questions from various modules related to solid state devices. The exam covers topics such as the law of mass action, quasi Fermi levels, MOSFET characteristics, and various semiconductor principles.

Uploaded by

Vaishnav
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

B 0800ECT201122002 G.

Reg No.: Name:

APJ ABDUL KALAM TECHNOLOGICAL UNIVERS


Third Semester B.Tech Dsgree Examination December 2021(2019

a
{rJi.:;-';1

Course Code: ECT201


Course Name: SOLID STATE DEVICES
Max. Marks: 100 Duration: 3 Hours

PART A
Answer all questions. Each question carries 3 marks Marks
1 State and explain law of mass action. (3)

2 Explain the concept of quasi Fermi level (3)


a
J State and explain the terms in Einstein's relation. (3)

4 Distinguish between drift and diffusion mechanisms. Write the expression (3)
for the corresponding currents
5 Explain Early effect and its impact on collector and base currents. (3)

6 Derive the expression for built in potential of a PN junction diode (3)

7 Draw the energy band diagram of a MOS capacitor at equilibrium, (3)

accumulation and strong inversion condition.


8 Explain the transfer characteristics of a MOSFET. (3)

9 Explain Drain induced barrier lowering? (3)

l0 Draw and label the structure of a FINFET (3)

PART B
Answer any onefull questionfrom each module. Each question carries 14 marks

Module I
Il (a) Define Fermi Dirac distribution function. Explain with relevant figures (10)

Fermi Dirac distribution of carriers in intrinsiCand extrinsic materials.


(b) The Fermi level in a Si sample at 300K is located at 0.3eV below the bottom (4)

of the conduction band. The effective density of states Nc:3.22xl01ecm-3

and Ny:l.83x10lecm-3. Determine (i) the electron and hole concentration at


300K (ii) the intrinsic carrier concentration at 300K
12 (a) An n-type Si sample with Na : 1015 cm-3 is steadily illuminated such that

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0800ECT201122002

gop : 10't EHP/cm3s. If Tn: Tp : lps for this excitation, calculate the
separation in the quasi-Fermi levels, (Een -Erp).
(b) Illustrate the direct and iridirect recombination process of excess carriers in (7)
semiconductors

Module 2
13 (a) Explain Hall effect? Derive the expression for determining carrier (7)
concentration in a semiconductor bar using Hall effect. .

(b) (i) Show that the minimum conductivity of a semiconductor sample occurs (7)

when rlo- : rli]3


-r,l u" fiil What is the expression for the minimum conductivity
o6in? (iii) Calculate o*;,, for Si at 300 K and compare with the intrinsic
conductivity.
rl
14 (a) Derive the expression for drift current density, mobility of carriers and (8)
conductivity of a semiconductor.
(b) A Si sample with 10r5/cm3 donors is uniformly optically excited at room (6)
temperature such that l0le/cm3 electron-hole pairs are generated per second.

Find the separation of the quasi-Fermi levels and the change of conductivity
upon shining the light. Electron and hole lifetimes are both 10 ps. Dp : 12

cm2ls.

Module 3
15 (a) Draw the energy band diagram of a metal N type semiconductor with (e)
I
O* > @s under equilibrium condition and on biasing. Is the contact
rectifying or ohmic. Justify your answer.
(b) Assume that a. p-n-p transistor is doped such that the emitter doping is 20 (5)
times that in the base, the minority carrier mobility in the emitter is one-
fourth that in the base, and the base width is one-tenth the minority carrier
diffusion length. The carrier lifetimes are equal- Calculate o and B for this
transistor.
16 (a) Derive ideal diode equation. (8)
(b) A Schottky barrier diode is formed from n type Si of a doping l0r6cm-3 and (6)
area 10-3cm2. A Si PN junction has the same area and Ne:l0tn.--',
Nu:l016cm-3, rn:ro:lps. (i)Calculate the Schottky barrier diode current at
0.4V and 300K. (ii) Calculate the value of forward bias to obtain same

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0800ECT201122002

crrrent for a PN junction.[R*:ll0A/tr(2, Electron affinity of Si:4.15eV,


metal work function=4.9eV,Diffirsion constant: I 2cm2I sf

Module 4
17 (a) Draw and explain the cv characteristics of a Mos capacitor (g)
(b) For a long channel n-MOSFET with W: lV, calculate the V6 required for
(6)
an lolsat.; of 0.1 mA and Vo(*t.) of 5V. Calculate the small-signal output
- conductance g and the transconductance gm(sat.) at Vp: l0V. Recalculate the
. new Io for Vc - Vr: 3V and Vp : 4V.
18 (a) Draw and explain the drain characteristics and transfer characteristics of a (8)

(. MOSFET.
(b) An Al-gate p-channel MOS transistor is made on an n-tlpe Si substrate with
'!l
N6 : 5xlOtt c*-'. The SiOz thickness is 100 A in the gate region, and the (6)

effective interface charge Qi is 5 x l0r0 q Clcr and the work function


difference between metal and semiconductor is -0.15v. Find w-* , vFB ,
and Vlof the device.

Module 5
lg (a) Distinguish between constant voltage scaling and constant field scaling (8)
(b) Illustrate the operation of FinFET (6)
20 Explain any four short channel effects in MOSFET (14)
'F****

.t

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