CH22 Lect

ME-4429
Thermofluid applications and design

Prof. Ryszard J. Pryputniewicz
NEST - NanoEngineering, Science, and Technology
CHSLT - Center for Holographic Studies and Laser micro-mechaTronics
Mechanical Engineering Department
School of Engineering
Worcester Polytechnic Institute
Worcester, MA 01609
C2014
M, 3 March 2014
Lecture 23
Heat exchangers (HEXs).
The overall heat transfer coefficient.
Analysis of HEXs. The LMTD method.
The effectiveness-NTU method. Microchannel heat sinks.
Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology
1 1
Interim discussion of
Topical Projects
The D-Day is on
Thursday, March 6
3 days from today
ANY QUESTIONS, CHALLENGES, etc.???
2 2
Consultations this week and

Consultation hours will be as scheduled
Should you have any questions relating either to Exam II
scheduled for Friday, March 7, or anything else relating to
the course, please see me ASAP
There will be QAR addressing Exam III tomorrow,
Tuesday, March 5, therefore prepare questions
Wednesday is Conference No. 5
Plan your week taking the above items into consideration

3 3
Last Wednesday of C-term

Conference C07, no new material covered
Prepare questions, good time to start review
for Exam III, which will be on Friday, March 7

4 4
Fundamentals of Thermal-Fluid Sciences

4th Edition
Yunus A. Cengel, John M. Cimbala, Robert H. Turner
McGraw-Hill, 2012
Chapter 22
HEAT EXCHANGES

Objectives
Recognize numerous types of heat exchangers, and classify

them
Develop an awareness of fouling on surfaces, and determine the

overall heat transfer coefficient for a heat exchanger
Perform a general energy analysis on heat exchangers
Obtain a relation for the logarithmic mean temperature difference

for use in the LMTD method, and modify it for different types of
heat exchangers using the correction factor
Develop relations for effectiveness, and analyze heat

exchangers when outlet temperatures are not known using the
effectiveness-NTU method
Know the primary considerations in the selection of heat

exchangers.
Introduce the state-of-the-art (SOTA) microchannel HEXs

6 6
22-1. TYPES OF HEAT EXCHANGERS
T-x diagrams
x, or A
Different flow regimes

and associated
temperature profiles in
a double-pipe heat
exchanger.
7 7
Shell-and-tube heat exchanger: The most common type of heat

exchanger in industrial applications.
They contain a large number of tubes (sometimes several hundred)
packed in a shell with their axes parallel to that of the shell. Heat
transfer takes place as one fluid flows inside the tubes while the other
fluid flows outside the tubes through the shell.
Shell-and-tube heat exchangers are further classified according to the
number of shell and tube passes involved.

8 8
Regenerative heat exchanger:

Involves the alternate passage of the
hot and cold fluid streams through the
same flow area.
Dynamic-type regenerator: Involves a
rotating drum and continuous flow of
the hot and cold fluid through different
portions of the drum so that any
portion of the drum passes periodically
through the hot stream, storing heat,
and then through the cold stream,
rejecting this stored heat.
Condenser: One of the fluids is cooled
and condenses as it flows through the
heat exchanger.
Boiler: One of the fluids absorbs heat
and vaporizes.
9 9
22-2. THE OVERALL HEAT TRANSFER COEFFICIENT
A heat exchanger typically involves two

flowing fluids separated by a solid wall.
Heat is first transferred from the hot fluid to

the wall by convection, through the wall by
conduction, and from the wall to the cold
fluid again by convection.
Any radiation effects are usually included in

the convection heat transfer coefficients.
Thermal resistance network

associated with heat transfer in a
double-pipe heat exchanger.
10 10
U the overall heat transfer

coefficient, W/m2C
When
The overall heat transfer coefficient U is dominated by the smaller convection

coefficient. When one of the convection coefficients is much smaller than the other
(say, hi << ho), we have 1/hi >> 1/ho, and thus U hi. This situation arises frequently
when one of the fluids is a gas and the other is a liquid. In such cases, fins are
commonly used on the gas side to enhance the product UA and thus the heat
transfer on that side.
11 11
The overall heat transfer coefficient

ranges from about 10 W/m2C for
gas-to-gas heat exchangers to about
10,000 W/m2C for heat exchangers
that involve phase changes.
When the tube is finned on one

side to enhance heat transfer, the
total heat transfer surface area on
the finned side is
For short fins of high

thermal conductivity, we
can use this total area in
the convection
resistance relation Rconv
= 1/hAs
To account for fin efficiency

12 12
Fouling Factor
The performance of heat exchangers usually deteriorates with time as a result of
accumulation of deposits on heat transfer surfaces. The layer of deposits represents
additional resistance to heat transfer. This is represented by a fouling factor Rf.
The fouling factor increases with the operating temperature and the length of
service and decreases with the velocity of the fluids.

13 13
22-3. ANALYSIS OF HEAT EXCHANGERS

An engineer often finds himself or herself in a position
1. To select a heat exchanger that will achieve a specified temperature
change in a fluid stream of known mass flow rate - the log mean
temperature difference (or LMTD) method.
2. To predict the outlet temperatures of the hot and cold fluid streams in
a specified heat exchanger - the effectivenessNTU method.
The rate of heat transfer in heat
exchanger (HE is insulated):
Two fluid
streams that
have the same
capacity rates
experience the
same
temperature
change in a wellinsulated heat
exchanger.
heat capacity rate

14 14
is the rate of evaporation or condensation of the fluid

hfg is the enthalpy of vaporization of the fluid at the specified temperature or pressure.
The heat capacity rate of a fluid during a phase-change process must approach
infinity since the temperature change is practically zero.
Variation of
fluid
temperatures
in a heat
exchanger
when one of
the fluids
condenses or
boils.
Tm an appropriate mean (average)
temperature difference between the two fluids
15 15
22-4. THE LOG MEAN TEMPERATURE

DIFFERENCE METHOD
log mean
temperature
difference
Variation of the fluid

temperatures in a
parallel-flow doublepipe
heat exchanger.
Mechanical Engineering Department/NEST - NanoEngineering, Science,
and Technology
16 16
The arithmetic mean temperature difference

The logarithmic mean temperature
difference Tlm is an exact representation
of the average temperature difference
between the hot and cold fluids.
Note that Tlm is always less than Tam.
Therefore, using Tam in calculations
instead of Tlm will overestimate the rate of
heat transfer in a heat exchanger between
the two fluids.
When T1 differs from T2 by no more than
40 percent, the error in using the arithmetic
mean temperature difference is less than 1
percent. But the error increases to
undesirable levels when T1 differs from
T2 by greater amounts.

17 17
Counter-Flow Heat Exchangers

In the limiting case, the cold fluid will be
heated to the inlet temperature of the hot
fluid.
However, the outlet temperature of the cold
fluid can never exceed the inlet
temperature of the hot fluid.
For specified inlet and outlet temperatures,
Tlm a counter-flow heat exchanger is
always greater than that for a parallel-flow
heat exchanger.
That is, Tlm, CF > Tlm, PF, and thus a
smaller surface area (and thus a smaller
heat exchanger) is needed to achieve a
specified heat transfer rate in a counterflow heat exchanger.
When the heat capacity rates
of the two fluids are equal
18 18
Multipass and Cross-Flow Heat Exchangers: Use of a

Correction Factor
F correction factor depends on the

geometry of the heat exchanger and the
inlet and outlet temperatures of the hot
and cold fluid streams.
F for common cross-flow and shell-andtube heat exchanger configurations is
given in the figure versus two
temperature ratios P and R defined as
1 and 2 inlet and outlet

T and t shell- and tube-side temperatures
F = 1 for a condenser or boiler
19 19
Correction factor
F charts for
common shelland-tube heat
exchangers.

20 20
The LMTD method is very suitable for determining the size of a heat
exchanger to realize prescribed outlet temperatures when the
mass flow rates and the inlet and outlet temperatures of the hot
and cold fluids are specified.
With the LMTD method, the task is to select a heat exchanger that
will meet the prescribed heat transfer requirements. The
procedure to be followed by the selection process is:
1. Select the type of heat exchanger suitable for the application.
2. Determine any unknown inlet or outlet temperature and the heat
transfer rate using an energy balance.
3. Calculate the log mean temperature difference Tlm and the
correction factor F, if necessary.
4. Obtain (select or calculate) the value of the overall heat transfer
coefficient U.
5. Calculate the heat transfer surface area As .
The task is completed by selecting a heat exchanger that has a heat
transfer surface area equal to or larger than As.
21 21
22-5. THE EFFECTIVENESSNTU METHOD

A second kind of problem encountered in heat exchanger analysis is the
determination of the heat transfer rate and the outlet temperatures of the hot and
cold fluids for prescribed fluid mass flow rates and inlet temperatures when the type
and size of the heat exchanger are specified.
Heat transfer effectiveness
the maximum possible heat transfer rate

Cmin is the smaller of Ch and Cc
22 22
Effectiveness relations of the heat exchangers typically involve the

dimensionless group UAs /Cmin.
This quantity is called the number of transfer units NTU.
capacity
ratio
For specified values of U and Cmin, the value

of NTU is a measure of the surface area As.
Thus, the larger the NTU, the larger the heat
exchanger.
The effectiveness of a heat exchanger is a function of the

number of transfer units NTU and the capacity ratio c.

23 23

24 24
Microchannels
Used to accommodate fluid flow for cooling in the IC substrate
Characteristic dimensions of microchannels
(cross-section) is on the order of 200 m

25
Schematic view of a microchannel heat sink

26
Fabrication of Si microchannels
Photolithography: overview
The process used in this illustration is known as Sacrificial
Surface Micromachining (SSM)
Deposition of thin layer to be patterned
Thin layer to be patterned
Si Substrate

27
Deposition of photoresist
Un-patterned photoresist
UV-Sensitive layer
Photoresist Layer
Si Substrate

28
UV radiation
Mask
Photoresist Layer
Si Substrate

29
Removal of exposed photoresist
Lithographically patterned
photoresist
Si Substrate

30
Deposition of thin layer to be patterned
Patterning of thin layer
Si Substrate

31
Removal of remaining photoresist
Patterned thin layer
Si Substrate

32

33
Fabricated triangular channel

80 m deep channel

34

35

36
Fundamental relationships

37
Fundamental relationships, contd

38
Temperature control concept on a chip

(Top)
(Bottom)
SOA
Hoya substrate
Si Interposer
Temperature Sensor
Heater

39
Temperature control on a silicon chip

40
Characteristics of a temperature controller on

a chip
y = 4.1542x + 1523.7
R2 = 0.9999
Resistance vs. Temperature

(Heating of d16ae06)
RESISTANCE, Ohm
1850
1800
1750
1700
1650
1600
0
10
20
30
40
50
60
70
80
TEMPERATURE, C

41
Thermosyphon
Relies on gravitational force
Heat
removal
Condenser
Vapor
Liquid
condensate
Heat
addition
liquid
Evaporator

42
Heat pipe
Basic heat pipe configuration
4. Return of condensed liquid through
the wick by capillarity action
1. Heat addition in the evaporator

causes vapor release
3. Heat removal in the condenser

causes condensation of vapor
2. Vapor travels to the condenser

43
A heat pipe systems for electronic

applications
Heat-pipes
Heat-pipes to move
heat from electronic
components to a cooling
area where fins are
used to increase the
cooling rate
Fins

44
Heat pipe performance wrt Cu rod

Both configurations of the same dimensions
End to end T, C
30
30
25
0.95 cm diameter solid Cu rod

0.95 cm diameter heat pipe
20
Cu( x)
HP ( x)
15
10
5
0
0
0
10
20
30
40
50
60
x W
Power,

70
70
45
Heat pipe
Operating characteristics

46
Thermal management

47
The heat pipe: thermal management

Loop of thermosyphons connecting enclosure to HVAC duct

48
Thermal management of PCs

49
Heat pipe based HEX for PCs

50
The heat pipe: thermal management

Modern PC (Dell OptiPlex GX270) using tubular heat pipes
and a conventional air-cooled heat sink

51
Fuel cells for every day use

52
Futuristic power source:

small, unattended, multi-year operation

53
Nanotechnology:
Quantum-dot-based power cell

54
Future-power will come in small

yet very capable packages

55
Hybridization of a solution
Advantage
Study of actual
configurations
Disadvantage
Impractical to perform
parametric investigations
Experimental
Effective study and

optimization
Hybridization
Computational
and
Analytical
Advantage
Parametric investigations
Disadvantage
Assumed mechanical
characteristics and
boundary conditions

56
Solution methodology
Analyticalexact, closed form

approximate, FEM, BEM, FDM
Computational
SOTA fiber laser based OE
Experimental
ACES
methodology
C
S
A

57
Summary
Types of Heat Exchangers
The Overall Heat Transfer Coefficient
Fouling factor
Analysis of Heat Exchangers

The Log Mean Temperature Difference Method
Counter-Flow Heat Exchangers
Multipass and Cross-Flow Heat Exchangers: Use of a
Correction Factor
The EffectivenessNTU Method

Introduced SOTA microchannel HEXs

58 58
Example: H23 Problem 22-112/970

In a chemical plant, a certain chemical is heated by
hot water supplied by a natural gas furnace. The
hot water (cp = 4180 J/kg.K) is then discharged at a
rate of 8 kg/min. The plant operates 8 h a day, 5
days per week, 52 weeks a year. The furnace has
an efficiency of 78 percent, and the cost of the
natural gas is $1.00 per therm (1 therm = 105,500
kJ). The average temperature of the cold water
entering the furnace throughout the year is 14C.
In order to save energy, it is proposed to install a
water-to-water heat exchanger to preheat the
incoming cold water by the drained hot water, Fig.
P22-112. Assuming that the heat exchanger will
recover 72 percent of the available heat in the hot
water, determine the heat transfer rating of the heat
exchanger that needs to be purchased and suggest
a suitable type. Also, determine the amount of
money this heat axchanger will save the company
per year from natural gas savings.
Fig. P22-112.
59 59
16. PROBLEM-SOLVING TECHNIQUE

Step 1: Problem Statement
Step 2: Schematic
Step 3: Assumptions and Approximations
Step 4: Physical Laws
Step 5: Properties
Step 6: Calculations, SIGNIFICANT DIGITS
Step 7: Reasoning, Verification, and DISCUSSION

60 60

CH22 Lect

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CH22 Lect

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ME-4429

Thermofluid applications and design

Consultations this week and

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Last Wednesday of C-term

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Fundamentals of Thermal-Fluid Sciences

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Recognize numerous types of heat exchangers, and classify

Develop an awareness of fouling on surfaces, and determine the

Perform a general energy analysis on heat exchangers

Obtain a relation for the logarithmic mean temperature difference

Develop relations for effectiveness, and analyze heat

Know the primary considerations in the selection of heat

Introduce the state-of-the-art (SOTA) microchannel HEXs

22-1. TYPES OF HEAT EXCHANGERS

Different flow regimes

Shell-and-tube heat exchanger: The most common type of heat

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Regenerative heat exchanger:

22-2. THE OVERALL HEAT TRANSFER COEFFICIENT

A heat exchanger typically involves two

Heat is first transferred from the hot fluid to

Any radiation effects are usually included in

Thermal resistance network

U the overall heat transfer

The overall heat transfer coefficient U is dominated by the smaller convection

The overall heat transfer coefficient

When the tube is finned on one

For short fins of high

To account for fin efficiency

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

22-3. ANALYSIS OF HEAT EXCHANGERS

heat capacity rate

is the rate of evaporation or condensation of the fluid

22-4. THE LOG MEAN TEMPERATURE

Variation of the fluid

The arithmetic mean temperature difference

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Counter-Flow Heat Exchangers

Multipass and Cross-Flow Heat Exchangers: Use of a

F correction factor depends on the

1 and 2 inlet and outlet

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

22-5. THE EFFECTIVENESSNTU METHOD

the maximum possible heat transfer rate

Effectiveness relations of the heat exchangers typically involve the

For specified values of U and Cmin, the value

The effectiveness of a heat exchanger is a function of the

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Schematic view of a microchannel heat sink

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Thin layer to be patterned

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Patterning of thin layer

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Patterned thin layer

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Fabricated triangular channel

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Fundamental relationships, contd

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Temperature control concept on a chip

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology

Temperature control on a silicon chip

Mechanical Engineering Department/NEST - NanoEngineering, Science, and Technology