XMC (company)
XMC | |
Native name | 武汉新芯集成电路股份有限公司 |
Company type | Subsidiary |
Industry | Semiconductors |
Founded | April 21, 2006 |
Headquarters | Wuhan, Hubei, China |
Key people | Sun Peng (CEO) |
Revenue | CN¥3.82 billion (2023) |
CN¥393.76 million (2023) | |
Total assets | CN¥15.03 billion (2023) |
Total equity | CN¥7.19 billion (2023) |
Parent | Yangtze Memory Technologies |
Website | www |
Footnotes / references [1] |
Wuhan Xinxin Semiconductor Manufacturing (XMC; Chinese: 新芯股份; pinyin: Xīnxīn Gǔfèn) is a Chinese semiconductor integrated device manufacturer. It produces logic chips, contact image sensors and NOR flash memory.
It is a subsidiary of Yangtze Memory Technologies (YTMC) and plays an integral part in its 3D NAND memory production.
Background
[edit]Wuhan Xinxin was originally founded by the Wuhan Government in 2006 as one of the first semiconductor foundries in Wuhan.[2][3]
In October 2010, the Donghu New Technology Development Zone Administrative Committee and Semiconductor Manufacturing International Corporation (SMIC) jointly invested in Wuhan Xinxin. SMIC also struck a deal with the Wuhan Government to manage Wuhan Xinxin for a management. Industry critics sated SMIC managed it "half-heartedly".[3]
In March 2013, Wuhan Xinxin acquired SMIC's shares to become an independent company and rebranded itself as XMC shifting focus from foundry services for mainstream products to producing flash memory via an expanded partnership deal with Spansion.[3]
In July 2016, Tsinghua Unigroup acquired a majority stake in XMC with the deal being brokered by the China Integrated Circuit Industry Investment Fund.Tsinghua Unigroup would merge XMC with its memory chip-making operations to form YTMC with XMC being a subsidiary under it.[3][4][5]
In April 2018, Chinese leader Xi Jinping visited the facilities of XMC as part of an inspection tour.[6]
On 3 December 2018, XMC announced the successful development of its three-dimensional wafer stacking technology based on its three-dimensional integration technology platform.[7]
In March 2024, it was reported that XMC initiated a project focused on developing and manufacturing High Bandwidth Memory (HBM).[8]
In May 2024, XMC filed for an initial public offering (IPO) on the Shanghai Stock Exchange STAR Market.[7] On 30 September, the China Securities Regulatory Commission approved XMC's IPO application.[2]
In December 2024, XMC was targeted in a new round of US export controls and added to the United States Department of Commerce's Entity List. [9]
See also
[edit]References
[edit]- ^ "IPO Prospectus" (PDF). Shanghai Stock Exchange. Archived (PDF) from the original on 1 October 2024. Retrieved 27 November 2024.
- ^ a b "XMC, Sister Company of YMTC, Has STAR Market IPO Application Accepted". TrendForce News. 2 October 2024. Archived from the original on 2 October 2024. Retrieved 27 November 2024.
- ^ a b c d Leopard, George (2 June 2020). "Wuhan Profile: Besieged City Fights its Next Battle". EE Times. Archived from the original on 28 November 2020. Retrieved 27 November 2024.
- ^ Dou, Eva (26 July 2016). "Tsinghua Unigroup Acquires Control of XMC in Chinese-Chip Deal". The Wall Street Journal. Archived from the original on 25 March 2023. Retrieved 27 November 2024.
- ^ "Tsinghua Leads Creation of $2.8 Billion Chinese Chip Giant". Bloomberg News. 26 July 2016. Archived from the original on 17 April 2024. Retrieved 27 November 2024.
- ^ Pan, Che (25 September 2022). "China's top memory chip maker in the crosshairs of US sanctions". South China Morning Post. Archived from the original on 11 November 2024. Retrieved 27 November 2024.
- ^ a b "XMC Initiates IPO Plan, Potentially Becoming China's First HBM Foundry". TrendForce News. 15 May 2024. Archived from the original on 10 August 2024. Retrieved 27 November 2024.
- ^ Shilov, Anton (16 March 2024). "Chinese foundry XMC aims to produce HBM memory". Tom's Hardware. Archived from the original on 22 May 2024. Retrieved 27 November 2024.
- ^ Chen, Charlene (3 December 2024). "New US ban imposes 'large yard, high fence' on Chinese equipment, materials, EDA". DIGITIMES. Retrieved 4 December 2024.