Data Sheet: Universal LCD Driver For Low Multiplex Rates

INTEGRATED CIRCUITS
DATA SHEET
PCF8576
Universal LCD driver for low
multiplex rates
Product specification 2001 Oct 02
Supersedes data of 1998 Feb 06
File under Integrated Circuits, IC12
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates PCF8576
CONTENTS 8 LIMITING VALUES

9 HANDLING
1 FEATURES
10 DC CHARACTERISTICS
2 GENERAL DESCRIPTION
11 AC CHARACTERISTICS
3 ORDERING INFORMATION
11.1 Typical supply current characteristics
4 BLOCK DIAGRAM
11.2 Typical characteristics of LCD outputs
5 PINNING
12 APPLICATION INFORMATION
6 FUNCTIONAL DESCRIPTION
12.1 Chip-on-glass cascadability in single plane
6.1 Power-on reset
13 BONDING PAD INFORMATION
6.2 LCD bias generator
6.3 LCD voltage selector 14 TRAY INFORMATION: PCF8576U
6.4 LCD drive mode waveforms 15 TRAY INFORMATION: PCF8576U/2
6.5 Oscillator 16 PACKAGE OUTLINES
6.5.1 Internal clock
6.5.2 External clock 17 SOLDERING
6.6 Timing 17.1 Introduction to soldering surface mount
6.7 Display latch packages
6.8 Shift register 17.2 Reflow soldering
6.9 Segment outputs 17.3 Wave soldering
6.10 Backplane outputs 17.4 Manual soldering
6.11 Display RAM 17.5 Suitability of surface mount IC packages for
6.12 Data pointer wave and reflow soldering methods
6.13 Subaddress counter 18 DATA SHEET STATUS
6.14 Output bank selector
19 DEFINITIONS
6.15 Input bank selector
6.16 Blinker 20 DISCLAIMERS
7 CHARACTERISTICS OF THE I2C-BUS 21 PURCHASE OF PHILIPS I2C COMPONENTS
7.1 Bit transfer (see Fig.12)
7.2 START and STOP conditions (see Fig.13)
7.3 System configuration (see Fig.14)
7.4 Acknowledge (see Fig.15)
7.5 PCF8576 I2C-bus controller
7.6 Input filters
7.7 I2C-bus protocol
7.8 Command decoder
7.9 Display controller
7.10 Cascaded operation
2001 Oct 02 2
1 FEATURES
• Single-chip LCD controller/driver
• Selectable backplane drive configuration: static or 2/3/4
backplane multiplexing
• Selectable display bias configuration: static, 1⁄2 or 1⁄3
• Internal LCD bias generation with voltage-follower • May be cascaded for large LCD applications (up to
buffers 2560 segments possible)
• 40 segment drives: up to twenty 8-segment numeric • Cascadable with 24-segment LCD driver PCF8566
characters; up to ten 15-segment alphanumeric
• Optimized pinning for plane wiring in both single and
characters; or any graphics of up to 160 elements
multiple PCF8576 applications
• 40 × 4-bit RAM for display data storage
• Space-saving 56-lead plastic very small outline package
• Auto-incremented display data loading across device (VSO56)
subaddress boundaries
• Very low external component count (at most one
• Display memory bank switching in static and duplex resistor, even in multiple device applications)
drive modes
• Compatible with chip-on-glass technology
• Versatile blinking modes
• Manufactured in silicon gate CMOS process.
• LCD and logic supplies may be separated
• Wide power supply range: from 2 V for low-threshold 2 GENERAL DESCRIPTION
LCDs and up to 9 V for guest-host LCDs and
high-threshold (automobile) twisted nematic LCDs The PCF8576 is a peripheral device which interfaces to
almost any Liquid Crystal Display (LCD) with low multiplex
• Low power consumption
rates. It generates the drive signals for any static or
• Power-saving mode for extremely low power multiplexed LCD containing up to four backplanes and up
consumption in battery-operated and telephone to 40 segments and can easily be cascaded for larger LCD
applications applications. The PCF8576 is compatible with most
• I2C-bus interface microprocessors/microcontrollers and communicates via a
• TTL/CMOS compatible two-line bidirectional I2C-bus. Communication overheads
are minimized by a display RAM with auto-incremented
• Compatible with any 4-bit, 8-bit or 16-bit
addressing, by hardware subaddressing and by display
microprocessors/microcontrollers
memory switching (static and duplex drive modes).
3 ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
PCF8576T VSO56 plastic very small outline package; 56 leads SOT190-1
PCF8576U − chip in tray −
PCF8576U/2 − chip with bumps in tray −
PCF8576U/5 − unsawn wafer −
PCF8576U/10 FFC chip on film frame carrier (FFC) −
PCF8576U/12 FFC chip with bumps on film frame carrier (FFC) −
2001 Oct 02 3
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2001 Oct 02
Philips Semiconductors
Universal LCD driver for low multiplex rates
BLOCK DIAGRAM
BP0 BP2 BP1 BP3 S0 to S39
40
13 14 15 16 17 to 56
5
VDD BACKPLANE
DISPLAY SEGMENT OUTPUTS
OUTPUTS
R
LCD DISPLAY LATCH

R VOLTAGE
SELECTOR
R LCD BIAS SHIFT REGISTER

12 GENERATOR
VLCD
PCF8576
4
4
CLK INPUT DISPLAY OUTPUT
3 TIMING BLINKER BANK RAM BANK
SYNC SELECTOR 40 x 4 BITS SELECTOR
DISPLAY
CONTROLLER
6
OSC OSCILLATOR POWER-
DATA
ON
POINTER
RESET
11 COMMAND
V SS DECODER
2 SUB-
SCL INPUT I 2C - BUS ADDRESS
1 FILTERS CONTROLLER COUNTER
SDA
10 7 8 9
Product specification
SA0 A0 A1 A2
MBK276
PCF8576
handbook, full pagewidth
Fig.1 Block diagram (for VSO56 package; SOT190-1).

5 PINNING
SYMBOL PIN DESCRIPTION

SDA 1 I2C-bus serial data input/output
SCL 2 I2C-bus serial clock input
SYNC 3 cascade synchronization input/output
CLK 4 external clock input/output
VDD 5 supply voltage
OSC 6 oscillator input
A0 to A2 7 to 9 I2C-bus subaddress inputs
SA0 10 I2C-bus slave address input; bit 0
VSS 11 logic ground
VLCD 12 LCD supply voltage
BP0, BP2, BP1 and BP3 13 to 16 LCD backplane outputs
S0 to S39 17 to 56 LCD segment outputs
2001 Oct 02 5
handbook, halfpage
SDA 1 56 S39
SCL 2 55 S38
SYNC 3 54 S37
CLK 4 53 S36
VDD 5 52 S35
OSC 6 51 S34
A0 7 50 S33
A1 8 49 S32
A2 9 48 S31
SA0 10 47 S30
VSS 11 46 S29
VLCD 12 45 S28
BP0 13 44 S27
BP2 14 43 S26
PCF8576T
BP1 15 42 S25
BP3 16 41 S24
S0 17 40 S23
S1 18 39 S22
S2 19 38 S21
S3 20 37 S20
S4 21 36 S19
S5 22 35 S18
S6 23 34 S17
S7 24 33 S16
S8 25 32 S15
S9 26 31 S14
S10 27 30 S13
S11 28 29 S12
MBK278
Fig.2 Pin configuration; SOT190-1.
2001 Oct 02 6
6 FUNCTIONAL DESCRIPTION The host microprocessor/microcontroller maintains the

2-line I2C-bus communication channel with the PCF8576.
The PCF8576 is a versatile peripheral device designed to
The internal oscillator is selected by connecting pin OSC
interface to any microprocessor/microcontroller to a wide
to pin VSS. The appropriate biasing voltages for the
variety of LCDs. It can directly drive any static or
multiplexed LCD waveforms are generated internally. The
multiplexed LCD containing up to four backplanes and up
only other connections required to complete the system
to 40 segments. The display configurations possible with
are to the power supplies (VDD, VSS and VLCD) and the
the PCF8576 depend on the number of active backplane
LCD panel chosen for the application.
outputs required; a selection of display configurations is
given in Table .
All of the display configurations given in Table can be
implemented in the typical system shown in Fig.3.
Selection of display configurations

14-SEGMENTS
NUMBER OF 7-SEGMENTS NUMERIC
ALPHANUMERIC
DOT MATRIX
INDICATOR INDICATOR
BACKPLANES SEGMENTS DIGITS CHARACTERS
SYMBOLS SYMBOLS
4 160 20 20 10 20 160 dots (4 × 40)
3 120 15 15 8 8 120 dots (3 × 40)
2 80 10 10 5 10 80 dots (2 × 40)
1 40 5 5 2 12 40 dots (1 × 40)
handbook, full pagewidth V

DD tr
R
2CB V V
DD LCD
5 12
HOST SDA
1 17 to 56 40 segment drives LCD PANEL
MICRO-
SCL
PROCESSOR/ 2 PCF8576 (up to 160
MICRO- elements)
OSC
CONTROLLER 6 13 to 16 4 backplanes
7 8 9 10 11
ROSC A0 A1 A2 SA0 V MBK277
SS
V
SS
Fig.3 Typical system configuration.
2001 Oct 02 7
6.1 Power-on reset 6.3 LCD voltage selector

At power-on the PCF8576 resets to a starting condition as The LCD voltage selector co-ordinates the multiplexing of
follows: the LCD in accordance with the selected LCD drive
1. All backplane outputs are set to VDD. configuration. The operation of the voltage selector is
controlled by MODE SET commands from the command
2. All segment outputs are set to VDD. decoder. The biasing configurations that apply to the
3. The drive mode ‘1 : 4 multiplex with 1⁄3bias’ is selected. preferred modes of operation, together with the biasing
4. Blinking is switched off. characteristics as functions of Vop = VDD − VLCD and the
resulting discrimination ratios (D), are given in Table 1.
5. Input and output bank selectors are reset (as defined
in Table 4). A practical value for Vop is determined by equating Voff(rms)
6. The I2C-bus interface is initialized. with a defined LCD threshold voltage (Vth), typically when
the LCD exhibits approximately 10% contrast. In the static
7. The data pointer and the subaddress counter are
drive mode a suitable choice is Vop > 3Vth approximately.
cleared.
Multiplex drive ratios of 1 : 3 and 1 : 4 with 1⁄2bias are
Data transfers on the I2C-bus should be avoided for 1 ms
possible but the discrimination and hence the contrast
following power-on to allow completion of the reset action.
ratios are smaller ( 3 = 1.732 for 1 : 3 multiplex or
6.2 LCD bias generator
21
---------- = 1.528 for 1 : 4 multiplex).
The full-scale LCD voltage (Vop) is obtained from 3
VDD − VLCD. The LCD voltage may be temperature The advantage of these modes is a reduction of the LCD
compensated externally through the VLCD supply to pin 12. full-scale voltage Vop as follows:
Fractional LCD biasing voltages are obtained from an
• 1 : 3 multiplex (1⁄2bias):
internal voltage divider of the three series resistors
connected between VDD and VLCD. The centre resistor can Vop = 6 × V off 〈 rms〉 = 2.449 Voff(rms)
be switched out of the circuit to provide a 1⁄2bias voltage
level for the 1 : 2 multiplex configuration. • 1 : 4 multiplex (1⁄2bias):
Vop = (4 × 3) = 2.309 Voff(rms)

----------------------
3
These compare with Vop = 3 Voff(rms) when 1⁄3bias is used.
Table 1 Preferred LCD drive modes: summary of characteristics
NUMBER OF LCD BIAS V off(rms) V on(rms) V on(rms)

LCD DRIVE MODE --------------------- --------------------- D = ---------------------
BACKPLANES LEVELS CONFIGURATION V op V op V off(rms)
static 1 2 static 0 1 ∞
1:2 2 3 1⁄ 0.354 0.791 2.236
2
1:2 2 4 1⁄ 0.333 0.745 2.236
3
1:3 3 4 1⁄ 0.333 0.638 1.915
3
1:4 4 4 1⁄ 0.333 0.577 1.732
3
2001 Oct 02 8
6.4 LCD drive mode waveforms When three backplanes are provided in the LCD, the 1 : 3
multiplex drive mode applies, as shown in Fig.7.
The static LCD drive mode is used when a single
backplane is provided in the LCD. Backplane and segment When four backplanes are provided in the LCD, the 1 : 4
drive waveforms for this mode are shown in Fig.4. multiplex drive mode applies, as shown in Fig.8.
When two backplanes are provided in the LCD, the 1 : 2
multiplex mode applies. The PCF8576 allows use of
1⁄ bias or 1⁄ bias in this mode as shown in Figs 5 and 6.
2 3
T frame
V DD LCD segments
BP0
V LCD
state 1 state 2
V DD (on) (off)
Sn
V LCD
VDD
Sn 1
V LCD
(a) waveforms at driver
V op
state 1 0
Vop
V op
state 2 0
Vop
(b) resultant waveforms
at LCD segment MBE539
V state1(t) = V S (t) – V BP0(t)

n
V on(rms) = V op

n+1
V off(rms) = 0 V
Fig.4 Static drive mode waveforms (Vop = VDD − VLCD).
2001 Oct 02 9
T frame
VDD LCD segments

BP0 (VDD V LCD )/2
V LCD
state 1
VDD state 2
BP1 (VDD V LCD )/2
V LCD
VDD
Sn
V LCD
VDD
Sn 1
V LCD
Vop
V op /2
state 1 0
V op /2
Vop
Vop
V op /2
state 2 0
V op /2
Vop
(b) resultant waveforms MBE540
at LCD segment

n
V on(rms) = 0.791V op

n
V off(rms) = 0.354V op
Fig.5 Waveforms for the 1 : 2 multiplex drive mode with 1⁄2bias (Vop = VDD − VLCD).
2001 Oct 02 10
T frame
VDD
LCD segments
V DD Vop /3
BP0
VDD 2Vop /3
VLCD
state 1
VDD
state 2
V DD Vop /3
BP1
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn 1
VDD 2Vop /3
VLCD
Vop
2Vop /3
Vop /3
state 1 0
Vop /3
2Vop /3
Vop
Vop
2Vop /3
Vop /3
state 2 0
Vop /3
2Vop /3
Vop
(b) resultant waveforms MBE541
at LCD segment

n

n
Fig.6 Waveforms for the 1 : 2 multiplex drive mode with 1⁄3bias (Vop = VDD − VLCD).
2001 Oct 02 11
T frame
VDD
LCD segments
V DD Vop /3
BP0
VDD 2Vop /3
VLCD
state 1
VDD
state 2
V DD Vop /3
BP1
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
BP2/S23
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn 1
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn 2
VDD 2Vop /3
VLCD
Vop
2V op /3
Vop /3
state 1 0
Vop /3
2V op /3
Vop
Vop
2V op /3
Vop /3
state 2 0
Vop /3
2V op /3
Vop
(b) resultant waveforms

n

n
Fig.7 Waveforms for the 1 : 3 multiplex drive mode (Vop = VDD − VLCD).
2001 Oct 02 12
T frame
VDD LCD segments
V DD Vop /3
BP0
VDD 2Vop /3
VLCD
state 1
VDD
state 2
V DD Vop /3
BP1
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
BP2
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
BP3
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn 1
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn 2
VDD 2Vop /3
VLCD
VDD
V DD Vop /3
Sn 3
VDD 2Vop /3
VLCD
Vop
2Vop /3
V op /3
state 1 0
V op /3
2Vop /3
Vop
Vop
2Vop /3
V op /3
state 2 0 V state1(t) = V S (t) – V BP0(t)
n
V op /3
2Vop /3 V on(rms) = 0.577V op
Vop
(b) resultant waveforms V state2(t) = V S (t) – V BP1(t)
n
Fig.8 Waveforms for the 1 : 4 multiplex drive mode (Vop = VDD − VLCD).
2001 Oct 02 13
6.5 Oscillator 6.6 Timing

6.5.1 INTERNAL CLOCK The timing of the PCF8576 organizes the internal data flow
of the device. This includes the transfer of display data
The internal logic and the LCD drive signals of the
from the display RAM to the display segment outputs. In
PCF8576 are timed either by the internal oscillator or from
cascaded applications, the synchronization signal SYNC
an external clock. When the internal oscillator is used,
maintains the correct timing relationship between the
pin OSC should be connected to pin VSS. In this event, the
PCF8576s in the system. The timing also generates the
output from pin CLK provides the clock signal for
LCD frame frequency which it derives as an integer
cascaded PCF8566s in the system.
multiple of the clock frequency (see Table 2). The frame
Where resistor Rosc to VSS is present, the internal oscillator frequency is set by the MODE SET commands when
is selected. The relationship between the oscillator internal clock is used, or by the frequency applied to
frequency on pin CLK (fclk) and Rosc is shown in Fig.9. pin CLK when external clock is used.
The ratio between the clock frequency and the LCD frame
frequency depends on the mode in which the device is
operating. In the power-saving mode the reduction ratio is
MBE531
10 3 six times smaller; this allows the clock frequency to be
reduced by a factor of six. The reduced clock frequency
f results in a significant reduction in power dissipation. The
clk
(kHz) lower clock frequency has the disadvantage of increasing
the response time when large amounts of display data are
transmitted on the I2C-bus.
max When a device is unable to digest a display data byte
102
before the next one arrives, it holds the SCL line LOW until
the first display data byte is stored. This slows down the
transmission rate of the I2C-bus but no data loss occurs.
min
Table 2 LCD frame frequencies

NOMINAL
10 FRAME FRAME
10 2 103 R osc (kΩ) 10 4 PCF8576 MODE
FREQUENCY FREQUENCY
(Hz)
 3.4 × 10 7
f clk ≈  ------------------------ ( kHz ) f clk
 R osc  Normal mode ------------- 64
2880
f clk
Fig.9 Oscillator frequency as a function of Rosc. Power-saving mode ---------- 64
480
6.5.2 EXTERNAL CLOCK 6.7 Display latch

The condition for external clock is made by connecting The display latch holds the display data while the
pin OSC to pin VDD; pin CLK then becomes the external corresponding multiplex signals are generated. There is a
clock input. one-to-one relationship between the data in the display
latch, the LCD segment outputs and one column of the
The clock frequency (fclk) determines the LCD frame
display RAM.
frequency and the maximum rate for data reception from
the I2C-bus. To allow I2C-bus transmissions at their
6.8 Shift register
maximum data rate of 100 kHz, fclk should be chosen to be
above 125 kHz. The shift register serves to transfer display information
from the display RAM to the display latch while previous
A clock signal must always be supplied to the device;
data is displayed.
removing the clock may freeze the LCD in a DC state.
2001 Oct 02 14
6.9 Segment outputs correspondence between the RAM addresses and the
segment outputs, and between the individual bits of a RAM
The LCD drive section includes 40 segment outputs
word and the backplane outputs. The first RAM column
pins S0 to S39 which should be connected directly to the
corresponds to the 40 segments operated with respect to
LCD. The segment output signals are generated in
backplane BP0 (see Fig.10). In multiplexed LCD
accordance with the multiplexed backplane signals and
applications the segment data of the second, third and
with data resident in the display latch. When less than
fourth column of the display RAM are time-multiplexed
40 segment outputs are required the unused segment
with BP1, BP2 and BP3 respectively.
outputs should be left open-circuit.
When display data is transmitted to the PCF8576 the
6.10 Backplane outputs display bytes received are stored in the display RAM in
accordance with the selected LCD drive mode. To
The LCD drive section includes four backplane outputs
illustrate the filling order, an example of a 7-segment
BP0 to BP3 which should be connected directly to the
numeric display showing all drive modes is given in Fig.11;
LCD. The backplane output signals are generated in
the RAM filling organization depicted applies equally to
accordance with the selected LCD drive mode. If less than
other LCD types.
four backplane outputs are required the unused outputs
can be left open-circuit. In the 1 : 3 multiplex drive mode With reference to Fig.11, in the static drive mode the eight
BP3 carries the same signal as BP1, therefore these two transmitted data bits are placed in bit 0 of eight successive
adjacent outputs can be connected together to give display RAM addresses. In the 1 : 2 multiplex drive mode
enhanced drive capabilities. In the 1 : 2 multiplex drive the eight transmitted data bits are placed in bits 0 and 1 of
mode BP0 and BP2, BP1 and BP3 respectively carry the four successive display RAM addresses. In the 1 : 3
same signals and may also be paired to increase the drive multiplex drive mode these bits are placed in
capabilities. In the static drive mode the same signal is bits 0, 1 and 2 of three successive addresses, with bit 2 of
carried by all four backplane outputs and they can be the third address left unchanged. This last bit may, if
connected in parallel for very high drive requirements. necessary, be controlled by an additional transfer to this
address but care should be taken to avoid overriding
6.11 Display RAM adjacent data because full bytes are always transmitted. In
the 1 : 4 multiplex drive mode the eight transmitted data
The display RAM is a static 40 × 4-bit RAM which stores
bits are placed in bits 0, 1, 2 and 3 of two successive
LCD data. A logic 1 in the RAM bit-map indicates the on
display RAM addresses.
state of the corresponding LCD segment; similarly, a
logic 0 indicates the off state. There is a one-to-one
display RAM addresses (rows) / segment outputs (S)
0 1 2 3 4 35 36 37 38 39
0
display RAM bits
(columns) / 1
backplane outputs
(BP) 2
MBE525
Fig.10 Display RAM bit-map showing direct relationship between display RAM addresses and segment outputs,
and between bits in a RAM word and backplane outputs.
2001 Oct 02 15
6.12 Data pointer 6.14 Output bank selector

The addressing mechanism for the display RAM is This selects one of the four bits per display RAM address
realized using the data pointer. This allows the loading of for transfer to the display latch. The actual bit chosen
an individual display data byte, or a series of display data depends on the particular LCD drive mode in operation
bytes, into any location of the display RAM. The sequence and on the instant in the multiplex sequence. In 1 : 4
commences with the initialization of the data pointer by the multiplex, all RAM addresses of bit 0 are the first to be
LOAD DATA POINTER command. Following this, an selected, these are followed by the contents of bit 1, bit 2
arriving data byte is stored starting at the display RAM and then bit 3. Similarly in 1 : 3 multiplex, bits 0, 1 and 2
address indicated by the data pointer thereby observing are selected sequentially. In 1 : 2 multiplex, bits 0 and 1
the filling order shown in Fig.11. The data pointer is are selected and, in the static mode, bit 0 is selected.
automatically incremented in accordance with the chosen
The PCF8576 includes a RAM bank switching feature in
LCD configuration. That is, after each byte is stored, the
the static and 1 : 2 multiplex drive modes. In the static
contents of the data pointer are incremented by eight
drive mode, the BANK SELECT command may request
(static drive mode), by four (1 : 2 multiplex drive mode) or
the contents of bit 2 to be selected for display instead of
by two (1 : 4 multiplex drive mode).
bit 0 contents. In the 1 : 2 drive mode, the contents of
bits 2 and 3 may be selected instead of bits 0 and 1. This
6.13 Subaddress counter
gives the provision for preparing display information in an
The storage of display data is conditioned by the contents alternative bank and to be able to switch to it once it is
of the subaddress counter. Storage is allowed to take assembled.
place only when the contents of the subaddress counter
agree with the hardware subaddress applied to A0, A1 6.15 Input bank selector
and A2. The subaddress counter value is defined by the
The input bank selector loads display data into the display
DEVICE SELECT command. If the contents of the
RAM in accordance with the selected LCD drive
subaddress counter and the hardware subaddress do not
configuration. Display data can be loaded in bit 2 in static
agree then data storage is inhibited but the data pointer is
drive mode or in bits 2 and 3 in 1 : 2 drive mode by using
incremented as if data storage had taken place. The
the BANK SELECT command. The input bank selector
subaddress counter is also incremented when the data
functions independent of the output bank selector.
pointer overflows.
The storage arrangements described lead to extremely
efficient data loading in cascaded applications. When a
series of display bytes are sent to the display RAM,
automatic wrap-over to the next PCF8576 occurs when
the last RAM address is exceeded. Subaddressing across
device boundaries is successful even if the change to the
next device in the cascade occurs within a transmitted
character (such as during the 14th display data byte
transmitted in 1 : 3 multiplex mode).
2001 Oct 02 16
6.16 Blinker bank selector, the displayed RAM banks are exchanged
with alternate RAM banks at the blinking frequency. This
The display blinking capabilities of the PCF8576 are very
mode can also be specified by the BLINK command.
versatile. The whole display can be blinked at frequencies
selected by the BLINK command. The blinking frequencies In the 1 : 3 and 1 : 4 multiplex modes, where no alternate
are integer multiples of the clock frequency; the ratios RAM bank is available, groups of LCD segments can be
between the clock and blinking frequencies depend on the blinked by selectively changing the display RAM data at
mode in which the device is operating, as shown in fixed time intervals.
Table 3.
If the entire display is to be blinked at a frequency other
An additional feature is for an arbitrary selection of LCD than the nominal blinking frequency, this can be effectively
segments to be blinked. This applies to the static and performed by resetting and setting the display enable bit E
1 : 2 LCD drive modes and can be implemented without at the required rate using the MODE SET command.
any communication overheads. By means of the output
Table 3 Blinking frequencies

NORMAL OPERATING POWER-SAVING MODE NOMINAL BLINKING
BLINKING MODE
MODE RATIO RATIO FREQUENCY
Off − − blinking off
f clk f clk
2 Hz ---------------- ---------------- 2 Hz
92160 15360
f clk f clk
1 Hz -------------------- ---------------- 1 Hz
184320 30720
f clk f clk
0.5 Hz -------------------- ---------------- 0.5 Hz
368640 61440
2001 Oct 02 17
2001 Oct 02
drive mode LCD segments LCD backplanes display RAM filling order transmitted display byte
a
Sn 2 n n 1 n 2 n 3 n 4 n 5 n 6 n 7
b BP0
f Sn 1
Sn 3 MSB LSB
Sn 4 g bit/ 0 c b a f g e d DP
Sn
BP 1 x x x x x x x x c b a f g e d DP
static e Sn 7
Sn 5 c 2 x x x x x x x x
d DP 3 x x x x x x x x
Sn 6
BP0
Sn a n n 1 n 2 n 3
b
1:2 Sn 1 f
MSB LSB
bit/ 0 a f e d
g
BP 1 b g c DP
BP1 a b f g e c d DP
multiplex Sn 2 e
c 2 x x x x
3 x x x x
d DP
Sn 3
18
BP0
Sn 1 a n n 1 n 2
b Sn
1:3 Sn 2 f
bit/ 0 b a f MSB LSB
g
BP 1 DP d e
BP1 BP2 b DP c a d g f e
multiplex e
c
2 c g x
3 x x x
d DP
Sn
a n n 1
b BP2
1:4 f BP0
bit/ 0 a f
g MSB LSB
BP 1 c e
multiplex e BP1 BP3
2 b g a c b DP f e g d
c
3 DP d
Sn 1 d DP
MBK389
PCF8576
x = data bit unchanged.
Fig.11 Relationships between LCD layout, drive mode, display RAM filling order and display data transmitted over the I2C-bus.
7 CHARACTERISTICS OF THE I2C-BUS 7.5 PCF8576 I2C-bus controller

The I2C-bus is for bidirectional, two-line communication The PCF8576 acts as an I2C-bus slave receiver. It does
between different ICs or modules. The two lines are a not initiate I2C-bus transfers or transmit data to an I2C-bus
serial data line (SDA) and a serial clock line (SCL). Both master receiver. The only data output from the PCF8576
lines must be connected to a positive supply via a pull-up are the acknowledge signals of the selected devices.
resistor when connected to the output stages of a device. Device selection depends on the I2C-bus slave address,
Data transfer may be initiated only when the bus is not on the transferred command data and on the hardware
busy. subaddress.
In single device application, the hardware subaddress
7.1 Bit transfer (see Fig.12)
inputs A0, A1 and A2 are normally connected to VSS which
One data bit is transferred during each clock pulse. The defines the hardware subaddress 0. In multiple device
data on the SDA line must remain stable during the HIGH applications A0, A1 and A2 are connected to VSS or VDD in
period of the clock pulse as changes in the data line at this accordance with a binary coding scheme such that no two
time will be interpreted as a control signal. devices with a common I2C-bus slave address have the
same hardware subaddress.
7.2 START and STOP conditions (see Fig.13)
In the power-saving mode it is possible that the PCF8576
Both data and clock lines remain HIGH when the bus is not is not able to keep up with the highest transmission rates
busy. A HIGH-to-LOW transition of the data line, while the when large amounts of display data are transmitted. If this
clock is HIGH is defined as the START condition (S). A situation occurs, the PCF8576 forces the SCL line to LOW
LOW-to-HIGH transition of the data line while the clock is until its internal operations are completed. This is known
HIGH is defined as the STOP condition (P). as the ‘clock synchronization feature’ of the I2C-bus and
serves to slow down fast transmitters. Data loss does not
7.3 System configuration (see Fig.14) occur.
A device generating a message is a ‘transmitter’, a device
7.6 Input filters
receiving a message is the ‘receiver’. The device that
controls the message is the ‘master’ and the devices which To enhance noise immunity in electrically adverse
are controlled by the master are the ‘slaves’. environments, RC low-pass filters are provided on the
SDA and SCL lines.
7.4 Acknowledge (see Fig.15)
The number of data bytes transferred between the START 7.7 I2C-bus protocol
and STOP conditions from transmitter to receiver is Two I2C-bus slave addresses (0111000 and 0111001) are
unlimited. Each byte of eight bits is followed by an reserved for the PCF8576. The least significant bit of the
acknowledge bit. The acknowledge bit is a HIGH level slave address that a PCF8576 will respond to is defined by
signal put on the bus by the transmitter during which time the level connected at its input pin SA0. Therefore, two
the master generates an extra acknowledge related clock types of PCF8576 can be distinguished on the same
pulse. A slave receiver which is addressed must generate I2C-bus which allows:
an acknowledge after the reception of each byte. Also a
• Up to 16 PCF8576s on the same I2C-bus for very large
master receiver must generate an acknowledge after the
LCD applications
reception of each byte that has been clocked out of the
slave transmitter. The device that acknowledges must • The use of two types of LCD multiplex on the same
pull-down the SDA line during the acknowledge clock I2C-bus.
pulse, so that the SDA line is stable LOW during the HIGH The I2C-bus protocol is shown in Fig.16. The sequence is
period of the acknowledge related clock pulse (set-up and initiated with a START condition (S) from the I2C-bus
hold times must be taken into consideration). A master master which is followed by one of the two PCF8576 slave
receiver must signal an end of data to the transmitter by addresses available. All PCF8576s with the corresponding
not generating an acknowledge on the last byte that has SA0 level acknowledge in parallel with the slave address
been clocked out of the slave. In this event the transmitter but all PCF8576s with the alternative SA0 level ignore the
must leave the data line HIGH to enable the master to whole I2C-bus transfer.
generate a STOP condition.
2001 Oct 02 19
After acknowledgement, one or more command bytes (m) 7.8 Command decoder
follow which define the status of the addressed PCF8576s.
The command decoder identifies command bytes that
The last command byte is tagged with a cleared most arrive on the I2C-bus. All available commands carry a
significant bit, the continuation bit C. The command bytes continuation bit C in their most significant bit position
are also acknowledged by all addressed PCF8576s on the (Fig.17). When this bit is set, it indicates that the next byte
bus. of the transfer to arrive will also represent a command. If
this bit is reset, it indicates the last command byte of the
After the last command byte, a series of display data bytes
transfer. Further bytes will be regarded as display data.
(n) may follow. These display bytes are stored in the
display RAM at the address specified by the data pointer The five commands available to the PCF8576 are defined
and the subaddress counter. Both data pointer and in Table 4.
subaddress counter are automatically updated and the
data is directed to the intended PCF8576 device. The
acknowledgement after each byte is made only by the (A0,
A1 and A2) addressed PCF8576. After the last display
byte, the I2C-bus master issues a STOP condition (P).
SDA
SCL
data line change

stable; of data
data valid allowed MBA607
Fig.12 Bit transfer.
SDA SDA
SCL SCL
S P
START condition STOP condition

MBC622
Fig.13 Definition of START and STOP conditions.
2001 Oct 02 20
MASTER SLAVE MASTER

SLAVE MASTER
TRANSMITTER/ TRANSMITTER/ TRANSMITTER/
RECEIVER TRANSMITTER
RECEIVER RECEIVER RECEIVER
SDA
SCL
MGA807
Fig.14 System configuration.
DATA OUTPUT
BY TRANSMITTER
not acknowledge
DATA OUTPUT
BY RECEIVER
acknowledge
SCL FROM
MASTER 1 2 8 9
S
clock pulse for
START acknowledgement
condition
MBC602
Fig.15 Acknowledgement on the I2C-bus.
2001 Oct 02 21
acknowledge by acknowledge
all addressed by A0, A1 and A2
PCF8576s selected
R/ W
PCF8576 only
slave address
S
S 0 1 1 1 0 0 A 0 A C COMMAND A DISPLAY DATA A P
0
1 byte n 1 byte(s) n 0 byte(s)

update data pointers
and if necessary,
MBK279 subaddress counter
Fig.16 I2C-bus protocol.
MSB LSB
C REST OF OPCODE
MSA833
C = 0; last command.
C = 1; commands continue.
Fig.17 General format of command byte.
2001 Oct 02 22
Table 4 Definition of PCF8576 commands

COMMAND OPCODE OPTIONS DESCRIPTION
MODE SET C 1 0 LP E B M1 M0 Table 5 Defines LCD drive mode.
Table 6 Defines LCD bias configuration.
Table 7 Defines display status. The possibility to disable the
display allows implementation of blinking under
external control.
Table 8 Defines power dissipation mode.
LOAD DATA C 0 P5 P4 P3 P2 P1 P0 Table 9 Six bits of immediate data, bits P5 to P0, are
POINTER transferred to the data pointer to define one of forty
display RAM addresses.
DEVICE C 1 1 0 0 A2 A1 A0 Table 10 Three bits of immediate data, bits A2 to A0, are
SELECT transferred to the subaddress counter to define one of
eight hardware subaddresses.
BANK C 1 1 1 1 0 I O Table 11 Defines input bank selection (storage of arriving
SELECT display data).
Table 12 Defines output bank selection (retrieval of LCD display
data). The BANK SELECT command has no effect in
1 : 3 and 1 : 4 multiplex drive modes.
BLINK C 1 1 1 0 A BF1 BF0 Table 13 Defines the blinking frequency.
Table 14 Selects the blinking mode; normal operation with
frequency set by BF1, BF0 or blinking by alternation of
display RAM banks. Alternation blinking does not
apply in 1 : 3 and 1 : 4 multiplex drive modes.
Table 5 MODE SET option 1 Table 8 MODE SET option 4

LCD DRIVE MODE BITS MODE BIT LP
DRIVE MODE BACKPLANE M1 M0 Normal mode 0
Static 1 BP 0 1 Power-saving mode 1
1:2 MUX (2 BP) 1 0
Table 9 LOAD DATA POINTER option 1
1:3 MUX (3 BP) 1 1
1:4 MUX (4 BP) 0 0 DESCRIPTION BITS
6-bit binary value of 0 to 39 P5 P4 P3 P2 P1 P0
Table 6 MODE SET option 2
Table 10 DEVICE SELECT option 1
LCD BIAS BIT B
1⁄ DESCRIPTION BITS
3bias 0
1⁄ 3-bit binary value of 0 to 7 A2 A1 A0
2bias 1
Table 7 MODE SET option 3 Table 11 BANK SELECT option 1
DISPLAY STATUS BIT E STATIC 1 : 2 MUX BIT I

Disabled (blank) 0 RAM bit 0 RAM bits 0 and 1 0
Enabled 1 RAM bit 2 RAM bits 2 and 3 1
2001 Oct 02 23
Table 12 BANK SELECT option 2 7.10 Cascaded operation

STATIC 1 : 2 MUX BIT O In large display configurations, up to 16 PCF8576s can be
distinguished on the same I2C-bus by using the 3-bit
RAM bit 0 RAM bits 0 and 1 0
hardware subaddress (A0, A1 and A2) and the
RAM bit 2 RAM bits 2 and 3 1 programmable I2C-bus slave address (SA0). When
cascaded PCF8576s are synchronized so that they can
Table 13 BLINK option 1 share the backplane signals from one of the devices in the
cascade. Such an arrangement is cost-effective in large
BITS
BLINK FREQUENCY LCD applications since the backplane outputs of only one
BF1 BF0 device need to be through-plated to the backplane
Off 0 0 electrodes of the display. The other PCF8576s of the
cascade contribute additional segment outputs but their
2 Hz 0 1
backplane outputs are left open-circuit (see Fig.18).
1 Hz 1 0
The SYNC line is provided to maintain the correct
0.5 Hz 1 1
synchronization between all cascaded PCF8576s. This
synchronization is guaranteed after the Power-on reset.
Table 14 BLINK option 2 The only time that SYNC is likely to be needed is if
BLINK MODE BIT A synchronization is accidentally lost (e.g. by noise in
adverse electrical environments; or by the definition of a
Normal blinking 0 multiplex mode when PCF8576s with differing SA0 levels
Alternation blinking 1 are cascaded). SYNC is organized as an input/output pin;
the output selection being realized as an open-drain driver
7.9 Display controller with an internal pull-up resistor. A PCF8576 asserts the
SYNC line at the onset of its last active backplane signal
The display controller executes the commands identified
and monitors the SYNC line at all other times. Should
by the command decoder. It contains the status registers
synchronization in the cascade be lost, it will be restored
of the PCF8576 and co-ordinates their effects. The
by the first PCF8576 to assert SYNC. The timing
controller is also responsible for loading display data into
relationship between the backplane waveforms and the
the display RAM as required by the filling order.
SYNC signal for the various drive modes of the PCF8576
are shown in Fig.19.
For single plane wiring of packaged PCF8576s and
chip-on-glass cascading, see Chapter 12.
2001 Oct 02 24
VDD VLCD
SDA 1 5 12
SCL 2 17 to 56 40 segment drives
SYNC LCD PANEL

3 PCF8576
CLK (up to 2560
4 13, 15
OSC 6 14, 16 elements)
BP0 to BP3
7 8 9 10 11 (open-circuit)
A0 A1 A2 SA0 VSS
V
LCD
VDD tr
R V V
2CB DD LCD
5 12
HOST SDA
1 17 to 56 40 segment drives
MICRO- SCL
2
PROCESSOR/ PCF8576
SYNC
MICRO- 3
CONTROLLER CLK 13, 15 4 backplanes
4 14, 16
OSC BP0 to BP3
6
MBK280
7 8 9 10 11
VSS A0 A1 A2 SA0 V
SS
Fig.18 Cascaded PCF8576 configuration.
2001 Oct 02 25

1
Tframe = f frame
BP0
SYNC
(a) static drive mode.
BP1
(1/2 bias)
BP1
(1/3 bias)
SYNC
(b) 1 : 2 multiplex drive mode.
BP2
SYNC
(c) 1 : 3 multiplex drive mode.
BP3
SYNC
MBE535
(d) 1 : 4 multiplex drive mode.
Excessive capacitive coupling between SCL or CLK and SYNC may cause erroneous synchronization. If this proves to be a problem, the capacitance
of the SYNC line should be increased (e.g. by an external capacitor between SYNC and VDD). Degradation of the positive edge of the SYNC pulse may
be countered by an external pull-up resistor.
Fig.19 Synchronization of the cascade for the various PCF8576 drive modes.
2001 Oct 02 26
8 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER MIN. MAX. UNIT
VDD supply voltage −0.5 +11.0 V
VLCD LCD supply voltage VDD − 11.0 VDD V
VI input voltage SDA, SCL, CLK, SYNC, SA0, OSC, A0 to A2 VSS − 0.5 VDD + 0.5 V
VO output voltage S0 to S39, BP0 to BP3 VLCD − 0.5 VDD + 0.5 V
II DC input current − 20 mA
IO DC output current − 25 mA
IDD, ISS, ILCD VDD, VSS or VLCD current − 50 mA
Ptot total power dissipation − 400 mW
PO power dissipation per output − 100 mW
Tstg storage temperature −65 +150 °C
9 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices” ).
2001 Oct 02 27
10 DC CHARACTERISTICS
VDD = 2 to 9 V; VSS = 0 V; VLCD = VDD − 2 V to VDD − 9 V; Tamb = −40 to +85 °C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies
VDD supply voltage 2 − 9 V
VLCD LCD supply voltage note 1 VDD − 9 − VDD − 2 V
IDD supply current note 2
normal mode fclk = 200 kHz − − 180 µA
power-saving mode fclk = 35 kHz; VDD = 3.5 V; − − 60 µA
VLCD = 0 V; A0, A1 and A2
connected to VSS
Logic
VIL LOW-level input voltage VSS − 0.3VDD V
VIH HIGH-level input voltage 0.7VDD − VDD V
VOL LOW-level output voltage IOL = 0 mA − − 0.05 V
VOH HIGH-level output voltage IOH = 0 mA VDD − 0.05 − − V
IOL1 LOW-level output current VOL = 1 V; VDD = 5 V 1 − − mA
CLK, SYNC
IOH1 HIGH-level output current CLK VOH = 4 V; VDD = 5 V 1 − − mA
IOL2 LOW-level output current VOL = 0.4 V; VDD = 5 V 3 − − mA
SDA and SCL
IL1 leakage current SA0, A0 to A2, VI = VDD or VSS − − 1 µA
CLK, SDA and SCL
IL2 leakage current OSC VI = VDD − − 1 µA
Ipd A0, A1, A2 and OSC pull-down VI = 1 V; VDD = 5 V 20 50 150 µA
current
RSYNC pull-up resistor (SYNC) 20 50 150 kΩ
VPOR Power-on reset voltage level note 3 − 1.0 1.6 V
CI input capacitance note 4 − − 7 pF
LCD outputs
VBP DC voltage component BP0 to BP3 CBP = 35 nF − 20 − mV
VS DC voltage component S0 to S39 CS = 5 nF − 20 − mV
RBP output resistance BP0 to BP3 note 5; VLCD = VDD − 5 V − − 5 kΩ
RS output resistance S0 to S39 note 5; VLCD = VDD − 5 V − − 7.5 kΩ
Notes
1. VLCD ≤ VDD − 3 V for 1⁄3bias.
2. LCD outputs are open-circuit; inputs at VSS or VDD; external clock with 50% duty factor; I2C-bus inactive.
3. Resets all logic when VDD < VPOR.
4. Periodically sampled, not 100% tested.
5. Outputs measured one at a time.
2001 Oct 02 28
11 AC CHARACTERISTICS
VDD = 2 to 9 V; VSS = 0 V; VLCD = VDD − 2 V to VDD − 9 V; Tamb = −40 to +85 °C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

fclk oscillator frequency on pin CLK
normal mode VDD = 5 V; note 1 125 200 288 kHz
power-saving mode VDD = 3.5 V 21 31 48 kHz
tclkH CLK HIGH time see Fig.21 1 − − µs
tclkL CLK LOW time 1 − − µs
tPSYNC SYNC propagation delay time − − 400 ns
tSYNCL SYNC LOW time 1 − − µs
tPLCD driver delays with test loads VLCD = VDD − 5 V; see Fig.20 − − 30 µs
Timing characteristics: I2C-bus; note 2; see Fig.22
tSW tolerable spike width on bus − − 100 ns
tBUF bus free time 4.7 − − µs
tHD;STA START condition hold time 4.0 − − µs
tSU;STA set-up time for a repeated START condition 4.7 − − µs
tLOW SCL LOW time 4.7 − − µs
tHIGH SCL HIGH time 4.0 − − µs
tr SCL and SDA rise time − − 1 µs
tf SCL and SDA fall time − − 0.3 µs
CB capacitive bus line load − − 400 pF
tSU;DAT data set-up time 250 − − ns
tHD;DAT data hold time 0 − − ns
tSU;STO set-up time for STOP condition 4.0 − − µs
Notes
1. At fclk < 125 kHz, I2C-bus maximum transmission speed is derated.
2. All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to
VIL and VIH with an input voltage swing of VSS to VDD.
6.8 Ω
SYNC V DD
(2%)
3.3 k Ω SDA, 1.5 k Ω

CLK 0.5VDD VDD
SCL
(2%) (2%)
BP0 to BP3, and 1 nF

S0 to S39 VDD
MBE544
Fig.20 Test loads.
2001 Oct 02 29
handbook, full pagewidth 1/ f clk

t clkH t clkL
0.7VDD
CLK
0.3VDD
0.7VDD
SYNC
0.3VDD
t PSYNC t PSYNC
t SYNCL
0.5 V
BP0 to BP3,
and S0 to S39 (VDD = 5 V)
0.5 V
t PLCD MBE545
Fig.21 Driver timing waveforms.
SDA
t BUF t LOW tf
SCL
t tr t HD;DAT t SU;DAT
HD;STA t HIGH
SDA
t SU;STA
MGA728 t SU;STO
Fig.22 I2C-bus timing waveforms.
2001 Oct 02 30
11.1 Typical supply current characteristics
MBE530 MBE529
50 50
I I
SS LCD
(µA) (µA)
normal
40 mode 40
30 30
20 20
power-saving
mode
10 10
0 0
0 100 f frame (Hz) 200 0 100 f frame (Hz) 200
VDD = 5 V; VLCD = 0 V; Tamb = 25 °C. VDD = 5 V; VLCD = 0 V; Tamb = 25 °C.
Fig.23 −ISS as a function of fframe. Fig.24 −ILCD as a function of fframe.
MBE528 - 1 MBE527 - 1
50 50
handbook, halfpage handbook, halfpage
I SS I LCD
(µA) (µA)
40 normal mode 40
f clk = 200 kHz o
85 C
30 30
o
25 C
20 20
o
power-saving mode 40 C
10 f clk = 35 kHz 10
0 0
0 5 V DD (V) 10 0 5 V DD (V) 10
VLCD = 0 V; external clock; Tamb = 25 °C. VLCD = 0 V; external clock; fclk = nominal frequency.
Fig.25 ISS as a function of VDD. Fig.26 ILCD as a function of VDD.
2001 Oct 02 31
11.2 Typical characteristics of LCD outputs
MBE532 - 1 MBE526
10 2.5
handbook, halfpage RS
R
O(max)
R
O(max) (kΩ)
(kΩ) 2.0
RS
1.5
1 R BP R BP
1.0
0.5
-1 0
10
0 3 6 40 0 40 80 o
120
VDD (V)
Tamb( C)
VLCD = 0 V; Tamb = 25 °C. VDD = 5 V; VLCD = 0 V.
Fig.27 RO(max) as a function of VDD. Fig.28 RO(max) as a function of Tamb.
2001 Oct 02 32
andbook, full pagewidth

2001 Oct 02
12 APPLICATION INFORMATION
SDA
SCL
SYNC
CLK
V
DD
VSS
V
LCD
SDA 1 56 S39 1 56 S79
SCL 2 55 S38 2 55 S78
SYNC 3 54 S37 3 54 S77
CLK 4 53 S36 4 53 S76
V 5 52 S35 5 52 S75
DD
OSC 6 51 S34 6 51 S74
A0 7 50 S33 7 50 S73
A1 8 49 S32 8 49 S72
A2 9 48 S31 9 48 S71
SA0 10 47 S30 10 47 S70
V 11 46 S29 11 46 S69
SS
33
V 12 45 S28 12 45 S68
LCD
BP0 13 44 S27 BP0 13 44 S67
BP2 14 43 S26 BP2 14 43 S66

PCF8576T open PCF8576T
BP1 15 42 S25 BP1 15 42 S65
BP3 16 41 S24 BP3 16 41 S64
S0 17 40 S23 S40 17 40 S63
S1 18 39 S22 S41 18 39 S62
S2 19 38 S21 S42 19 38 S61
S3 20 S43 20
34 S17 34 S57
S7 24 33 S16 S47 24 33 S56
S8 25 32 S15 S48 25 32 S55
S9 26 31 S14 S49 26 31 S54
S10 27 30 S13 S50 27 30 S53
PCF8576
S11 28 29 S12 S51 28 29 S52
S0 S10 S11 S12 S13 S39 S40 S50 S51 S52 S53 S79
backplanes segments MBK281
Fig.29 Single plane wiring of packaged PCF8576Ts.

12.1 Chip-on-glass cascadability in single plane and the backplane output pads. The only bus line that does
not require a second opening to lead through to the next
In chip-on-glass technology, where driver devices are
PCF8576 is VLCD, being the cascade centre. The placing
bonded directly onto glass of the LCD, it is important that
of VLCD adjacent to VSS allows the two supplies to be
the devices may be cascaded without the crossing of
connected together.
conductors, but the paths of conductors can be continued
on the glass under the chip. All of this is facilitated by the When an external clocking source is to be used, OSC of all
PCF8576 bonding pad layout (see Fig.30). Pads needing devices should be connected to VDD. The pads OSC,
bus interconnection between all PCF8576s of the cascade A0, A1, A2 and SA0 have been placed between
are VDD, VSS, VLCD, CLK, SCL, SDA and SYNC. These VSS and VDD to facilitate wiring of oscillator, hardware
lines may be led to the corresponding pads of the next subaddress and slave address.
PCF8576 through the wide opening between VLCD pad
13 BONDING PAD INFORMATION

S17
S16
S15
S14
S13
S12
S11
S10
handbook, full pagewidth S9
S8
S7
S6
S5
S4
34 33 32 31 30 29 28 27 26 25 24 23 22 21
S18 35 20 S3
19 S2
S19 36
18 S1
S20 37
17 S0
S21 38
16 BP3
S22 39
15 BP1
S23 40
14 BP2
S24 41
13 BP0
S25 42
4.12 x
mm 0
0
S26 43
S27 44 y
S28 45
PCF8576
S29 46
S30 47 cascade
VLCD
centre 12
S31 48
11 VSS
S32 49
10 SA0
S33 50 9 A2
51 52 53 54 55 56 1 2 3 4 5 6 7 8
S34
S35
S36
S37
S38
S39
SDA
SCL
SYNC
CLK
OSC
A0
A1
VDD
3.07 mm
MBK282
Bonding pad dimensions: 120 × 120 µm.

Gold bump dimensions: 94 × 94 × 25 µm.
Fig.30 Bonding pad locations.
2001 Oct 02 34
Table 15 Bonding pad locations (dimensions in µm)

COORDINATES
All x and y coordinates are referenced to centre of chip SYMBOL PAD
(see Fig.30). x y
COORDINATES S13 30 −555 1900

SYMBOL PAD S14 31 −755 1900
x y
S15 32 −955 1900
SDA 1 −155 −1900
S16 33 −1155 1900
SCL 2 45 −1900
S17 34 −1375 1900
SYNC 3 245 −1900
S18 35 −1375 1660
CLK 4 445 −1900
S19 36 −1375 1420
VDD 5 645 −1900
S20 37 −1375 1200
OSC 6 865 −1900
S21 38 −1375 1000
A0 7 1105 −1900
S22 39 −1375 800
A1 8 1375 −1900
S23 40 −1375 600
A2 9 1375 −1700
S24 41 −1375 400
SA0 10 1375 −1500
S25 42 −1375 200
VSS 11 1375 −1300
S26 43 −1375 −200
VLCD 12 1375 −1100
S27 44 −1375 −400
BP0 13 1375 300
S28 45 −1375 −600
BP2 14 1375 500
S29 46 −1375 −800
BP1 15 1375 700
S30 47 −1375 −1000
BP3 16 1375 900
S31 48 −1375 −1200
S0 17 1375 1100
S32 49 −1375 −1420
S1 18 1375 1300
S33 50 −1375 −1660
S2 19 1375 1500
S34 51 −1375 −1900
S3 20 1375 1700
S35 52 −1155 −1900
S4 21 1375 1900
S36 53 −955 −1900
S5 22 1105 1900
S37 54 −755 −1900
S6 23 865 1900
S38 55 −555 −1900
S7 24 645 1900
S39 56 −355 −900
S8 25 445 1900
S9 26 245 1900 Table 16 Bonding pad dimensions
S10 27 45 1900 Pad pitch 200 µm
S11 28 −155 1900 Pad size, aluminium 120 × 120 µm
S12 29 −355 1900 Gold bump dimensions 94 × 94 × 25 µm
2001 Oct 02 35
14 TRAY INFORMATION: PCF8576U
x
handbook, full pagewidth G A C
y H
1,1 2,1 x,1 D
1,2
1,y x,y
A A
E
M
SECTION A-A MGU431
For dimensions see Table 18.
Fig.31 Tray details.
Table 17 Tray dimensions (see Fig.33)
SYMBOL DESCRIPTION VALUE

handbook, halfpage
A pocket pitch; x direction 6.32 mm
B pocket pitch; y direction 6.32 mm
C pocket width; x direction 4.55 mm
D pocket width; y direction 4.55 mm
E tray width; x direction 50.67 mm
F tray width; y direction 50.67 mm
G cut corner to pocket 1,1 centre 6.32 mm
H cut corner to pocket 1,1 centre 6.32 mm
PC8576U J tray thickness 3.94 mm
M pocket depth 0.61 mm
x number of pockets; x direction 7
MGU432
y number of pockets; y direction 7
The orientation of the IC in a pocket is indicated by the
position of the IC type name on the die surface with respect to
the chamfer on the upper left corner of the tray.
Fig.32 Tray alignment.
2001 Oct 02 36
15 TRAY INFORMATION: PCF8576U/2
handbook, full pagewidth x

G A C
y H
1,1 2,1 x,1 D
1,2
1,y x,y
A E A
K M
L J
SECTION A-A MGW014

For dimensions see Table 17.
Fig.33 Tray details.
Table 18 Tray dimensions (see Fig.31)
SYMBOL DESCRIPTION VALUE

handbook, halfpage
A pocket pitch; x direction 5.33 mm
B pocket pitch; y direction 7.11 mm
C pocket width; x direction 3.43 mm
D pocket width; y direction 4.67 mm
E tray width; x direction 50.67 mm
F tray width; y direction 50.67 mm
G cut corner to pocket 1,1 centre 6.67 mm
H cut corner to pocket 1,1 centre 7.56 mm
J tray thickness 3.94 mm
PCF8576U/2 K tray cross section 1.76 mm
L tray cross section 2.46 mm
MGW015
M pocket depth 0.89 mm
The orientation of the IC in a pocket is indicated by the x number of pockets; x direction 8
position of the IC type name on the die surface with respect to
the chamfer on the upper left corner of the tray.
y number of pockets; y direction 6
Fig.34 Tray alignment.
2001 Oct 02 37
16 PACKAGE OUTLINES
VSO56: plastic very small outline package; 56 leads SOT190-1
D E A
X
y
HE v M A
56 29
Q
A2 A
A1 (A 3)
pin 1 index θ
Lp
L
detail X
1 28
w M
e bp
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ
max.
0.3 3.0 0.42 0.22 21.65 11.1 15.8 1.6 1.45 0.90
mm 3.3 0.25 0.75 2.25 0.2 0.1 0.1 o
0.1 2.8 0.30 0.14 21.35 11.0 15.2 1.4 1.30 0.55 7
0.012 0.12 0.017 0.0087 0.85 0.44 0.62 0.063 0.057 0.035 0o
inches 0.13 0.01 0.0295 0.089 0.008 0.004 0.004
0.004 0.11 0.012 0.0055 0.84 0.43 0.60 0.055 0.051 0.022
Note
1. Plastic or metal protrusions of 0.3 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION
96-04-02
SOT190-1
97-08-11
2001 Oct 02 38
17 SOLDERING If wave soldering is used the following conditions must be

observed for optimal results:
17.1 Introduction to soldering surface mount
packages • Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
This text gives a very brief insight to a complex technology. smooth laminar wave.
A more in-depth account of soldering ICs can be found in
• For packages with leads on two sides and a pitch (e):
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011). – larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
There is no soldering method that is ideal for all surface transport direction of the printed-circuit board;
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch – smaller than 1.27 mm, the footprint longitudinal axis
SMDs. In these situations reflow soldering is must be parallel to the transport direction of the
recommended. printed-circuit board.
The footprint must incorporate solder thieves at the
17.2 Reflow soldering downstream end.
Reflow soldering requires solder paste (a suspension of • For packages with leads on four sides, the footprint must
fine solder particles, flux and binding agent) to be applied be placed at a 45° angle to the transport direction of the
to the printed-circuit board by screen printing, stencilling or printed-circuit board. The footprint must incorporate
pressure-syringe dispensing before package placement. solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example, During placement and before soldering, the package must
convection or convection/infrared heating in a conveyor be fixed with a droplet of adhesive. The adhesive can be
type oven. Throughput times (preheating, soldering and applied by screen printing, pin transfer or syringe
cooling) vary between 100 and 200 seconds depending dispensing. The package can be soldered after the
on heating method. adhesive is cured.
Typical reflow peak temperatures range from Typical dwell time is 4 seconds at 250 °C.
215 to 250 °C. The top-surface temperature of the A mildly-activated flux will eliminate the need for removal
packages should preferable be kept below 220 °C for of corrosive residues in most applications.
thick/large packages, and below 235 °C for small/thin
packages. 17.4 Manual soldering
Fix the component by first soldering two
17.3 Wave soldering diagonally-opposite end leads. Use a low voltage (24 V or
Conventional single wave soldering is not recommended less) soldering iron applied to the flat part of the lead.
for surface mount devices (SMDs) or printed-circuit boards Contact time must be limited to 10 seconds at up to
with a high component density, as solder bridging and 300 °C.
non-wetting can present major problems. When using a dedicated tool, all other leads can be
To overcome these problems the double-wave soldering soldered in one operation within 2 to 5 seconds between
method was specifically developed. 270 and 320 °C.
2001 Oct 02 39
17.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable(2) suitable
PLCC(3), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SSOP, TSSOP, VSO not recommended(5) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Oct 02 40
18 DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS(1) DEFINITIONS
STATUS(2)
Objective specification Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary specification Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product specification Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
19 DEFINITIONS for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any
Short-form specification  The data in a short-form
damages resulting from such application.
specification is extracted from a full data sheet with the
same type number and title. For detailed information see Right to make changes  Philips Semiconductors
the relevant data sheet or data handbook. reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
Limiting values definition  Limiting values given are in
software, described or contained herein in order to
accordance with the Absolute Maximum Rating System
improve design and/or performance. Philips
(IEC 60134). Stress above one or more of the limiting
Semiconductors assumes no responsibility or liability for
values may cause permanent damage to the device.
the use of any of these products, conveys no licence or title
These are stress ratings only and operation of the device
under any patent, copyright, or mask work right to these
at these or at any other conditions above those given in the
products, and makes no representations or warranties that
Characteristics sections of the specification is not implied.
these products are free from patent, copyright, or mask
Exposure to limiting values for extended periods may
work right infringement, unless otherwise specified.
affect device reliability.
Bare die  All die are tested and are guaranteed to
Application information  Applications that are
comply with all data sheet limits up to the point of wafer
described herein for any of these products are for
sawing for a period of ninety (90) days from the date of
illustrative purposes only. Philips Semiconductors make
Philips' delivery. If there are data sheet limits not
no representation or warranty that such applications will be
guaranteed, these will be separately indicated in the data
suitable for the specified use without further testing or
sheet. There are no post packing tests performed on
modification.
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
20 DISCLAIMERS packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
Life support applications  These products are not
functionality or performance of the die or systems after
designed for use in life support appliances, devices, or
third party sawing, handling, packing or assembly of the
systems where malfunction of these products can
die. It is the responsibility of the customer to test and
reasonably be expected to result in personal injury. Philips
qualify their application in which the die is used.
Semiconductors customers using or selling these products
2001 Oct 02 41
21 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2001 Oct 02 42
NOTES
2001 Oct 02 43
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2001 SCA73

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 403512/04/pp44 Date of release: 2001 Oct 02 Document order number: 9397 750 08044

Data Sheet: Universal LCD Driver For Low Multiplex Rates

Uploaded by

Data Sheet: Universal LCD Driver For Low Multiplex Rates

Uploaded by

INTEGRATED CIRCUITS

Universal LCD driver for low multiplex rates PCF8576

CONTENTS 8 LIMITING VALUES

Universal LCD driver for low multiplex rates PCF8576

LCD DISPLAY LATCH

R LCD BIAS SHIFT REGISTER

Fig.1 Block diagram (for VSO56 package; SOT190-1).

Universal LCD driver for low multiplex rates PCF8576

SYMBOL PIN DESCRIPTION

Universal LCD driver for low multiplex rates PCF8576

Fig.2 Pin configuration; SOT190-1.

Universal LCD driver for low multiplex rates PCF8576

6 FUNCTIONAL DESCRIPTION The host microprocessor/microcontroller maintains the

Selection of display configurations

handbook, full pagewidth V

Fig.3 Typical system configuration.

Universal LCD driver for low multiplex rates PCF8576

6.1 Power-on reset 6.3 LCD voltage selector

Vop = (4 × 3) = 2.309 Voff(rms)

These compare with Vop = 3 Voff(rms) when 1⁄3bias is used.

Table 1 Preferred LCD drive modes: summary of characteristics

NUMBER OF LCD BIAS V off(rms) V on(rms) V on(rms)

Universal LCD driver for low multiplex rates PCF8576

V state1(t) = V S (t) – V BP0(t)

V state2(t) = V S (t) – V BP0(t)

Fig.4 Static drive mode waveforms (Vop = VDD − VLCD).

Universal LCD driver for low multiplex rates PCF8576

VDD LCD segments

V state1(t) = V S (t) – V BP0(t)

V state2(t) = V S (t) – V BP1(t)

Universal LCD driver for low multiplex rates PCF8576

V state1(t) = V S (t) – V BP0(t)

V state2(t) = V S (t) – V BP1(t)

Universal LCD driver for low multiplex rates PCF8576

V state1(t) = V S (t) – V BP0(t)

V state2(t) = V S (t) – V BP1(t)

Universal LCD driver for low multiplex rates PCF8576

Universal LCD driver for low multiplex rates PCF8576

6.5 Oscillator 6.6 Timing

Table 2 LCD frame frequencies

6.5.2 EXTERNAL CLOCK 6.7 Display latch

Universal LCD driver for low multiplex rates PCF8576

display RAM addresses (rows) / segment outputs (S)

Universal LCD driver for low multiplex rates PCF8576

6.12 Data pointer 6.14 Output bank selector

Universal LCD driver for low multiplex rates PCF8576

Table 3 Blinking frequencies

Universal LCD driver for low multiplex rates PCF8576

7 CHARACTERISTICS OF THE I2C-BUS 7.5 PCF8576 I2C-bus controller

Universal LCD driver for low multiplex rates PCF8576

data line change

Fig.12 Bit transfer.

handbook, full pagewidth

START condition STOP condition

Fig.13 Definition of START and STOP conditions.

Universal LCD driver for low multiplex rates PCF8576

MASTER SLAVE MASTER

Fig.14 System configuration.

handbook, full pagewidth

Fig.15 Acknowledgement on the I2C-bus.

Universal LCD driver for low multiplex rates PCF8576

1 byte n 1 byte(s) n 0 byte(s)

Fig.16 I2C-bus protocol.

Fig.17 General format of command byte.

Universal LCD driver for low multiplex rates PCF8576

Table 4 Definition of PCF8576 commands

Table 5 MODE SET option 1 Table 8 MODE SET option 4

Table 7 MODE SET option 3 Table 11 BANK SELECT option 1

DISPLAY STATUS BIT E STATIC 1 : 2 MUX BIT I

Universal LCD driver for low multiplex rates PCF8576

Table 12 BANK SELECT option 2 7.10 Cascaded operation

Universal LCD driver for low multiplex rates PCF8576

handbook, full pagewidth

SYNC LCD PANEL

Fig.18 Cascaded PCF8576 configuration.

Universal LCD driver for low multiplex rates PCF8576