Kevin Drucker

Some great commentary about the industry consolidation in generative AI. Worth reading.

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Thanks for hosting me Prakash. Loved discussing how Intel Corporation #TiberEdgePlatform enables Edge AI and operationalizes it for enterprises in brownfield IoT systems.

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As you may already know, you can get notified via Cadence Learning and Support website of recently published content and new or updated releases of Cadence Software. Read this blog to learn more details. https://ow.ly/3xgG50SWqyH

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Learn about how Cadence is breaking ground with Voltus InsightAI. Voltus InsightAI is an AI-driven in-design solution for early prediction of IR problems and automated IR drop closure. https://ow.ly/nAS730sC1sP

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What’s driving enterprise adoption of AI PC’s?  Tune in for this video conversation hosted by Daniel Newman and Patrick Moorhead with AMD’s Jack Huynh, Senior Vice President and GM of Computing and Graphics Group, and Rahul Tikoo, Senior Vice President & GM, Client Business Unit. They're discussing AMD’s leadership in end-to-end AI infrastructure and the exciting announcement of the next-gen processors for the enterprise, the Ryzen AI PRO 300 series. Watch the video below at Six Five Media, and be sure to subscribe to our YouTube channel so you never miss an episode. #TheFuturumGroup

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Qualcomm Incorporated (NASDAQ: QCOM) announced results for its fiscal third quarter (FY Q3) ended June 23, 2024, with revenues of $9.4 billion for the quarter (up 11% year-over-year / +30% EBT), net income of $2.1B (up 18% year-over-year) and GAAP EPS of $1.88 (non-GAAP EPS of $2.33). The company also reported 87% YoY growth in Revenues from QCT automotive segment and 12% YoY growth from its QCT handset business. Another strong quarter from Qualcomm despite strong competition from semiconductor rivals, the high likelihood of price hikes by chip manufacturers, and a softening of EV demand growth in the US market. Read more in this research piece by Olivier Blanchard from the Futurum Group 👇 #TheFuturumGroup

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https://lnkd.in/gQCqYbiR Samsung opens path to chase TSMC for 3nm foundry collaboration with AMD. As Lisa Su, CEO of AMD, hinted in her keynote speech at ITF World 2024 that the company plans to adopt Samsung's 3nm for its next-generation products. #samsungelectronics #amd #Semiconductorindustry #electronics #semiconductor #technology #innovation #business #supplychain #engineering #manufacturing #computerchips #semiconductors #chips #chipmaker #foundry credit: business korea

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Micron Technology announces 12-high HBM3E Memory, bringing 36 GB capacity and 1.2 TB/s bandwidth. As AI workloads continue to evolve and expand, memory bandwidth and capacity are increasingly critical for system performance. The latest GPUs in the industry need the highest performance high bandwidth memory (HBM), significant memory capacity, as well as improved power efficiency. Micron HBM3E 12-high boasts an impressive 36 GB capacity, a 50% increase over current HBM3E 8-high offerings, allowing larger AI models like Llama 2 with 70 billion parameters to run on a single processor. Looking forward to significant AI innovations as Micron HBM3E gains industry adoption in coming months. https://lnkd.in/g_mnkM3b

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AMD continues its trend of growth acquisitions today with the announcement that it reached an agreement with ZT Systems to acquire the infrastructure giant for $4.9B. As AMD expands into the AI data center market, both with the $4.5B forecasted annual revenue for Instinct GPUs and grabbing up software companies like Silo AI, a logical next step is the purchase of ZT. ZT is one of the biggest players in design and manufacturing for hyperscaler infrastructure and will give AMD a new set of technical expertise and the ability to design full systems across thermal, mechanical, network, and power, WITH the chips and IP it already owns. Though apparently not going as far as selling branded servers (like DGX from NVIDIA), AMD will now be able to design custom, complete solutions for big-time buyers and likely create some holistic, white box solutions that are “ready to run.” This is a great move by AMD and another feather in Lisa Su cap as the right move at the right time.

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NVIDIA's new private 5G network at their Santa Clara HQ is a great step forward for 5G Standalone (5G SA) implementation and evolution. While large carriers have hesitated to lean into 5G SA, innovators like NVIDIA, building the underlying technology and initial test beds, create the momentum needed to make these next-level investments and cultivate the new revenues long promised by 5G. Increasingly, as NVIDIA and other ORAN platforms reach scale, telecoms will have to rethink where such investments and workloads are hosted as they move more and more to metro-aggregated, multi-tenant facilities like data centers to achieve the best cost efficiencies and meet the latency demands that will come with 5G SA applications. And best of all, it will lead to the thaw sorely needed for the current 5G winter. #5G #NVIDIA #ORAN #telecom #datacenter https://lnkd.in/gDYdbfnN

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OpenAI’s Big Move into Custom AI Chips with Broadcom and TSMC OpenAI has partnered with Broadcom and TSMC to build its first in-house AI chip, aiming to secure a reliable supply chain while reducing its dependency on Nvidia. Here’s why this shift is pivotal: 🔹 Diversified Supply Chain: OpenAI originally considered building its own chip foundries but opted for a partnership approach with Broadcom and TSMC, allowing a faster and more cost-effective solution. 🔹 Optimized for Inference: Unlike traditional GPUs, OpenAI’s custom chip will be optimized for inference, crucial for quick and efficient AI predictions as applications scale. 🔹 Strategic Move in AI Hardware: This project aligns with trends from other tech giants like Google and Amazon, using both in-house and external resources to boost hardware capabilities. Read more here: https://lnkd.in/gtBqavnp #OpenAI #AI #Broadcom #TSMC #Nvidia #TechInnovation #ArtificialIntelligence

Ampere Computing has unveiled its roadmap for the coming years, which includes collaborations with third parties and new CPUs. The company is set to launch its all-new 256-core AmpereOne processor next year, made on TSMC's N3 process technology. Ampere is teaming up with Qualcomm to build AI inference servers with the company's accelerators. Ampere has already begun shipping 192-core AmpereOne processors, with an eight-channel DDR5 memory subsystem that was introduced a year ago. Later this year, the company plans to introduce 192-core AmpereOne CPUs with a 12-channel DDR5 memory subsystem, requiring a brand-new platform. Next year, the company will use this platform for its 256-core AmpereOne CPU, which will be made using one of TSMC's N3 fabrication processes. While the company has not disclosed whether the new processor will also feature a new microarchitecture, it will continue to feature 2 MB of L2 cache per core. Ampere's 256-core CPU will use the same cooling system as its existing offerings, which implies that its thermal design power will remain in the 350-watt ballpark. While the company's capabilities for AI are currently limited, it has teamed up with Qualcomm to build platforms for LLM inferencing based on Ampere's CPUs and Qualcomm's Cloud AI 100 Ultra accelerators. It remains to be seen when the platform will be ready, but this collaboration demonstrates that Ampere's ambitions do not end with general-purpose computing. With the launch of its new CPUs and collaborations with third parties, Ampere Computing is certainly a company to watch in the coming years. #amperecomputing #qualcomm #cpus #processors #hardware #computerhardware #ai #llms #cloudai #servers #chips #chipmaker #semiconductors #semiconductorindustry #semiconductormanufacturing #innovation #technology #technologynews

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The technology world seems to be more engaged and prepared for new AI model releases than just a few months ago. With Meta releasing the Llama 3 model just today, I've seen performance results and readiness for platforms from Intel Corporation and Qualcomm. AMD highlighted its partnership, but hasn't showed specifics as yet. Intel has the most robust testing so far, showing results on Gaudi 2, Xeon, Core Ultra integrated graphics and Arc A770 discrete GPU: https://lnkd.in/gjB85SgQ Snapdragon says that tools "will be available" to run Llama 3 on its platforms, just not posted on their AI Hub yet: https://lnkd.in/gEqCfbqn

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Micron Develops Industry’s First PCIe Gen6 Data Center SSD for Ecosystem Enablement Micron’s FMS 2024 presence highlights its AI product leadership in memory and storage from the data center to edge devices FMS: The Future of Memory and Storage — Micron Technology, Inc. today announced it is the first to develop PCIe® Gen6 data center SSD technology for ecosystem enablement as part of a portfolio of memory and storage products to support the broad demand for AI. Addressing these demands, Raj Narasimhan, senior vice president and general manager of Micron’s Compute and Networking Business Unit, will present a keynote at FMS titled, “Data is at the heart of AI: Micron memory and storage are fueling the AI revolution,” on Wednesday, Aug. 7, at 11:00 a.m. Pacific time. The session will focus on how Micron’s industry-leading products are impacting AI system architectures while enabling faster and more power-efficient solutions to manage vast data sets. https://lnkd.in/gpEUrSY6

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Semiconductor Engineering sat down to talk about using AI for designing and testing complex chips with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta; David Pan, professor in the Department of Electrical and Computer Engineering at the University of Texas at Austin. What follows are excerpts of that conversation, which were held in front of a live audience at DesignCon.

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